LC 2 MOS 4-/8-Channel High Performance Analog Multiplexers AG408/AG409 FEATURES 44 V supply maximum ratings VSS to V analog signal range Low on resistance ( Ω maximum) Low power (ISUPPLY < 75 μa) Fast switching Break-before-make switching action Plug-in replacement for G408/G409 FUNCTIONAL BLOCK IAGRAMS AG408 A S4A B AG409 A B APPLICATIONS Audio and video routing Automatic test equipment ata acquisition systems Battery-powered systems Sample-and-hold systems Communication systems S8 S4B 1-OF-8 ECOER A0 A1 A2 EN Figure 1. 1-OF-4 ECOER A0 A1 EN 00027-001 GENERAL ESCRIPTION The AG408/AG409 are monolithic CMOS analog multiplexers comprising eight single channels and four differential channels, respectively. The AG408 switches one of eight inputs to a common output as determined by the 3-bit binary address lines A0, A1, and A2. The AG409 switches one of four differential inputs to a common differential output, as determined by the 2-bit binary address lines A0 and A1. An EN input on both devices is used to enable or disable the device. When the device is disabled, all channels are switched off. The AG408/AG409 are designed on an enhanced LC 2 MOS process that provides low power dissipation yet gives high switching speed and low on resistance. Each channel conducts equally well in both directions when on and has an input signal range that extends to the supplies. In the off condition, signal levels up to the supplies are blocked. All channels exhibit breakbefore-make switching action, preventing momentary shorting when switching channels. Inherent in the design is low charge injection for minimum transients when switching the digital inputs. PROUCT HIGHLIGHTS 1. Extended Signal Range. The AG408/AG409 are fabricated on an enhanced LC 2 MOS process, giving an increased signal range that extends to the supply rails. 2. Low Power issipation. 3. Low RON. 4. Single-Supply Operation. For applications where the analog signal is unipolar, the AG408/AG409 can be operated from a single rail power supply. The parts are fully specified with a single 12 V power supply and remain functional with single supplies as low as 5 V. The AG408/AG409 are improved replacements for the G408/G409 analog multiplexers. Rev. C Information furnished by Analog evices is believed to be accurate and reliable. However, no responsibility is assumed by Analog evices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog evices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 2006 Analog evices, Inc. All rights reserved.
TABLE OF CONTENTS Features... 1 Applications... 1 Functional Block iagrams... 1 General escription... 1 Product Highlights... 1 Revision History... 2 Specifications... 3 ual Supply... 3 Absolute Maximum Ratings...6 ES Caution...6 Pin Configurations and Function escriptions...7 Typical Performance Characteristics...8 Test Circuits... 11 Terminology... 13 Outline imensions... 14 Ordering Guide... 16 Single Supply... 4 REVISION HISTORY 10/06 Rev. B to Rev. C Updated Format...Universal Changes to Table 3... 6 Inserted Table 4 and Table 5... 7 Updated Outline imensions... 14 Changes to Ordering Guide... 15 3/03 Rev. A to Rev. B Changes to Ordering Guide...4 Updated Outline imensions... 11 2/01 Revision 0: Initial Version Rev. C Page 2 of 16
