Microchip Proprietary Information

2.4 GHz High-Power, High-Gain Power Amplifier The is a versatile power amplifier based on the highly-reliable InGaP/GaAs HBT technology. Easily configured for high-power applications with excellent power-added efficiency while operating over the 2.4-2.5 GHz frequency band, it typically provides 32 db gain with 34% power-added efficiency. The has excellent linearity while meeting 82.11g spectrum mask at 24 dbm. This power amplifier also features easy board-level usage along with highspeed power-up/down control through the reference voltage pins. The is offered in both a 3mm x 3mm, 16-contact VQFN package and a 2mm x 2mm, 12-contact XQFN package. Features High Gain: More than 32 db gain across 2.4 2.5 GHz over temperature -4 C to +85 C High linear output power: >29 dbm P1dB Meets 82.11g OFDM ACPR requirement up to 26 dbm ~3% added EVM up to 23 dbm for 54 Mbps 82.11g signal Meets 82.11b ACPR requirement up to 25.5 dbm High power-added efficiency/low operating current for 82.11b/g/n applications Single-pin low I REF power-up/down control I REF <2 ma Low idle current High-speed power-up/down Turn on/off time (1%- 9%) <1 ns Typical power-up/down delay with driver delay included <2 ns Low Shut-down Current (~2µA) High temperature stability ~1 db gain/power variation between C to +85 C Excellent On-chip power detection More than 2 db dynamic range on-chip power detection Simple input/output matching Packages available 16-contact VQFN 3mm x 3mm 12-contact XQFN 2mm x 2mm All non-pb (lead-free) devices are RoHS compliant Applications WLAN (IEEE 82.11b/g/n) Home RF Cordless phones 2.4 GHz ISM wireless equipment Microchip Proprietary Information 212 Silicon Storage Technology, Inc. www.microchip.com DS7529A 1/12

Microchip Proprietary Information 2 2.4 GHz High-Power, High-Gain Power Amplifier Product Description is a versatile power amplifier based on the highly-reliable InGaP/GaAs HBT technology. This power amplifier can be easily configured for high-power applications with very low EVM for improved power-added efficiency (PAE) while operating over the 2.4-2.5 GHz frequency band. There are two application circuits provided to show this versatility. provides more than 32 db gain. The device has excellent linearity typically it meets 3% added EVM up to 23 dbm output power for 54 Mbps 82.11g operation. This power amplifier also meets spectral mask compliance output power up to 26 dbm for 82.11g and up to 25.5 dbm for 82.11b operation. This device also features easy board-level usage along with high-speed power-up/down control through the reference voltage pins. Ultra-low reference current (total I REF ~2 ma) makes the controllable by an on/off switching signal directly from the baseband chip. These features coupled with low operating current make ideal for the final stage power amplification in battery-powered 82.11b/g/n WLAN transmitter applications. The power amplifier has an excellent, wide dynamic range (>2 db), db-wise linear on-chip power detector. The excellent on-chip power detector provides a reliable solution to board-level power control. The is offered in both 16-contact VQFN (3mm x 3mm) and 12-contact XQFN (2mm x 2mm) packages. See Figures 3 and 4 for pin assignments and Tables 1 and 2 for pin descriptions.

Microchip Proprietary Information 3 2.4 GHz High-Power, High-Gain Power Amplifier Functional Blocks VCC1 VCC2 16 15 14 13 1 12 VCC3 RFIN 2 11 RFOUT RFIN 3 1 Bias Circuit 4 9 5 6 7 8 RFOUT Det VCCb VREF1 VREF2 DNU 1424 B2. Figure 1: Functional Block Diagram for 3mm x 3mm, 16-contact VQFN (QVC)

Microchip Proprietary Information 4 2.4 GHz High-Power, High-Gain Power Amplifier VCC1 VCC2 12 11 1 1 9 VCC3 RFIN 2 8 RFOUT/VCC2 VCCb 3 Bias Circuit 7 4 5 6 VREF1 VREF2 DET 7529 B1.1 Figure 2: Functional Block Diagram for 2mm x 2mm, 12-contact XQFN (QXB)

