Different Types of Laser in Packaging User Report L. Engisch R. Zähringer
The Future is Laser
Leading Network in Europe with Production Sites in sia (Malaysia, Vietnam) and South merica (rgentina) Page 3
Janoschka Network Figures in Mio 130 120 110 100 90 80 70 60 50 40 30 20 10 Turnover evolution 2009 Turnover in Mio 115 Employees > 1 000 Cylinders produced 190 000 Steel bases produced 31 000 Engraving Machines 90 Direct Laser Systems 5 Digilas Laser 4 Milling Machines 4 0 1975 1978 1981 1984 1987 1990 1993 1996 1999 2002 2005 2008 Page 4
Fields of pplication Line Work rands Halftone rand Protection Embossing Direct Laser Engraving Security Printing Finishing Printed electronics luminium Different Types of Laser in Packaging User Report 03. November 2010 Page 5
Markets Packaging Tobacco Illustration Direct Laser Engraving Decorative Markets Pharmacy Special pplication Page 6
Demands rands and Flexible Packaging / Fine Line Work and Halftone Perfect for product families (rand Consistency) Smooth ink layer Direct Laser Engraving Perfect to reproduce Fine details without compromising on ink layer Page 7
Demands Printers No ink drying during the print process Improved ink release from the cell Taylor made cell geometries very interesting for inhomogeneous substrates Direct Laser Engraving Fine details without compromising on ink volume Reduced substrate waste during the printing process Page 8
Demands Tobacco Smooth ink layer Printing on cardboard UV and water based lacquer Direct Laser Engraving Different cell variations for the different substrates High resolution for fine test elements Page 9
Demands Security Printing Different inks and chemicals High resolution Direct Laser Engraving Fine line work Different cell geometry and gravure parameters on one cylinder Page 10
Demands Printed Functionalities / Printed Electronics Resolution << 30µm Register <5µm Printed areas < 50µm Non printed areas <30µm Ink layer thickness 30-300nm Homogenous ink layer Special ink formulation Page 11
Demands Decor No missing dots Perfect to reproduce Direct Laser Engraving Perfect half tone Printing with water based inks Page 12
Demands Embossing High resolution Gravure depth Direct Laser Engraving Gravure speed Different materials Page 13
Laser Technologies at Janoschka Page 14
Direct Laser Engraving Datwyler DLS Hell Cellaxy Page 15
Datwyler DLS Hell Cellaxy Page 16
Cell geometries vs. Engraving Technology Etching Stylus Direct Laser Engraving Variable area Variable area and variable depth ut strongly connected Variable area and variable depth Independent Page 17
Laser Material Interaction Laser eam Plasma Melted Particle Waste Vapour Material Melt Fritz Klocke, Wilfried König: Fertigungsverfahren 3 btragen, Generieren, Lasermaterialbearbeitung, 2007,achen, Springer Verlag erlin Page 18
Laser Direct Engraving Workflow Page 19
Laser Related Material Properties Page 20
Laser System Daetwyler DLS Page 21
DLS Development at Janoschka Kippenheim The Year 2000: beginning of the DLS development The Year 2005: DLS in high quality on the market The Year 2010: 5 DLS systems in our global network Installation of the 6 th DLS system in rgentina Page 22
Performance Gravure Speed: 35,000 or 70,000 cells/s Effective Range of Screen: 30-160L/cm (Single Shot and Master Screen) Effective Resolution used: 100-400L/cm 03. November 2010 Different Types of Laser in Packaging User Report Page 23 Single Shot Master Screen
Cell Geometry Single Shot vs Master Screen Single Shot Screen equals resolution Very fast engraving Only round cells possible Variation in cell types conventional, halfautotypical and superhalfautotypical Cell depth up to 35µm ( in one pass ) ( Multi pass possible ) Page 24
Cell Geometry Single Shot vs Master Screen Master Screen Resolution higher than screen ( similar to image setter ) Hexagonal cell Variation in cell types conventional, halfautotypical Outline possible Cell depth up to 35µm ( in one pass ) ( Multi pass possible ) Page 25
Cell Geometry Page 26
Laser System Hell Cellaxy Page 27
Cellaxy Development at SWG Frankenberg eta-test since 2008 Since early 2009 engraving in copper developed Development in SWG: Enhanced Laser Control Improved Laser Finishing Today: Production ready New 70L/cm Cell Geometry Page 28
Enhanced Laser Control Conventional Laser Control Enhanced Laser Control Page 29
dvantages Cellaxy High Resolution Laser System (Spot Size: <10µm) Free Cell Geometry Similar to Image Setter Principle Engraving in Copper, Zinc and Chromium Hexagonal, Conventional and Free Cell Forms Usable Combination of Fine Line and Half Tone Elements on the same Cylinder First Test for Laser Engraved Embossing Cylinders Page 30
Newly Developed Raster for Packaging Sample 80L/cm Page 31
Fine Line Work Enhanced Edge Optimization Image Data Pattern Data order Cell Outline Page 32
Cellaxy for Packaging High Resolution daption of cell geometry to substrates djustable ink transfer amount for different substrates (cell depth) Reducing of Saw Tooth Effect by using of enhanced edge detection algorithm Half tone and Line Work Elements on the same cylinder 100µm Page 33
dvanced Line Work Page 34
Embossing 2mm In Copper and Zinc High resolution (up to 1000L/cm) Up to 900µm deep Page 35
Direct Laser Engraving enefits High Quality / High Resolution Flexible in Cell Geometry and Cell Depth daptable in Ink Transfer Volume and Ink Layer Deposition Tailor made gravure structures for different applications New and Innovative applications Page 36
The Future is Laser Ralf Zähringer Janoschka GmbH Mattweg 1 77971Kippenheim ralf.zaehringer@janoschka.com Dr. Lutz Engisch SWG Frankenberg adstraße 9 09669 Frankenberg lutz.engisch@swg-online.de