SPECIFICATIONS UAL SUPPLY V = 15 V, VSS = 15 V, GN = 0 V, unless otherwise noted. Table 1. Parameter B Version 40ºC to +25ºC +85ºC AG408/AG409 T Version 55ºC to +25ºC +125ºC Unit Test Conditions/Comments ANALOG SWITCH Analog Signal Range VSS to V VSS to V V RON 40 40 Ω typ V = ±10 V, IS = 10 ma 125 125 Ω max RON 15 15 Ω max V = +10 V, 10 V LEAKAGE CURRENTS Source Off Leakage IS (OFF) ±0.5 ±50 ±0.5 ±50 na max V = ±10 V, VS = m 10 V; see Figure 19 rain Off Leakage I (OFF) V = ±10 V; VS = m 10 V; see Figure 20 AG408 ±1 ± ±1 ± na max AG409 ±1 ±50 ±1 ±50 na max Channel On Leakage I, IS (ON) VS = V = ±10 V; see Figure 21 AG408 ±1 ± ±1 ± na max AG409 ±1 ±50 ±1 ±50 na max IGITAL INPUTS Input High Voltage, VINH 2.4 2.4 V min Input Low Voltage, VINL 0.8 0.8 V max Input Current IINL or IINH ±10 ±10 μa max VIN = 0 or V CIN, igital Input Capacitance 8 8 pf typ f = 1 MHz YNAMIC CHARACTERISTICS 1 ttransition 120 120 ns typ RL = 300 Ω, CL = 35 pf; 250 250 ns max V = ±10 V, VS8 = m 10 V; see Figure 22 topen 10 10 10 10 ns min RL = 300 Ω, CL = 35 pf; VS = 5 V; see Figure 23 ton (EN) 85 125 85 125 ns typ RL = 300 Ω CL = 35 pf; 150 225 150 225 ns max VS = 5 V; see Figure 24 toff (EN) 65 65 ns typ RL = 300 Ω, CL = 35 pf; 150 150 ns max VS = 5 V; see Figure 24 Charge Injection 20 20 pc typ VS = 0 V, RS = 0 Ω, CL = 10 nf; see Figure 25 OFF Isolation 75 75 db typ RL = 1 kω, f = khz; VEN = 0 V; see Figure 26 Channel-to-Channel Crosstalk 85 85 db typ RL = 1 kω, f = khz; see Figure 27 CS (OFF) 11 11 pf typ f = 1 MHz C (OFF) f = 1 MHz AG408 40 40 pf typ AG409 20 20 pf typ C, CS (ON) f = 1 MHz AG408 54 54 pf typ AG409 34 34 pf typ Rev. C Page 3 of 16
Parameter POWER REQUIREMENTS B Version 40ºC to +25ºC +85ºC T Version 55ºC to +25ºC +125ºC Unit Test Conditions/Comments I 1 1 μa typ VIN = 0 V, VEN = 0 V 5 5 μa max ISS 1 1 μa typ 5 5 μa max I μa typ VIN = 0 V, VEN = 2.4 V 200 500 200 500 μa max 1 Guaranteed by design, not subject to production test. SINGLE SUPPLY V = 12 V, VSS = 0 V, GN = 0 V, unless otherwise noted. Table 2. Parameter B Version 40ºC to +25ºC +85ºC T Version 55ºC to +25 C +125ºC Unit Test Conditions/Comments ANALOG SWITCH Analog Signal Range 0 to V 0 to V V RON 90 90 Ω typ V = 3 V, 10 V, IS = 1 ma LEAKAGE CURRENTS Source Off Leakage IS (OFF) ±0.5 ±50 ±0.5 ±50 na max V = 8 V/0 V, VS = 0 V/8 V; see Figure 19 rain Off Leakage I (OFF) V = 8 V/0 V, VS = 0 V/8 V; see Figure 20 AG408 ±1 ± ±1 ± na max AG409 ±1 ±50 ±1 ±50 na max Channel On Leakage I, IS (ON) VS = V = 8 V/0 V; see Figure 21 AG408 ±1 ± ±1 ± na max AG409 ±1 ±50 ±1 ±50 na max IGITAL INPUTS Input High Voltage, VINH 2.4 2.4 V min