2.4 GHz High-Power, High-Gain Power Amplifier Pin Assignments and Pin Descriptions VCC1 VCC2 16 15 14 13 RFIN 1 2 Top View (contacts facing down) 12 11 VCC3 RFOUT RFIN 3 4 RF and DC GND 1 9 RFOUT Det 5 6 7 8 Figure 3: Pin Assignments for 3mm x 3mm, 16-contact VQFN (QVC) Table 1: Pin Description for 3mm x 3mm,16-contact VQFN Symbol Pin No. Pin Name Type 1 Function GND Ground The center pad should be connected to RF ground with several low inductance, low resistance vias. 1 No Connection Unconnected pins. RFIN 2 I RF input, DC decoupled RFIN 3 I RF input, DC decoupled 4 No Connection Unconnected pins. VCCb 5 Power Supply PWR Supply voltage for bias circuit VREF1 6 PWR 1st and 2nd stage idle current control VREF2 7 PWR 3rd stage idle current control DNU 8 Do Not Use Do not use or connect Det 9 O On-chip power detector RFOUT 1 O RF output RFOUT 11 O RF output VCC3 12 Power Supply PWR Power supply, 3rd stage 13 No Connection Unconnected pins. VCC2 14 Power Supply PWR Power supply, 2nd stage 15 No Connection Unconnected pins. VCC1 16 Power Supply PWR Power supply, 1st stage 1. I=Input, O=Output VCCb VREF1 VREF2 DNU 1424 16-vqfn P1. T1. 7529 Microchip Proprietary Information 5

2.4 GHz High-Power, High-Gain Power Amplifier VCC1 VCC2 12 11 1 1 Top View 9 VCC3 RFIN VCCb 2 3 (Contacts facing down) 8 7 RFOUT 4 5 6 DET VREF2 VREF1 Figure 4: Pin Assignments for 2mm x 2mm, 12-contact XQFN (QXB) 1424 P.1 Table 2: Pin Description for 2mm x 2mm,12-contact XQFN Symbol Pin No. Pin Name Type 1 Function GND Ground Low-inductance ground pad 1 No Connection Unconnected pin RFIN 2 I RF input, DC decoupled VCCb 3 Power Supply PWR Supply voltage for bias circuit VREF1 4 PWR 1 st and 2 nd stage idle current control VREF2 5 PWR 3 rd stage idle current control DET 6 O On-chip power detector 7 No Connection Unconnected pin RFOUT 8 O RF output, DC decoupled VCC3 9 Power Supply PWR Power supply, 3 rd stage VCC2 1 Power Supply PWR Power supply, 2 nd stage 11 No Connection Unconnected pin VCC1 12 Power Supply PWR Power supply, 1 st stage 1. I=Input, O=Output T2. 7529 Microchip Proprietary Information 6

Microchip Proprietary Information 7 2.4 GHz High-Power, High-Gain Power Amplifier Electrical Specifications The DC and RF specifications for the power amplifier are specified below. Absolute Maximum Stress Ratings (Applied conditions greater than those listed under Absolute Maximum Stress Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these conditions or conditions greater than those defined in the operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating conditions may affect device reliability.) Average Input power (P IN ) 1... +5dBm Average output power (P OUT ) 1... +28dBm Supply Voltage at pins 5, 12, 14, and 16 (V CC ) for 16-contact VQFN...-.3V to +5.V 2 Reference voltage to pin 6 and 7(V REF ) for 16-contact VQFN....-.3V to +3.3V DC supply current (I CC ) 3... 5mA Operating Temperature (T A )... -4ºC to +85ºC Storage Temperature (T STG )... -4ºC to +12ºC Maximum Junction Temperature (T J )... +15ºC Surface Mount Solder Reflow Temperature...26 C for 1 seconds 1. Never measure with CW source. Pulsed single-tone source with <5% duty cycle is recommended. Exceeding the maximum rating of average output power could cause permanent damage to the device. 2. Output power must be limited to 2 dbm at 5V V CC. 3. Measured with 1% duty cycle 54 Mbps 82.11g OFDM Signal Table 6 shows the DC and RF characteristics for the configuration that achieves high linear power, with good Table 3: Operating Range Range Ambient Temp V CC Industrial -4 C to +85 C 3.3V T3.1 7529 PAE. The associated schematic is shown in Figure 22, at 25 C for 16-contact VQFN package. The RF performance is shown in figures 17 through 21. Table 4 shows the DC and RF characteristics for the configuration that achieves high spectrum mask compliant output power. The associated schematic is shown in Figure 16, at 25 C for 16-contact VQFN package. The RF performance is shown in figures 11 through 15.

