FEAURES SYMBOL QUICK REFERENCE DAA Low forward volt drop DAMPER MODULAOR Fast switching damper modulator Soft recovery characteristic V R =5 V V R =8 V High thermal cycling performance 3 V F.3 V V F.45 V Isolated mounting tab I F(RMS) =5.7 A I F(RMS) = A 2 I FSM 6 A I FSM 6 A t rr 3 ns t rr 45 ns GENERAL DESCRIPION PINNING SO86A Combined damper and modulator PIN DESCRIPION diodes in an isolated plastic envelope for horizontal deflection in damper cathode colour V and PC monitors. he BYM359X contains diodes with performance characteristics 2 common anode/cathode designed specifically for 3 modulator anode. applications from 6kHz to 56kHz case he BYM359X series is supplied in the conventional leaded SO86A package. 2 3 LIMIING VALUES j = 25 C unless otherwise stated DAMPER MODULAOR SYMBOL PARAMEER CONDIIONS MIN MAX MIN MAX UNI V RSM Peak non-repetitive reverse - 5-8 V voltage. V RRM Peak repetitive reverse voltage - 5-6 V V RWM Crest working reverse voltage - 3-6 V I F(AV) Average forward current sinusoidal;a=.57 - - 8 A I F(RMS) RMS forward current - 5.7 -. A I FRM Peak repetitive forward current t=25 µs δ=.5-2 - 6. A hs 83 C I FSM Peak non-repetitive forward t = ms - 6-6 A current t = 8.3 ms sinusoidal; - 66-66 A with reapplied V RWM(MAX) stg Storage temperature -4 5-4 5 C J Operating junction temperature - 5-5 C December 999 Rev.2
ISOLAION LIMIING VALUE & CHARACERISIC hs = 25 C unless otherwise specified SYMBOL PARAMEER CONDIIONS MIN. YP. MAX. UNI V isol R.M.S. isolation voltage from all three terminals to external f = 5-6 Hz; sinusoidal waveform; - - 25 V heatsink R.H. 65% ; clean and dustfree C isol Capacitance from 2 to external heatsink f = MHz - - pf HERMAL RESISANCES DAMPER MODULAOR SYMBOL PARAMEER CONDIIONS YP. MAX. YP. MAX. UNI R th j-hs hermal resistance junction to with heatsink - 4.8-4.8 K/W heatsink compound R th j-a hermal resistance junction to in free air. 55 - - 55 K/W ambient SAIC CHARACERISICS j = 25 C unless otherwise stated DAMPER MODULAOR SYMBOL PARAMEER CONDIIONS YP. MAX. YP. MAX. UNI V F Forward voltage I F = 6.5 A..45.5.55 V I R Reverse current I F = 6.5 A; j = 25 C.5.3..45 V V R = V RWM 25 µa V R = V RWM 5 5 6 µa j = C DYNAMIC CHARACERISICS j = 25 C unless otherwise stated DAMPER MODULAOR SYMBOL PARAMEER CONDIIONS YP. MAX. YP. MAX. UNI t rr Reverse recovery time I F = A; V R 3 V; 2 3 25 45 ns -di F /dt = 5 A/µs Q s Reverse recovery charge 2 A,3 V,2 A/µs.2 2..5.7 µc V fr Peak forward recovery voltage I F = 6.5 A; 27-8. - V di F /dt = 5 A/µs December 999 2 Rev.2
I F di F dt trr time 5 PF / W Vo =.25 V Rs =.3 Ohms 4 2.8 2.2 hs() / C 78 a =.57.9 2 Qs 25% % 5 26 I R I rrm Fig.. Definition of t rr, Q s and I rrm 5 2 4 6 8 IF(AV) / A Fig.4. Modulator imum forward dissipation, P F = f(i F(AV) ); sinusoidal current waveform; parameter a = form factor = I F(RMS) /I F(AV). I F 8 IFS(RMS) / A BY229 7 6 IFSM time 5 4 V F 3 V fr 2 Fig.2. Definition of V fr V F time ms ms.s s s / s Fig.5. Modulator imum non-repetitive rms forward current. I F = f(t p ); sinusoidal current waveform; j = 5 C prior to surge with reapplied V RWM. 2 5 PF / W Vo =.25 V Rs =.3 Ohms.5 hs() / C 54 D =. 78 3 2 IF / A j = 5 C j = 25 C BY229F..2 2 5 I D = 26 typ t 5 2 4 6 8 2 IF(AV) / A Fig.3. Modulator imum forward dissipation, P F = f(i F(AV) ); square wave current waveform; parameter D = duty cycle = t p /..5.5 VF / V Fig.6. Modulator typical and imum forward characteristic; I F = f(v F ); parameter j 2 December 999 3 Rev.2
Qs / uc j = 5 C j = 25 C IF = A Cd / pf 2 A A A 2 A A. -dif/dt (A/us) Fig.7. Modulator imum Q s at j = 25 C and 5 C VR / V Fig.9. Modulator typical junction capacitance C d at f = MHz ; j = 25 C trr / ns ransient thermal impedance, Zth j-hs (K/W) IF = A A A A.. P D D = j = 5 C j = 25 C -dif/dt (A/us) Fig.8. Modulator imum t rr measured to 25% of I rrm ; j = 25 C and 5 C t. us us us ms ms ms s s pulse width, (s) BY229F Fig.. Modulator transient thermal impedance Z th = f(t p ) December 999 4 Rev.2
8 7 6 5 IFS(RMS) / A IFSM BY359 3 2 IF / A j=5c j=25c BY359 4 3 2 typ ms ms.s s s / s Fig.. Damper imum non-repetitive rms forward current. I F = f(t p ); sinusoidal current waveform; j = 5 C prior to surge with reapplied V RWM.. 2. VF / V Fig.3. Damper forward characteristic I F = f(v F ); parameter j ransient thermal impedance, Zth j-hs (K/W).. P D D = t. us us us ms ms ms s s pulse width, (s) BY359F Fig.2. Damper transient thermal impedance Z th = f(t p ) December 999 5 Rev.2
MECHANICAL DAA Dimensions in mm Net Mass: 2 g.3 3.2 3. 4.6 2.9 Recesses (2x) 2.5.8. depth 3. not tinned 2.8 5.8. 9. seating plane 6.4 5.8 3 2.5 3.5 min. 2 3.4 M 5.8 2.54.5.6 2.5.3. (2x).9.7 Notes. Refer to mounting instructions for F-pack envelopes. 2. Epoxy meets UL94 V at /8". Fig.4. SO86A; he seating plane is electrically isolated from all terminals. December 999 6 Rev.2
DEFINIIONS Data sheet status Objective specification his data sheet contains target or goal specifications for product development. Preliminary specification his data sheet contains preliminary data; supplementary data may be published later. his data sheet contains final product specifications. Limiting values Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 34). Stress above one or more of the limiting values may cause permanent damage to the device. hese are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. Philips Electronics N.V. 999 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. he information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. LIFE SUPPOR APPLICAIONS hese products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. December 999 7 Rev.2