Input Low Voltage, VINL 0.8 0.8 V max Input Current IINL or IINH ±10 ±10 μa max VIN = 0 or V CIN, igital Input Capacitance 8 8 pf typ f = 1 MHz YNAMIC CHARACTERISTICS 1 ttransition 130 130 ns typ RL = 300 Ω, CL = 35 pf; V = 8 V/0 V, VS8 = 0 V/8 V; see Figure 22 topen 10 10 ns typ RL = 300 Ω, CL = 35 pf; VS = 5 V; see Figure 23 ton (EN) 140 140 ns typ RL = 300 Ω CL = 35 pf; VS = 5 V; see Figure 24 toff (EN) 60 60 ns typ RL = 300 Ω, CL = 35 pf; VS = 5 V; see Figure 24 Charge Injection 5 5 pc typ VS = 0 V, RS = 0Ω, CL = 10 nf; see Figure 25 Off Isolation 75 75 db typ RL = 1 kω f = khz; VEN = 0 V; see Figure 26 Rev. C Page 4 of 16
Parameter B Version 40ºC to +25ºC +85ºC T Version 55ºC to +25 C +125ºC Unit Test Conditions/Comments Channel-to-Channel Crosstalk 85 85 db typ RL = 1 kω, f = khz; see Figure 27 CS (OFF) 11 11 pf typ f = 1 MHz C (OFF) f = 1 MHz AG408 40 40 pf typ AG409 20 20 pf typ C, CS (ON) f = 1 MHz AG408 54 54 pf typ AG409 34 34 pf typ POWER REQUIREMENTS I 1 1 μa typ VIN = 0 V, VEN = 0 V 5 5 μa max I μa typ VIN = 0 V, VEN = 2.4 V 200 500 200 500 μa max 1 Guaranteed by design, not subject to production test. Rev. C Page 5 of 16
ABSOLUTE MAXIMUM RATINGS TA = 25 C, unless otherwise noted. Table 3. Parameter Rating V to VSS 44 V V to GN 0.3 V to +32 V VSS to GN +0.3 V to 32 V Analog, igital Inputs VSS 2 V to V + 2 V or 20 ma, whichever occurs first Continuous Current, S or 20 ma Peak Current, S or (Pulsed at 1 ms, 10% uty Cycle 40 ma Maximum) Operating Temperature Range Industrial (B Version) 40 C to +85 C Extended (T Version) 55 C to +125 C Storage Temperature Range 65 C to +150 C Junction Temperature 150 C CERIP Package, Power issipation 900 mw θja, Thermal Impedance 76 C/W Lead Temperature, Soldering 300 C (10 sec) PIP Package, Power issipation 470 mw θja, Thermal Impedance 117 C/W Lead Temperature, Soldering 260 C (10 sec) TSSOP Package, Power issipation 450 mw θja, Thermal Impedance 155 C/W θjc, Thermal Impedance 50 C/W SOIC Package, Power issipation 600 mw θja, Thermal Impedance 77 C/W Lead Temperature, Soldering Vapor Phase (60 sec) 215 C Infrared (15 sec) 220 C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ES CAUTION Rev. C Page 6 of 16
PIN CONFIGURATIONS AN FUNCTION ESCRIPTIONS A0 1 EN 2 16 A1 15 A2 3 AG408 14 GN 4 TOP VIEW 13 S2 5 (Not to Scale) 12 S5 S3 6 11 S6 S4 7 10 S7 8 9 S8 Figure 2. AG408 Pin Configuration Table 4. AG408 Pin Function escriptions Pin No. Mnemonic escription 1 A0 Logic Control Input. 2 EN Active High igital Input. When low, the device is disabled and all switches are off. When high, Ax logic inputs determine on switches. 3 VSS Most Negative Power Supply Potential in ual Supplies. In single-supply applications, it can be connected to ground. 4 Source Terminal 1. Can be an input or 5 S2 Source Terminal 2. Can be an input or 6 S3 Source Terminal 3. Can be an input or 7 S4 Source Terminal 4. Can be an input or 8 rain Terminal. Can be an input or an output. 