2.4 GHz High-Power, High-Gain Power Amplifier 3mm x 3mm, 16-contact VQFN High-Linearity Configuration Typical Performance Characteristics for High Spectrum Mask Compliant Output Power Configuration for 16-contact VQFN package (Schematic in Figure 16) Table 4: DC and RF Characteristics for High-Spectrum Mask Compliant Output Power Performance at 25 C, for 16-contact VQFN (Schematic in Figure 16) Symbol Parameter Min. Typ Max. Unit V CC Supply Voltage at pins 5, 12, 14, and 16 3. 3.3 4.2 V Idle current to meet EVM ~3.5% @ 23 dbm Output Power with 82.11g 175 ma I CQ OFDM 54 Mbps signal V REG1 Reference Voltage for pin 6, with 51 resistor 2.75 2.85 2.95 V V REG2 Reference Voltage for pin 7, with 91 resistor 2.75 2.85 2.95 V Current Consumption to meet 82.11g OFDM 6 Mbps Spectrum mask 37 ma I CC @ 25.5 dbm Output Power Current Consumption to meet 82.11b DSSS 1 Mbps Spectrum mask 37 ma @ 25.5 dbm Output Power F L-U Frequency range 2412 2484 MHz G Small signal gain 32 33 db G VAR1 Gain variation over band (2412 2484 MHz) ±.5 db G VAR2 Gain ripple over channel (2 MHz).2 db 2f Harmonics at 25 dbm, without external filters -43 dbm/ 3f -25 MHz 4f -3 5f -3 EVM Added EVM @ 22 dbm Output Power with 82.11g OFDM 54 Mbps signal 3 % Output Power to meet 82.11g OFDM 6 Mbps spectrum mask 24.5 25.5 dbm P OUT Output Power to meet 82.11b DSSS 1 Mbps spectrum mask 24.5 25.5 dbm T4.1 7529 Microchip Proprietary Information 8

Microchip Proprietary Information 9 2.4 GHz High-Power, High-Gain Power Amplifier 3mm x 3mm, 16-contact VQFN High-Linearity Configuration (continued) Test Conditions: V CC = 3.3V, T A = 25 C, unless otherwise specified S11 versus Frequency S12 versus Frequency S11 (db) -5-1 -15-2 -25 S12 (db) -1-2 -3-4 -5-6 -7-3. 1. 2. 3. 4. 5. 6. 7. Frequency (GHz) -8 8.. 1. 2. 3. 4. 5. 6. 7. 8. Frequency (GHz) 4 S21 versus Frequency S22 versus Frequency S21 (db) 3 2 1-1 -2-3 S22 (db) -5-1 -15-2 -25-4. 1. 2. 3. 4. 5. 6. 7. 8. Frequency (GHz) -3. 1. 2. 3. 4. 5. 6. 7. 8. Frequency (GHz) 1424 S-Parms. 3. Figure 5: S-Parameters

