Zener Voltage Regulators mw Surface Mount This series of Zener diodes is packaged in a surface mount package that has a power dissipation of mw. They are designed to provide voltage regulation protection and are especially attractive in situations where space is at a premium. They are well suited for applications such as cellular phones, hand held portables, and high density P boards. Specification Features: Standard Zener Breakdown Voltage Range.4 V to 75 V Steady State Power Rating of mw Small Body Outline Dimensions:.67 x.49 (.7 mm x.5 mm) Low Body Height:.35 (.9 mm) Package Weight: 4.57 mg/unit ESD Rating of lass 3 (>6 kv) per Human Body Model Pb Free Packages are Available Mechanical haracteristics: ASE: Void-free, Transfer-Molded Plastic FINISH: All External Surfaces are orrosion Resistant MAXIMUM ASE TEMPERATURE FOR SOLDERING PURPOSES: 6 for Seconds LEADS: Plated with Pb Sn or Sn Only (Pb Free) POLARITY: athode Indicated by Polarity Band FLAMMABILITY RATING: UL 94 V MOUNTING POSITION: Any athode ASE 477 STYLE Anode MARKING DIAGRAM xx M MAXIMUM RATINGS Rating Symbol Max Unit Total Device Dissipation FR 5 Board, (Note ) @ T A = 5 Derate above 5 P D.5 mw mw/ Thermal Resistance, Junction to Ambient R JA 635 /W Junction and Storage Temperature Range T J, T stg 65 to +5 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating onditions is not implied. Extended exposure to stresses above the Recommended Operating onditions may affect device reliability.. FR 4 Minimum Pad xx = Specific Device ode M = Date ode* = Pb Free Package (Note: Microdot may be in either location) *Date ode orientation may vary depending upon manufacturing location. ORDERING INFORMATION Device Package Shipping MM3ZxxxT 3/Tape & Reel MM3ZxxxTG (Pb Free) 3/Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8/D. DEVIE MARKING INFORMATION See specific marking information in the device marking column of the Electrical haracteristics table on page of this data sheet. Semiconductor omponents Industries, LL, 6 November, 6 Rev. 7 Publication Order Number: MM3ZV4T/D
ELETRIAL HARATERISTIS Symbol Parameter V Z Reverse Zener Voltage @ I ZT I ZT Reverse urrent I F I Z ZT Maximum Zener Impedance @ I ZT I ZK Z ZK I R Reverse urrent Maximum Zener Impedance @ I ZK Reverse Leakage urrent @ V R V Z V R I R V F IZT V V R I F Reverse Voltage Forward urrent V F Forward Voltage @ I F V Z Maximum Temperature oefficient of V Z Max. apacitance @V R = and f = MHz Zener Voltage Regulator ELETRIAL HARATERISTIS (T A = 5 unless otherwise noted, V F =.9 V Max. @ I F = ma for all types) Zener Voltage (Note ) Zener Impedance Leakage urrent V Z Z ZT (mv/k) @ V R = V @ I Device Z (Volts) @ I ZT @ I ZT Z ZK @ I ZK I R @ V R ZT f = MHz Device* Marking Min Nom Max ma ma A Volts Min Max pf MM3ZV4T, G..4.6 5.5 5 3.5 45 MM3ZV7T, G.5.7.9 5.5 3.5 45 MM3Z3VT, G.8 3. 3. 5.5 3.5 45 MM3Z3V3T, G 5 3. 3.3 3.5 5 95.5 5 3.5 45 MM3Z3V6T, G 6 3.4 3.6 3.8 5 9.5 5 3.5 45 MM3Z3V9T, G 7 3.7 3.9 4. 5 9.5 3 3.5.5 45 MM3Z4V3T, G 8 4. 4.3 4.6 5 9.5 3 3.5 45 MM3Z4V7T, G 9 4.4 4.7 5. 5 8 8.5 3. 3.5. 6 MM3Z5VT, G A 4.8 5. 5.4 5 6 5.5..7. 5 MM3Z5V6T, G 5. 5.6 6. 5 4.5...5 MM3Z6VT, G E 5.8 6. 6.6 5.5 3 4..4 3.7 85 MM3Z6V8T, G F 6.4 6.8 7. 5 5 6.5 4.. 4.5 55 MM3Z7V5T, G G 7. 7.5 7.9 5 5 6.5 5..5 5.3 4 MM3Z8VT, G H 7.7 8. 8.7 5 5 6.5.7 5. 3. 6. 35 MM3Z9VT, G K 8.5 9. 9.6 5 5 6.5. 7. 3.8 7. 3 MM3ZVT, G L 9.4.6 5 6.5 8. 4.5 8. 3 MM3ZVT, G M.4.6 5 6.5 8. 5.4 9. 3 MM3ZVT, G N.4.7 5 5 8.5 8. 6. 3 MM3Z3VT, G P.4 3.5 4. 5 3 8.5 8. 7. MM3Z5VT, G T 4.3 5 5.8 5 3 8.5.5.5 9. 3 MM3Z6VT, G U 5.3 6. 7. 5 4 8.5.5..4 4 5 MM3Z8VT, G W 6.8 8 9. 5 45 8.5.5.6.4 6 MM3ZVT, G Z 8.8. 