9 S8 Source Terminal 8. Can be an input or 10 S7 Source Terminal 7. Can be an input or 11 S6 Source Terminal 6. Can be an input or 12 S5 Source Terminal 5. Can be an input or 13 V Most Positive Power Supply Potential. 14 GN Ground (0 V) Reference. 15 A2 Logic Control Input. 16 A1 Logic Control Input. Table 6. AG408 Truth Table A2 A1 A0 EN ON SWITCH X X X 0 NONE 0 0 0 1 1 0 0 1 1 2 0 1 0 1 3 0 1 1 1 4 1 0 0 1 5 1 0 1 1 6 1 1 0 1 7 1 1 1 1 8 00027-002 A0 1 EN 2 3 A 4 S2A 5 S3A 6 S4A 7 AG409 TOP VIEW (Not to Scale) 16 A1 15 GN 14 13 B 12 S2B 11 S3B 10 S4B A 8 9 B Figure 3. AG409 Pin Configuration Table 5. AG409 Pin Function escriptions Pin No. Mnemonic escription 1 A0 Logic Control Input. 2 EN Active High igital Input. When low, the device is disabled and all switches are off. When high, Ax logic inputs determine on switches. 3 VSS Most Negative Power Supply Potential in ual Supplies. In single-supply applications, it can be connected to ground. 4 A Source Terminal 1A. Can be an input or 5 S2A Source Terminal 2A. Can be an input or 6 S3A Source Terminal 3A. Can be an input or 7 S4A Source Terminal 4A. Can be an input or 8 A rain Terminal A. Can be an input or an output. 9 B rain Terminal B. Can be an input or an output. 10 S4B Source Terminal 4B. Can be an input or 11 S3B Source Terminal 3B. Can be an input or 12 S2B Source Terminal 2B. Can be an input or 13 B Source Terminal 1B. Can be an input or 14 V Most Positive Power Supply Potential. 15 GN Ground (0 V) Reference. 16 A1 Logic Control Input. Table 7. AG409 Truth Table ON SWITCH A1 A0 EN PAIR X X 0 NONE 0 0 1 1 0 1 1 2 1 0 1 3 1 1 1 4 00027-003 Rev. C Page 7 of 16
TYPICAL PERFORMANCE CHARACTERISTICS 120 T A =25 C 180 T A =25 C =+5V = 5V 160 =5V =0V 140 R ON (Ω) 80 60 =+10V = 10V = +12V = 12V R ON (Ω) 120 =10V =0V =12V =0V 80 40 = +15V = 15V 60 =15V =0V 20 15 10 5 0 5 10 15 V [ ](V) Figure 4. RON as a Function of V (VS): ual-supply Voltage 00027-004 40 0 3 6 9 12 15 V [ ](V) Figure 7. RON as a Function of V (VS): Single-Supply Voltage 00027-007 90 =+15V = 15V 130 120 =12V =0V 80 110 R ON (Ω) 70 60 85 C 125 C R ON (Ω) 90 125 C 50 80 85 C 40 25 C 70 25 C 30 15 10 5 0 5 10 15 V [ ](V) Figure 5. RON as a Function of V (VS) for ifferent Temperatures 00027-005 60 0 2 4 6 8 10 12 V [ ](V) Figure 8. RON as a Function of V (VS) for ifferent Temperature 00027-008 LEAKAGE CURRENT (na) 0.2 0.1 0 0.1 T A = 25 C =+15V = 15V I (ON) I S (OFF) I (OFF) LEAKAGE CURRENT (na) 0.04 0.02 0 0.02 0.04 T A = 25 C =12V =0V I (ON) I (OFF) I S (OFF) 0.2 15 10 5 0 5 10 15 V [ ](V) Figure 6. Leakage Currents as a Function of V (VS) 00027-006 0.06 0 2 4 6 8 10 12 V [ ](V) Figure 9. Leakage Currents as a Function of V (VS) 00027-009 Rev. C Page 8 of 16
