INTEGRATED CIRCUITS. 74LVT00 3.3V Quad 2-input NAND gate. Product specification 1996 Aug 15 IC24 Data Handbook

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Transcription:

INTEGRATED CIRCUITS 1996 Aug 15 IC24 Data Handbook

QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS T amb = 25 C; GND = 0V TYPICAL UNIT t PLH t PHL Propagation delay An or Bn to Yn C L = 50pF; V CC = 3.3V 2.7 2.7 ns C IN Input capacitance V I = 0V or 3.0V 3 pf I CCL Total supply current Outputs Low; V CC = 3.6V 1 ma ORDERING INFORMATION PACKAGES TEMPERATURE RANGE OUTSIDE NORTH AMERICA NORTH AMERICA DWG NUMBER 14-Pin Plastic SO 40 C to +85 C D D SOT108-1 14-Pin Plastic SSOP 40 C to +85 C DB DB SOT337-1 14-Pin Plastic TSSOP 40 C to +85 C PW PW DH SOT402-1 LOGIC SYMBOL PIN CONFIGURATION 1 2 4 5 9 10 12 13 A0 1 14 V CC B0 2 13 B3 A0 B0 A1 B1 A2 B2 A3 B3 Y0 A1 3 4 12 11 A3 Y3 Y0 Y1 Y2 Y3 B1 Y1 5 6 10 9 B2 A2 GND 7 8 Y2 V CC = Pin 14 GND = Pin 7 3 6 8 11 SA00333 LOGIC SYMBOL (IEEE/IEC) 1 2 & SA00334 3 PIN DESCRIPTION PIN SYMBOL NUMBER 1, 2, 4, 5, 9, 10, 12, 13 An-Bn NAME AND FUNCTION Data inputs 4 5 9 10 6 8 3, 6, 8, 11 Yn Data outputs 7 GND Ground (0V) 14 V CC Positive supply voltage 12 13 11 SF00004 1996 Aug 15 2 853-1858 17183

LOGIC DIAGRAM FUNCTION TABLE V CC = Pin 14 GND = Pin 7 A0 B0 A1 B1 A2 B2 A3 B3 1 2 4 5 9 10 12 13 3 Y0 6 Y1 8 Y2 11 Y3 SA00360 INPUTS OUTPUT Dna Dnb Qn L L H L H H H L H H H L NOTES: H = High voltage level L = Low voltage level ABSOLUTE MAXIMUM RATINGS 1, 2 SYMBOL PARAMETER CONDITIONS RATING UNIT V CC DC supply voltage 0.5 to +4.6 V I IK DC input diode current V I < 0 50 ma V I DC input voltage 3 0.5 to +7.0 V I OK DC output diode current V O < 0 50 ma V OUT DC output voltage 3 Output in Off or High state 0.5 to +7.0 V Output in High state 32 I OUT DC output current Output in Low state 64 ma T stg Storage temperature range 65 to 150 C NOTES: 1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 C. 3. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER LIMITS V CC DC supply voltage 2.7 3.6 V V I Input voltage 0 5.5 V V IH High-level input voltage 2.0 V V IL Low-level Input voltage 0.8 V I OH High-level output current 20 ma I OL Low-level output current 32 ma t/ v Input transition rise or fall rate; Outputs enabled 10 ns/v T amb Operating free-air temperature range 40 +85 C MIN MAX UNIT 1996 Aug 15 3

DC ELECTRICAL CHARACTERISTICS Over recommended operating conditions Voltages are referenced to GND (ground = 0V) LIMITS SYMBOL PARAMETER TEST CONDITIONS Temp = -40 C to +85 C UNIT MIN TYP 1 MAX V IK Input clamp voltage V CC = 2.7V; I IK = 18mA 1.2 V V CC = 2.7 to 3.6V; I OH = 100µA V CC 0.2 V OH High-level output voltage V CC = 2.7V; I OH = 6mA 2.4 V V CC = 3.0V; I OH = 20mA 2.0 V CC = 2.7V; I OL = 100µA 0.2 V OL Low-level output voltage V CC = 2.7V; I OL = 24mA 0.5 V V CC = 3.0V; I OL = 32mA 0.5 I I Input leakage current V CC = 0 or 3.6V; V I = 5.5V 10 V CC = 3.6V; V I = V CC or GND ±1 µaa I OFF Output off current V CC = 0V; V I or V O = 0 to 4.5V ±100 µa I CCH I CCL Quiescent supply current V CC = 3.6V; Outputs High, V I = GND or V CC, I O = 0 V CC = 3.6V; Outputs Low, V I = GND or V CC, I O = 0 0.02 1 2 ma I CC Additional supply current per input pin 2 V CC = 3V to 3.6V; One input at V CC 0.6V, Other inputs at V CC or GND 0.2 µa C I Input capacitance V I = 3V or 0 3 pf NOTES: 1. All typical values are at V CC = 3.3V and T amb = 25 C. 2. This is the increase in supply current for each input at the specificed voltage level other than V CC or GND. AC CHARACTERISTICS GND = 0V; t R = t F = 2.5ns; C L = 50pF, R L = 500Ω; T amb = 40 C to +85 C. LIMITS SYMBOL PARAMETER WAVEFORM V CC = 3.3V ± 0.3V V CC = 2.7V UNIT MIN TYP 1 MAX MAX t PLH t PHL Propagation delay An or Bn to Yn 1 1.0 1.0 2.7 2.7 4.1 3.9 5.0 3.8 ns NOTE: 1. All typical values are at V CC = 3.3V and T amb = 25 C. AC WAVEFORMS = 1.5V, V IN = GND to 2.7V A n, B n t PHL t PLH Yn Waveform 1. SF01395 Propagation delay for inverting outputs 1996 Aug 15 4

TEST CIRCUIT AND WAVEFORMS V CC t W 90% 90% AMP (V) PULSE GENERATOR V IN D.U.T. V OUT NEGATIVE PULSE 10% 10% t THL (t F ) 0V t TLH (t R ) R T Test Circuit for Outputs C L R L POSITIVE PULSE 90% 90% t TLH (t R ) t THL (t F ) 10% t 10% W AMP (V) 0V = 1.5V Input Pulse Definition DEFINITIONS R L = Load resistor; see AC CHARACTERISTICS for value. C L = Load capacitance includes jig and probe capacitance; see AC CHARACTERISTICS for value. R T = Termination resistance should be equal to Z OUT of pulse generators. INPUT PULSE REQUIREMENTS FAMILY Amplitude Rep. Rate t W t R t F 74LVT 2.7V 10MHz 500ns 2.5ns 2.5ns SV00022 1996 Aug 15 5

SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 1996 Aug 15 6

SSOP14: plastic shrink small outline package; 14 leads; body width 5.3 mm SOT337-1 1996 Aug 15 7

TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 1996 Aug 15 8

NOTES 1996 Aug 15 9

DEFINITIONS Data Sheet Identification Product Status Definition Objective Specification Preliminary Specification Product Specification Formative or in Design Preproduction Product Full Production This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product. Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088 3409 Telephone 800-234-7381 Philips Semiconductors and Philips Electronics North America Corporation register eligible circuits under the Semiconductor Chip Protection Act. Copyright Philips Electronics North America Corporation 1996 All rights reserved. Printed in U.S.A. (print code) Date of release: July 1994 Document order number: 9397-750-04847