Microchip Proprietary Information 1 2.4 GHz High-Power, High-Gain Power Amplifier 3mm x 3mm, 16-contact VQFN High-Linearity Configuration (continued) Test Conditions: V CC = 3.3V, T A = 25 C, 54 Mbps 82.11g OFDM Signal 1 EVM versus Output Power 9 8 7 Freq=2.412 GHz Freq=2.442 GHz Freq=2.472 GHz EVM (%) 6 5 4 3 2 1 1 2 3 4 5 6 7 8 9 1 11 12 13 14 15 16 17 18 19 2 21 22 23 24 25 26 27 28 Output Power (dbm) 1424 F11. Figure 6: EVM versus Output Power measured with equalizer training set to sequence only Gain versus Output Power 4 38 36 34 Gain (db) 32 3 28 26 24 22 Freq=2.412 GHz Freq=2.442 GHz Freq=2.472 GHz 2 1 2 3 4 5 6 7 8 9 1 11 12 13 14 15 16 17 18 19 2 21 22 23 24 25 26 27 28 Output Power (dbm) 1424 F12. Figure 7: Gain versus Output Power

2.4 GHz High-Power, High-Gain Power Amplifier 3mm x 3mm, 16-contact VQFN High-Linearity Configuration (continued) Supply Current versus Output Power Supply Current (ma) 5 48 46 44 42 4 38 36 34 32 3 28 26 24 22 2 18 16 14 Freq=2.412 GHz Freq=2.442 GHz Freq=2.472 GHz 1 2 3 4 5 6 7 8 9 111121314151617181922122232425262728 Output Power (dbm) 1424 F13. Figure 8: Total Current Consumption for 82.11g operation versus Output Power 1.3 Detector Voltage versus Output Power Detector Voltage (V) 1.2 1.1 1..9.8.7.6.5.4 Freq=2.412 GHz Freq=2.442 GHz Freq=2.472 GHz.3 1 2 3 4 5 6 7 8 9 1 11 12 13 14 15 16 17 18 19 2 21 22 23 24 25 26 27 28 Output Power (dbm) Figure 9: Detector Characteristics versus Output Power 1424 F15. Microchip Proprietary Information 11

Microchip Proprietary Information 12 2.4 GHz High-Power, High-Gain Power Amplifier 3mm x 3mm, 16-contact VQFN High-Linearity Configuration (continued).1 μf.1 μf.1 μf 4.7 μf Vcc Length = 22 mil, Width = 1 mil trace 16 15 14 13 1 12 5Ω RFin 5Ω /2mil R5=68Ω* 2 3 3x3 16L VQFN Top View 11 1 5Ω/125 mil 2.7pF 5Ω RFout 4 5 6 7 8 9 R4=7.5KΩ Suggested operation conditions: 1V CC = 3.3V 2. VREG1=VREG2=2.85V.1 μf R3=1 Ω 1pF R1=51Ω 1pF R2=91Ω *Could be removed if -7 db return loss is acceptable VREG 1 VREG 2 Det 1424 Schematic.4. Figure 1: Typical Schematic for High Spectrum Mask Compliant Output Power 82.11b/g/n Applications for 16-contact VQFN

Microchip Proprietary Information 13 2.4 GHz High-Power, High-Gain Power Amplifier 2mm x 2mm, 12-contact XQFN High-Linearity Configuration Typical Performance Characteristics for High Spectrum Mask Compliant Output Power Configuration for 12-contact XQFN package (Schematic in Figure 16) Table 5: DC and RF Characteristics for High Linear Power, with Good PAE Performance at 25 C, for 12-contact XQFN (Schematic in Figure 16) Symbol Parameter Min. Typ Max. Unit V CC Supply Voltage at pins 3, 9, 1, and 12 3. 3.3 4.2 V Idle current to meet EVM ~3.5% @ 23 dbm Output Power with 82.11g 19 ma I CQ OFDM 54 Mbps signal V REG1 Reference Voltage for pin 4, with 562 resistor 2.75 2.85 2.95 V V REG2 Reference Voltage for pin 5, with 294 resistor 2.75 2.85 2.95 V Current Consumption to meet 82.11g OFDM 6 Mbps Spectrum mask 395 ma I CC @ 26 dbm Output Power Current Consumption to meet 82.11b DSSS 1 Mbps Spectrum mask 325 ma @ 24 dbm Output Power Frequency range 2412 248 MHz F L-U 4 G Small signal gain 31 32 db G VAR1 Gain variation over band (2412 2484 MHz) ±.5 db G VAR2 Gain ripple over channel (2 MHz).2 db 2f Harmonics at 25 dbm, without external filters -43 dbm 3f -25 / MHz 4f -3 5f -3 EVM Added EVM @ 23 dbm Output Power with 82.11g OFDM 54 Mbps 3. % signal Output Power to meet 82.11g OFDM 6 Mbps spectrum mask 24.5 25.5 dbm P OUT Output Power to meet 82.11b DSSS 1 Mbps spectrum mask 24.5 25.5 dbm T5.1 7529