120 = +15V = 15V 140 =12V =0V t TRANSITION t TRANSITION 120 t ON (EN) TIME (ns) 80 60 t ON (EN) 80 TIME (ns) 40 t OFF (EN) 60 t OFF (EN) 20 1 3 5 7 9 11 13 15 V IN (V) Figure 10. Switching Time vs. VIN (Bipolar Supply) 00027-010 40 1 3 5 7 9 11 13 V IN (V) Figure 13. Switching Time vs. VIN (Single Supply) 00027-013 400 V IN =5V 300 V IN =5V 300 t TRANSITION 200 TIME (ns) 200 t ON (EN) TIME (ns) t TRANSITION t ON (EN) t OFF (EN) t OFF (EN) 0 5 7 9 11 13 15 UPPLY (V) Figure 11. Switching Time vs. Single Supply 00027-011 0 ±5 ±7 ±9 ±11 ±13 ±15 UPPLY (V) Figure 14. Switching Time vs. Bipolar Supply 00027-014 10k = +15V = 15V 10k = +15V = 15V 1k I (µa) 1k I SS (µa) 10 EN = 2.4V EN = 2.4V 0 EN = 0V EN = 0V 10 1k 10k k 1M 10M FREQUENCY (Hz) 00027-012 10 10 1k 10k k 1M 10M FREQUENCY (Hz) 00027-015 Figure 12. Positive Supply Current vs. Switching Frequency Figure 15. Negative Supply Current vs. Switching Frequency Rev. C Page 9 of 16
110 = +15V = 15V 110 =+15V = 15V OFF ISOLATION (db) 90 CROSSTALK (db) 90 80 80 70 70 1k 10k k 1M FREQUENCY (Hz) 00027-016 60 1k 10k k 1M FREQUENCY (Hz) 00027-017 Figure 16. Off Isolation vs. Frequency Figure 17. Crosstalk vs. Frequency Rev. C Page 10 of 16
TEST CIRCUITS I S V1 S R ON =V1/I S 00027-018 S2 S8 GN 0.8V EN V I (OFF) A 00027-020 Figure 18. On Resistance Figure 20. I (OFF) I S (OFF) A V S2 S8 EN GN 0.8V 00027-019 S8 EN GN 2.4V V A I (ON) 00027-021 Figure 19. IS (OFF) Figure 21. I (ON) 3V ARESS RIVE (V IN ) 0V 50% 50% t r < 20ns t f < 20ns V IN 50Ω A0 A1 A2 S2 S7 V t TRANSITION OUTPUT t TRANSITION 90% 2.4V EN AG408 1 S8 8 OUTPUT 90% GN 300Ω 35pF 1SIMILAR CONNECTION FOR AG409. 00027-022 Figure 22. Switching Time of Multiplexer, ttransltlon 3V ARESS RIVE (V IN ) 0V V IN 50Ω A0 A1 A2 S2 S7 OUTPUT 80% 80% 2.4V EN AG408 1 S8 OUTPUT GN 300Ω 35pF t OPEN 1SIMILAR CONNECTION FOR AG409. 00027-023 Figure 23. Break-Before-Make elay, topen Rev. C Page 11 of 16
3V ENABLE RIVE (V IN ) 0V 50% 50% A0 A1 A2 S2 S8 OUTPUT t ON (EN) 0.9V O 0.9V O t OFF (EN) V IN 50Ω EN AG408 1 GN OUTPUT 300Ω 35pF 1SIMILAR CONNECTION FOR AG409. Figure 24. Enable elay, ton (EN), toff (EN) 00027-024 3V A0 A1 V IN A2 AG408 1 V OUT Q INJ =C L ΔV OUT ΔV OUT R S V IN S EN GN C L 10nF V OUT Figure 25. Charge Injection 1 SIMILAR CONNECTION FOR AG409. 00027-025 0V A0 A1 A2 S8 EN AG408 GN 1kΩ V OUT 1kΩ A0 A1 A2 S2 S8 AG408 GN EN 2.4V 1kΩ V OUT OFF ISOLATION = 20 log V OUT /V IN 00027-026 CROSSTALK = 20 log V OUT /V IN 00027-027 Figure 26. Off Isolation Figure 27. Channel-to-Channel Crosstalk Rev. C Page 12 of 16
TERMINOLOGY RON Ohmic resistance between and S. ΔRON ifference between the RON of any two channels. IS (OFF) Source leakage current when the switch is off. I (OFF) rain leakage current when the switch is off. I, IS (ON) Channel leakage current when the switch is on. V (VS) Analog voltage on Terminal and Terminal S. CS (OFF) Channel input capacitance for off condition. C (OFF) Channel output capacitance for off condition. C, CS (ON) On switch capacitance. CIN igital input capacitance. ton (EN) elay time between the 50% and 90% points of the digital input and switch on condition. toff (EN) elay time between the 50% and 