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Operational Amplifier ANSSM CMOS single power supply Overview ANSSM is an operational amplifier with a single power supply by CMOS diffusion process. It has low current-consumption compared to general purpose operational amplifier by bipolar diffusion process. V to V DD is available for both input voltage and output voltage. And this IC is widely applicable to the butterydriven equipment and to many amplifier circuits which adopt small package products. Features Low current-consumption: I DD = µa (typ.), V DD = V Operating input/output voltage range: V to V DD Small offset voltage:. mv (typ.) Small input bias current: pa (typ.) Operating supply voltage range:. V to. V or ±. V to ±.7 V Applications Various small-size general consumer electronics equipment Block Diagram Pin Descriptions Pin No. Symbol Description V OUT Output GND (V SS ) Ground, V SS (negative supply) at using two power supply V IN+ Input (positive) V IN Input (negative) V DD Power supply V DD V OUT GND (V SS ) V IN V IN+..6±...±..6 max. to....±..6±... +. -.. M.8 +. -. Seating plane Unit: mm SSMINI-DA (Lead-free package) includes following four Product lifecycle stage. Note) The ANSSM has been designed for general consumer electronics equipment, not for the specific one requiring such a high reliability that may prevent it from threatening the human lives. Publication date: August SFBCEB

ANSSM Absolute Maximum Ratings Parameter Symbol Rating Unit Supply voltage V DD.6 V Differential input voltage DV IN ±.6 V Input voltage V IN V SS to V DD V Supply current I DD ma Power dissipation * Operating ambient temperature * P D mw T opr to +8 C Storage temperature * T stg to + C Note). *: Except for the operating ambient temperature and storage temperature, all ratings are for T a = C. *: The value at T a = +8 C.. This IC is not suitable for car electrical equipment. Recommended Operating Range Parameter Symbol Range Unit Supply voltage V DD. to. V ±. to ±.7 Electrical Characteristics at V DD =. V, V SS = GND, T a = C ± C Parameter Symbol Conditions Min Typ Max Unit Input offset voltage V IO.. mv Common-mode input voltage CMV IN R S = kω, R F = kω V Open-loop gain GV f = Hz 6 9 db Maximum output amplitude voltage V OH R L kω.9.98 V Maximum output amplitude voltage V OL R L kω.. V Common-mode input voltage CMRR V IN =. V to. V, R S = R F = kω 6 db rejection ratio Supply voltage ripple rejection ratio * SVRR V DD =. V to. V 7 db Supply current I DD µa Note) * : Except for the supply voltage ripple rejection ratio (SVRR), V DD = V. Design reference data includes following four Product lifecycle stage. Note) The characteristics listed below are theoretical values based on the IC design and are not guaranteed. Parameter Symbol Conditions Reference Unit Offset current I O pa Input bias current I IO pa Slew rate SR R L kω. V/µs Zero-cross frequency f T A V =.8 MHz SFBCEB

ANSSM Technical Data P D T a curve of SSMINI-DA. P D T a Independent IC without a heat sink R th( j-a) = 8. C/W Main characteristics Supply current I DD (µa) 8 7 6 Power dissipation P D (W).... Supply current Supply voltage.... Supply voltage V DD (V). 7 8 VIN+ = VDD / High-level output voltage Output flow-out current High-level output voltage VOL (V)..8.6....8.6 V DD = V V IN+ = V Output flow-out current I O (ma) 6 Low-level output voltage VOL (V) Low-level output voltage Output flow-in current...8.6.. V V V Output flow-in current I O (ma) Slew rate SR VDD = V VIN+ = V V DD = V includes following four Product lifecycle stage. V V V V V Input Output (µs) SFBCEB

ANSSM Technical Data (continued) Main characteristics (continued) Offset voltage V IO (mv) Voltage gain (db) Offset voltage Ambient temperature 7 V DD = V V IN+ = V DD / Voltage gain Phase Frequency characteristics 6 Voltage gain k k k Frequency f (Hz) Application Circuit Example M V DD = V A V = db Phase M 8 9 Phase ( ) Supply current I DD (µa) 8 7 6 Supply current Ambient temperature VDD = V VIN+ = V DD / 7 V DD. µf V IN includes following four Product lifecycle stage. V OUT GND (V SS ) V IN+ SFBCEB

Request for your special attention and precautions in using the technical information and semiconductors described in this book () If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. () The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. () The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Any applications other than the standard applications intended. () The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. () When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. includes following four Product lifecycle stage.