Microchip Proprietary Information 14 2.4 GHz High-Power, High-Gain Power Amplifier 2mm x 2mm, 12-contact XQFN High-Linearity Configuration (continued) Test Conditions: V CC = 3.3V, T A = 25 C, unless otherwise specified S11 versus Frequency S12 versus Frequency S11 (db) -5-1 -15-2 -25 S12 (db) -1-2 -3-4 -5-6 -7-3. 1. 2. 3. 4. 5. 6. 7. 8. -8. 1. 2. 3. 4. 5. 6. 7. 8. Frequency (GHz) Frequency (GHz) 4 S21 versus Frequency S22 versus Frequency S21 (db) 3 2 1-1 -2-3 S22 (db) -5-1 -15-2 -25-4. 1. 2. 3. 4. 5. 6. 7. 8. Frequency (GHz) -3. 1. 2. 3. 4. 5. 6. 7. 8. Frequency (GHz) 1424 S-Parms. 4.2 Figure 11:S-Parameters

2.4 GHz High-Power, High-Gain Power Amplifier 2mm x 2mm, 12-contact XQFN High-Linearity Configuration (continued) Test Conditions: V CC = 3.3V, T A = 25 C, 54 Mbps 82.11g OFDM Signal 1 EVM versus Output Power 9 8 7 Freq=2.412 GHz Freq=2.442 GHz Freq=2.472 GHz EVM (%) 6 5 4 3 2 1 1 2 3 4 5 6 7 8 9 1 11 12 13 14 15 16 17 18 19 2 21 22 23 24 25 26 27 28 Output Power (dbm) 1424 F18. Figure 12: EVM versus Output Power measured with equalizer training set to sequence only Microchip Proprietary Information 15

2.4 GHz High-Power, High-Gain Power Amplifier 2mm x 2mm, 12-contact XQFN High-Linearity Configuration (continued) 4 38 36 Power Gain versus Output Power Power Gain (db) 34 32 3 28 26 24 22 2 Freq=2.412 GHz Freq=2.442 GHz Freq=2.472 GHz 1 2 3 4 5 6 7 8 9 1 11121314151617181922122232425262728 Output Power (dbm) 1424 F16.1 Figure 13:Gain versus Output Power Supply Current versus Output Power Supply Current (ma) 48 46 44 42 4 38 36 34 32 3 28 26 24 22 2 18 16 14 12 1 8 6 4 Freq=2.412 GHz Freq=2.442 GHz Freq=2.472 GHz 1 2 3 4 5 6 7 8 9 1 11 12 13 14 15 16 17 18 19 2 21 22 23 24 25 26 27 28 Output Power (dbm) 1424 F19.1 Figure 14:Total Current Consumption for 82.11g operation versus Output Power Microchip Proprietary Information 16