90% points of the digital input and switch off condition. ttransition elay time between the 50% and 90% points of the digital inputs and the switch on condition when switching from one address state to another. topen Off time measured between the 80% point of both switches when switching from one address state to another. VINL Maximum input voltage for Logic 0. VINH Minimum input voltage for Logic 1. IINL (IINH) Input current of the digital input. Crosstalk A measure of unwanted signal that is coupled through from one channel to another as a result of parasitic capacitance. Off Isolation A measure of unwanted signal coupling through an off channel. Charge Injection A measure of the glitch impulse transferred from the digital input to the analog output during switching. I Positive supply current. ISS Negative supply current. Rev. C Page 13 of 16
OUTLINE IMENSIONS 0.800 (20.32) 0.790 (20.07) 0.780 (19.81) PIN 1 0.210 (5.33) MAX 0.150 (3.81) 0.130 (3.30) 0.115 (2.92) 0.022 (0.56) 0.018 (0.46) 0.014 (0.36) 16 1 0. (2.54) BSC 0.070 (1.78) 0.060 (1.52) 0.045 (1.14) 9 8 0.280 (7.11) 0.250 (6.35) 0.240 (6.10) 0.015 (0.38) MIN SEATING PLANE 0.005 (0.13) MIN 0.060 (1.52) MAX 0.015 (0.38) GAUGE PLANE 0.325 (8.26) 0.310 (7.87) 0.300 (7.62) 0.430 (10.92) MAX 0.195 (4.95) 0.130 (3.30) 0.115 (2.92) 0.014 (0.36) 0.010 (0.25) 0.008 (0.20) COMPLIANT TO JEEC STANARS MS-001-AB CONTROLLING IMENSIONS ARE IN INCHES; MILLIMETER IMENSIONS (IN PARENTHESES) ARE ROUNE-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AN ARE NOT APPROPRIATE FOR USE IN ESIGN. CORNER LEAS MAY BE CONFIGURE AS WHOLE OR HALF LEAS. Figure 28. 16-Lead Plastic ual In-Line Package [PIP] Narrow Body (N-16) imensions shown in inches and (millimeters) 0.005 (0.13) MIN 0.098 (2.49) MAX 16 1 9 8 0.310 (7.87) 0.220 (5.59) PIN 1 0. (2.54) BSC 0.840 (21.34) MAX 0.200 (5.08) MAX 0.200 (5.08) 0.125 (3.18) 0.023 (0.58) 0.014 (0.36) 0.070 (1.78) 0.030 (0.76) 0.060 (1.52) 0.015 (0.38) 0.150 (3.81) MIN SEATING PLANE 0.320 (8.13) 0.290 (7.37) 15 0 0.015 (0.38) 0.008 (0.20) CONTROLLING IMENSIONS ARE IN INCHES; MILLIMETER IMENSIONS (IN PARENTHESES) ARE ROUNE-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AN ARE NOT APPROPRIATE FOR USE IN ESIGN. Figure 29. 16-Lead Ceramic ual In-Line Package [CERIP] (Q-16) imensions shown in inches and (millimeters) Rev. C Page 14 of 16
10.00 (0.3937) 9.80 (0.3858) 4.00 (0.1575) 3.80 (0.1496) 16 9 1 8 6.20 (0.2441) 5.80 (0.2283) 0.25 (0.0098) 0.10 (0.0039) COPLANARITY 0.10 1.27 (0.0500) BSC 1.75 (0.0689) 1.35 (0.0531) 0.51 (0.0201) SEATING 0.31 (0.0122) PLANE 0.25 (0.0098) 0.17 (0.0067) 8 0 0.50 (0.0197) 45 0.25 (0.0098) 1.27 (0.0500) 0.40 (0.0157) COMPLIANT TO JEEC STANARS MS-012-AC CONTROLLING IMENSIONS ARE IN MILLIMETERS; INCH IMENSIONS (IN PARENTHESES) ARE ROUNE-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AN ARE NOT APPROPRIATE FOR USE IN ESIGN. Figure 30. 16-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-16) imensions shown in millimeters and (inches) 5.10 5.00 4.90 16 9 4.50 4.40 4.30 6.40 BSC 1 8 0.15 0.05 PIN 1 0.65 BSC 0.30 0.19 COPLANARITY 0.10 1.20 MAX 0.20 0.09 0.75 SEATING PLANE 8 0 0.60 0.45 COMPLIANT TO JEEC STANARS MO-153-AB Figure 31. 16-Lead Thin Shrink Small Outline Package [TSSOP] (RU-16) imensions shown in millimeters Rev. C Page 15 of 16