5 55.5.5 4. 4.4 8 85 MM3ZVT, G.8 3.3 5 55.5.5 5.4 6.4 85 MM3Z4VT, G.8 4. 5.6 5 7.5.5 6.8 8.4 8 MM3Z7VT, G 5. 7 8.9 8 3.5.5 8.9.4 5.3 7 MM3Z3VT, G 4 8 3 3 8 3.5.5 4.4 9.4 7 MM3Z33VT, G 8 3 33 35 8 3.5.5 3. 7.4 33.4 7 MM3Z36VT, G 9 34 36 38 9 5.5.5 5. 3.4 37.4 7 MM3Z39VT, G 37 39 4 3 5.5.5 7.3 33.4 4. 45 MM3Z43VT, G 4 43 46 5 5.5.5 3 37.6 46.6 4 MM3Z47VT, G A 44 47 5 7 5.5.5 3.9 4. 5.8 4 MM3Z5VT, G 48 5 54 8 5.5.5 35.7 46.6 57. 4 MM3Z56VT, G D 5 56 6 5.5.5 39. 5. 63.8 4 MM3Z6VT E 58 6 66 5 5.5.5 43.4 58.8 7.6 35 MM3Z68VT, G F 64 68 7 4 5.5.5 47.6 65.6 79.8 35 MM3Z75VT, G G 7 75 79 55 5.5.5 5.5 73.4 88.6 35 *The G suffix indicates Pb Free package available.. Zener voltage is measured with a pulse test current I Z at an ambient temperature of 5.
TYPIAL HARATERISTIS Z ZT, DYNAMI IMPEDANE ( Ω ) 3. T J = 5 I Z(A) = I Z(D) f = khz I Z = ma 5 ma V Z, NOMINAL ZENER VOLTAGE 8 IF, FORWARD URRENT (ma).4 5 75 5.5.6.7.8.9 V F, FORWARD VOLTAGE (V).. Figure. Effect of Zener Voltage on Zener Impedance Figure. Typical Forward Voltage, APAITANE (pf) V BIAS V BIAS BIAS AT 5% OF V Z NOM T A = 5 I R, LEAKAGE URRENT ( μ A)... +5 +5 55 4. V Z, NOMINAL ZENER VOLTAGE (V). 7 3 4 5 V Z, NOMINAL ZENER VOLTAGE (V) 6 7 Figure 3. Typical apacitance Figure 4. Typical Leakage urrent 3
TYPIAL HARATERISTIS T A = 5 T A = 5 I Z, ZENER URRENT (ma) IZ, ZENER URRENT (ma).. 4. 6. 8. V Z, ZENER VOLTAGE (V). 3 5 7 9 V Z, ZENER VOLTAGE (V) Figure 5. Zener Voltage versus Zener urrent (V Z Up to V) Figure 6. Zener Voltage versus Zener urrent ( V to 75 V) POWER DISSIPATION (%) 8 6 4 5 5 75 5 5 TEMPERATURE ( ) Figure 7. Steady State Power Derating 4
PAKAGE DIMENSIONS ASE 477 ISSUE G b H E D E NOTES:. DIMENSIONING AND TOLERANING PER ANSI Y4.5M, 98.. ONTROLLING DIMENSION: MILLIMETERS. 3. LEAD THIKNESS SPEIFIED PER L/F DRAWING WITH SOLDER PLATING. 4. DIMENSIONS A AND B DO NOT INLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. 5. DIMENSION L IS MEASURED FROM END OF RADIUS. NOTE 3 L NOTE 5 A A3 A MILLIMETERS DIM MIN NOM MAX A.8.9 A..5. A3 5 REF b.5.3.4.89 77 D.6.7.8 E.5.5.35 L.8 H E.3.5.7 INHES MIN NOM MAX.3.35.4...4.6 REF...6.3.5.7.6.66.7.45.49.53.3.9.98.5 STYLE : PIN. ATHODE. ANODE SOLDERING FOOTPRINT*.63.5.6.63.85.83.33 *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor omponents Industries, LL (SILL). SILL reserves the right to make changes without further notice to any products herein. SILL makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SILL assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SILL data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SILL does not convey any license under its patent rights nor the rights of others. SILL products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SILL product could create a situation where personal injury or death may occur. Should Buyer purchase or use SILL products for any such unintended or unauthorized application, Buyer shall indemnify and hold SILL and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SILL was negligent regarding the design or manufacture of the part. SILL is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLIATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution enter for ON Semiconductor P.O. Box 563, Denver, olorado 87 USA Phone: 33 675 75 or 8 344 386 Toll Free USA/anada Fax: 33 675 76 or 8 344 3867 Toll Free USA/anada Email: orderlit@onsemi.com N. American Technical Support: 8 8 9855 Toll Free USA/anada Europe, Middle East and Africa Technical Support: Phone: 4 33 79 9 Japan ustomer Focus enter Phone: 8 3 5773 385 5 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MM3ZV4T/D