2.4 GHz High-Power, High-Gain Power Amplifier 2mm x 2mm, 12-contact XQFN High-Linearity Configuration (continued) 1.3 Detector Voltage versus Output Power Detector Voltage (V) 1.2 1.1 1..9.8.7.6.5.4 Freq=2.412 GHz Freq=2.442 GHz Freq=2.472 GHz.3 1 2 3 4 5 6 7 8 9 1 11 12 13 14 15 16 17 18 19 2 21 22 23 24 25 26 27 28 Output Power (dbm) 1424 F2.1 Figure 15:Detector Characteristics versus Output Power.1 µf.1 µf.1 µf 1 µf Vcc 5mm 12 11 1 RFin 1 2 2x2 12L XQFN Top View 9 8 5Ω/ 2.7 mm 3.pF RFout 68Ω 3 7 1Ω.1 µf 4 5 6 1pF 1pF 51Ω 91Ω Suggested operation conditions: 1 V CC = 3.3V 2. VREG1=VREG2=2.85V VREG1 VREG2 VDet 1424 Schematic.5.1 Figure 16: Typical Schematic for 82.11b/g/n Applications for 12-contact XQFN Microchip Proprietary Information 17

2.4 GHz High-Power, High-Gain Power Amplifier 3mm x 3mm, 16-contact VQFN High-Efficiency Configuration Typical Performance Characteristics for High Linear Power, with Good PAE Configuration, for 16-contact VQFN package (Schematic in Figure 22) Table 6: DC and RF Characteristics for High Linear Power, with Good PAE Performance at 25 C, for 16-contact VQFN (Schematic in Figure 22) Symbol Parameter Min. Typ Max. Unit V CC Supply Voltage at pins 5, 12, 14, and 16 3. 3.3 4.2 V Idle current to meet EVM ~3.5% @ 23 dbm Output Power with 82.11g 8 ma I CQ OFDM 54 Mbps signal V REG1 Reference Voltage for pin 6, with 86 resistor 2.75 2.85 2.95 V V REG2 Reference Voltage for pin 7, with 86 resistor 2.75 2.85 2.95 V Current Consumption to meet 82.11g OFDM 6 Mbps Spectrum mask 33 ma I CC @ 25 dbm Output Power Current Consumption to meet 82.11b DSSS 1 Mbps Spectrum mask 31 ma @ 24 dbm Output Power F L-U Frequency range 2412 2484 MHz G Small signal gain 35 36 db G VAR1 Gain variation over band (2412 2484 MHz) ±.5 db G VAR2 Gain ripple over channel (2 MHz).2 db 2f Harmonics at 25 dbm, without external filters -43 dbm/ 3f -25 MHz 4f -3 5f -3 EVM Added EVM @ 23 dbm Output Power with 82.11g OFDM 54 Mbps signal 3.5 % Output Power to meet 82.11g OFDM 6 Mbps spectrum mask 24 25 dbm P OUT Output Power to meet 82.11b DSSS 1 Mbps spectrum mask 23 24 dbm T6.1 7529 Microchip Proprietary Information 18

Microchip Proprietary Information 19 2.4 GHz High-Power, High-Gain Power Amplifier 3mm x 3mm, 16-contact VQFN High-Efficiency Configuration (continued) Test Conditions: V CC = 3.3V, T A = 25 C, unless otherwise specified S11 versus Frequency S12 versus Frequency S11 (db) -5-1 -15-2 -25 S12 (db) -1-2 -3-4 -5-6 -7-3. 1. 2. 3. 4. 5. 6. 7. Frequency (GHz) -8 8.. 1. 2. 3. 4. 5. 6. 7. 8. Frequency (GHz) 4 S21 versus Frequency S22 versus Frequency S21 (db) 3 2 1-1 -2-3 S22 (db) -5-1 -15-2 -25-4. 1. 2. 3. 4. 5. 6. 7. 8. Frequency (GHz) -3. 1. 2. 3. 4. 5. 6. 7. 8. Frequency (GHz) 1424 S-Parms. 2. Figure 17:S-Parameters