ORERING GUIE Model Temperature Range Package escription Package Option AG408BN 40 C to +85 C 16-Lead Plastic ual In-Line Package [PIP] N-16 AG408BNZ 1 40 C to +85 C 16-Lead Plastic ual In-Line Package [PIP] N-16 AG408BR 40 C to +85 C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 AG408BR-REEL 40 C to +85 C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 AG408BR-REEL7 40 C to +85 C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 AG408BRU 40 C to +85 C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 AG408BRU-REEL 40 C to +85 C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 AG408BRU-REEL7 40 C to +85 C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 AG408BRUZ 1 40 C to +85 C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 AG408BRUZ-REEL 1 40 C to +85 C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 AG408BRUZ-REEL7 1 40 C to +85 C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 AG408BRZ 1 40 C to +85 C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 AG408BRZ-REEL 1 40 C to +85 C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 AG408BRZ-REEL7 1 40 C to +85 C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 AG408TQ 55 C to +125 C 16-Lead Ceramic ual In-Line Package [CERIP] Q-16 AG408BCHIPS IE AG409BN 40 C to +85 C 16-Lead Plastic ual In-Line Package [PIP] N-16 AG409BNZ 1 40 C to +85 C 16-Lead Plastic ual In-Line Package [PIP] N-16 AG409BR 40 C to +85 C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 AG409BR-REEL 40 C to +85 C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 AG409BR-REEL7 40 C to +85 C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 AG409BRU 40 C to +85 C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 AG409BRU-REEL 40 C to +85 C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 AG409BRU-REEL7 40 C to +85 C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 AG409BRUZ 1 40 C to +85 C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 AG409BRUZ-REEL 1 40 C to +85 C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 AG409BRUZ-REEL7 1 40 C to +85 C 16-Lead Thin Shrink Small Outline Package [TSSOP] RU-16 AG409BRZ 1 40 C to +85 C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 AG409BRZ-REEL 1 40 C to +85 C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 AG409BRZ-REEL7 1 40 C to +85 C 16-Lead Narrow Body Small Outline Package [SOIC_N] R-16 AG409TQ 55 C to +125 C 16-Lead Ceramic ual In-Line Package [CERIP] Q-16 1 Z = Pb-free part. 2006 Analog evices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. C00027-0-10/06(C) Rev. C Page 16 of 16