2.4 GHz High-Power, High-Gain Power Amplifier 3mm x 3mm, 16-contact VQFN High-Efficiency Configuration (continued) Test Conditions: V CC = 3.3V, T A = 25 C, 54 Mbps 82.11g OFDM Signal 1 EVM versus Output Power 9 8 7 Freq=2.412 GHz Freq=2.442 GHz Freq=2.472 GHz EVM (%) 6 5 4 3 2 1 1 2 3 4 5 6 7 8 9 1 11 12 13 14 15 16 17 18 19 2 21 22 23 24 25 26 27 28 Output Power (dbm) 1424 F6. Figure 18:EVM versus Output Power measured with equalizer training set to sequence only Gain versus Output Power 4 38 36 34 32 Gain (db) 3 28 26 24 22 Freq=2.412 GHz Freq=2.442 GHz Freq=2.472 GHz 2 1 2 3 4 5 6 7 8 9 1 11 12 13 14 15 16 17 18 19 2 21 22 23 24 25 26 27 28 Output Power (dbm) Figure 19:Gain versus Output Power 1424 F7. Microchip Proprietary Information 2

2.4 GHz High-Power, High-Gain Power Amplifier 3mm x 3mm, 16-contact VQFN High-Efficiency Configuration (continued) Supply Current versus Output Power Supply Current (ma) 48 46 44 42 4 38 36 34 32 3 28 26 24 22 2 18 16 14 12 1 8 6 4 Freq=2.412 GHz Freq=2.442 GHz Freq=2.472 GHz 1 2 3 4 5 6 7 8 9 1 11 12 13 14 15 16 17 18 19 2 21 22 23 24 25 26 27 28 Output Power (dbm) 1424 F8. Figure 2:Total Current Consumption for 82.11g operation versus Output Power 1.3 Detector Voltage versus Output Power Detector Voltage (V) 1.2 1.1 1..9.8.7.6.5.4 Freq=2.412 GHz Freq=2.442 GHz Freq=2.472 GHz.3 1 2 3 4 5 6 7 8 9 1 11 12 13 14 15 16 17 18 19 2 21 22 23 24 25 26 27 28 Output Power (dbm) Figure 21:Detector Characteristics versus Output Power 1424 F1. Microchip Proprietary Information 21

Microchip Proprietary Information 22 2.4 GHz High-Power, High-Gain Power Amplifier 3mm x 3mm, 16-contact VQFN High-Efficiency Configuration (continued).1 μf.1 μf.1 μf 4.7 μf Vcc Length = 22 mil, Width = 1 mil trace 16 15 14 13 1 12 5Ω RFin 5Ω /2mil 3.3nH* 2 3 3x3 16L VQFN Top View 11 1 5Ω/125 mil 2.7pF 5Ω RFout 4 5 6 7 8 9 R4=7.5KΩ Suggested operation conditions: 1V CC = 3.3V 2. VREG1=VREG2=2.85V.1 μf R3=1 Ω 1pF R1=86Ω 1pF R2=86Ω *Could be removed if -7 db return loss is acceptable VREG 1 VREG 2 Det 1424 Schematic.3.1 Figure 22:Typical Schematic for High-Linearity 82.11b/g/n Applications for 16-contact VQFN

2.4 GHz High-Power, High-Gain Power Amplifier Product Ordering Information SST 12 LP 15B - QVCE XX XX XXX - XXXX Environmental Attribute E 1 = non-pb contact (lead) finish Package Modifier C = 16 contact B = 12 contact Package Type QV = VQFN (3mm x 3mm) QX = XQFN (2mm x 2mm) Product Family Identifier Product Type P = Power Amplifier Voltage L = 3.-3.6V Frequency of Operation 2 = 2.4 GHz Product Line 1 = RF Products 1. Environmental suffix E denotes non-pb solder. SST non-pb solder devices are RoHS Compliant. Valid combinations for -QVCE -QXBE Evaluation Kits -QVCE-K -QXBE-K Note:Valid combinations are those products in mass production or will be in mass production. Consult your SST sales representative to confirm availability of valid combinations and to determine availability of new combinations. Microchip Proprietary Information 23

Microchip Proprietary Information 24 2.4 GHz High-Power, High-Gain Power Amplifier Packaging Diagrams TOP VIEW SIDE VIEW BOTTOM VIEW.2 See notes 2 and 3 Pin 1 3. ±.75.75 1.7 1.7 Pin 1.5 BSC 3. ±.75 1..8.5 Max.3.18.45.35 1mm 16-vqfn-3x3-QVC-2. Note: 1. Complies with JEDEC JEP95 MO-22J, variant VEED-4 except external paddle nominal dimensions. 2. From the bottom view, the pin 1 indicator ma y be either a 45-degree chamfer or a half-circle notch. 3. The external paddle is electrically connected to the die back-side and possibly to certain V SS leads. This paddle can be soldered to the PC board; it is suggested to connect this paddle to the V SS of the unit. Connection of this paddle to any other voltage potential can result in shorts and/or electrical malfunction of the device. 4. Untoleranced dimensions are nominal target dimensions. 5. All linear dimensions are in millimeters (max/min). Figure 23:16-contact Very-thin Quad Flat No-lead (VQFN) SST Package Code: QVC

Microchip Proprietary Information 25 2.4 GHz High-Power, High-Gain Power Amplifier TOP VIEW SIDE VIEW BOTTOM VIEW 2. ±.5 See notes 2 and 3 Pin 1 (laser engraved see note 2) 2. ±.5.75.92 Pin 1.4 BSC.5 Max.265.165.5.4.25.15.34.24 Note: 1. Complies with JEDEC JEP95 MO-22J, variant VEED-4 except external paddle nominal dimensions and pull-back of terminals from body edge. 2. The topside pin 1 indicator is laser engraved; its approximate shape and location is as shown. 3. From the bottom view, the pin 1 indicator may be either a curved indent or a 45-degree chamfer. 3. The external paddle is electrically connected to the die back-side and possibly to certain V SS leads. This paddle must be soldered to the PC board; it is required to connect this paddle to the V SS of the unit. Connection of this paddle to any other voltage potential will result in shorts and electrical malfunction of the device. 4. Untoleranced dimensions are nominal target dimensions. 5. All linear dimensions are in millimeters (max/min). Figure 24:12-contact Extremely-thin Quad Flat No-lead (XQFN) SST Package Code: QXB 1mm 12-xqfn-2x2-QXB-2.

2.4 GHz High-Power, High-Gain Power Amplifier Table 7:Revision History Revision Description Date Initial release of data sheet Mar 21 1 Added QVC package to the data sheet. This required changes throughout the document and the addition of the following: Figures 1, 3, 17-22, Oct 21 and 24; Tables 1, 6, and 8. Changed document status from to Preliminary Specification 2 Added Figures 11-16 and Tables 4 and 7 Jan 211 3 Updated document status from Preliminary Specification to Data Feb 211 Sheet A Applied new document format Oct 212 Released document under letter revision system Updated spec number S71424 to DS7529 Updated XQFN information in Figures 11-16 Added package dimensions throughout. ISBN:978-1-6276-617- 212 Silicon Storage Technology, Inc a Microchip Technology Company. All rights reserved. SST, Silicon Storage Technology, the SST logo, SuperFlash, MTP, and FlashFlex are registered trademarks of Silicon Storage Technology, Inc. MPF, SQI, Serial Quad I/O, and Z-Scale are trademarks of Silicon Storage Technology, Inc. All other trademarks and registered trademarks mentioned herein are the property of their respective owners. Specifications are subject to change without notice. Refer to www.microchip.com for the most recent documentation. For the most current package drawings, please see the Packaging Specification located at http://www.microchip.com/packaging. Memory sizes denote raw storage capacity; actual usable capacity may be less. SST makes no warranty for the use of its products other than those expressly contained in the Standard Terms and Conditions of Sale. For sales office locations and information, please see www.microchip.com. Silicon Storage Technology, Inc. A Microchip Technology Company www.microchip.com Microchip Proprietary Information 26