Applications Repeaters Mobile Infrastructure LTE / WCDMA / CDMA / EDGE General Purpose Wireless 6 Pin x mm QFN Package Product Features Functional Block Diagram -4 MHz.5 db Gain at 9 MHz. db Noise Figure at 9 MHz +7 dbm Output IP 5 Ohm Cascadable Gain Block Unconditionally Stable High Input Power Capability +5 V Single Supply, 85mA Current x mm QFN Package RF In Pin Reference Mark 6 5 4 4 9 5 6 7 8 Backside Pad - RF/DC GND RF Out / V DD General Description The is a cascadable, high linearity gain block amplifier in a low-cost surface-mount package. At.9 GHz, this amplifier typically provides.5 db gain, +7 dbm output IP and. db noise figure while only drawing 85 ma current. The device is housed in a leadfree / green / RoHS-compliant industry-standard 6-pin xmm QFN package. The has the benefit of having high gain across a broad range of frequencies while also providing very low noise. This allows the device to be used in both receiver and transmitter chains for high performance systems. The amplifier is internally matched using a high performance E-pHEMT process and requires only an external RF choke and blocking/bypass capacitors for operation from a single +5 V supply. The internal active bias circuit also provides stable operation over bias and temperature variations. The covers the.-4 GHz frequency band and is targeted for wireless infrastructure or other applications requiring high linearity and/or low noise figure. Pin Configuration Pin No. Label RF In RF Out / VDD All Other Pins Backside Paddle RF/DC GND Ordering Information Part No. -PCB_IF Description 5-5 MHz Evaluation Board -PCB_RF.5-4 GHz Evaluation Board Standard T/R size = 5 pieces on a 7 reel Datasheet: Rev M 6--5 - of - Disclaimer: Subject to change without notice
Absolute Maximum Ratings Parameter Rating Storage Temperature 65 to 5 C RF Input Power, CW, 5Ω, T=5 C Supply Voltage (VDD) Reverse Supply Voltage + dbm +7 V -. V Operation of this device outside the parameter ranges given above may cause permanent damage. Recommended Operating Conditions Parameter Min Typ Max Units Supply Voltage (VDD) +. +5. +5.5 V TCASE 4 +5 C Tj for > 6 hours MTTF +9 C Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Electrical Specifications Test conditions unless otherwise noted: VDD=+5V, Temp.=, 5 Ω system Parameter Conditions Min Typ Max Units Operational Frequency Range 4 MHz Test Frequency 9 MHz Gain 9.5 db Input Return Loss 6 db Output Return Loss 9 db Output PdB + dbm Output IP Pout=+ dbm/tone, f = MHz + +7 dbm Noise Figure. db Current, IDD 85 ma Thermal Resistance, θjc Module (junction to case) 8.7 C/W Datasheet: Rev M 6--5 - of - Disclaimer: Subject to change without notice
-PCB_RF Evaluation Board (5 4 MHz) J4 J J V DD J4 GND C B C C U L C6 J RF Input C U L C6 J RF Output Notes:. See Evaluation Board PCB Information section for material and stack-up.. Components shown on the silkscreen but not on the schematic are not used.. B ( Ω jumper) is not shown on the schematic and may be replaced with copper trace in the target application layout. 4. The recommended component values are dependent upon the frequency of operation. 5. All components are of 6 size unless otherwise specified. Bill of Material -PCB_RF Reference Des. Value Description Manuf. Part Number n/a n/a Printed Circuit Board TriQuint 764 U n/a TriQuint C, C6 pf CAP, 6, 5%, V, NPO/COG various C. uf CAP, 6, 5%, 5V, X7R various L 68 nh IND, 6, 5% CoilCraft 6CS-68NXJL B Ω RES, 6 various L, D, C, C4 DNP n/a n/a n/a Note: Performances can be optimized at frequency of interest by using recommended component values shown in the table below. Inductors are wirewound Coilcraft. Reference Designation 5 5 5 5 C, C6. uf pf pf pf pf pf L 47 nh nh 8 nh nh 8 nh 5 nh Datasheet: Rev M 6--5 - of - Disclaimer: Subject to change without notice
S (db) Noise Figure (db) Gain (db) S (db) RFMD + TriQuint = Qorvo Typical Performance -PCB_RF Test conditions unless otherwise noted: VDD=+5V, IDD=85 ma typ., Temp= Parameter Typical Value Units Frequency 5 9 9 7 5 4 MHz Gain.4.9.5 9.5 8. 7 db Input Return Loss 6.6.5.7 8 db Output Return Loss 9 9 6 6.6 8 db Output PdB +.4 +.4 + +. +9.8 +9. dbm OIP () +8.4 +7.5 +7 +5. +4.7 +4.4 dbm Noise figure ()....6.5 db Notes:. OIP measured with two tones at an output power of +4 dbm / tone separated by MHz.. Noise figure data listed in the table above includes PCB losses. ~.db @ GHz. Performance Plots -PCB_RF Test conditions unless otherwise noted: VDD=+5V, IDD=85 ma typ., Temp= 4 Gain vs. Frequency over Temp - S vs. Frequency over Temp - 8-6.5.5.5.5 4-4.5.5.5.5 4 S vs. Frequency over Temp 4 Noise Figure vs. Frequency over Temp - 4 C - - -4.5.5.5.5 4.5.5.5.5 4 Datasheet: Rev M 6--5-4 of - Disclaimer: Subject to change without notice
Noise Figure (db) Idd (ma) OIP (dbm) PdB (dbm) PdB (dbm) Idd (ma) OIP (dbm) OIP (dbm) RFMD + TriQuint = Qorvo Performance Plots -PCB_RF Test conditions unless otherwise noted: VDD=+5V, IDD=85 ma typ., Temp= 45 4 OIP vs. Pout/tone over Temp Frequency = 9 MHz 45 4 OIP vs. Frequency over Temp 5 5 5 4 6 8 Pout/tone (dbm) 5.5.5.5.5 4 6 4 PdB vs. Frequency over Temp 9 85 Idd vs. Temperature Temp.= CW Signal 8 75 8.5.5.5.5 4 7-4 -5 5 6 85 Temperature ( C) 45 OIP vs. Vdd Temp.= PdB vs. Vdd Temp.= 4 5 9 MHz 9 MHz 5 9 MHz 9 MHz 5 5 4 5 6 7 Vdd (Volts) 4 5 6 7 Vdd (Volts).5 Noise Figure vs. Vdd Temp.= 9 85 Idd vs. Vdd Temp.= CW Signal.5 9 MHz 9 MHz 8 75.5 7 4 5 6 7 Vdd (Volts) 65 4 5 6 7 Vdd (Volts) Datasheet: Rev M 6--5-5 of - Disclaimer: Subject to change without notice
-PCB_IF Evaluation Board (5 5 MHz) J4 J J V DD J4 GND C B C C U L C6 J RF Input C U L C6 J RF Output Notes:. See Evaluation Board PCB Information section for material and stack-up.. Components shown on the silkscreen but not on the schematic are not used.. B ( Ω jumper) is not shown on the schematic and may be replaced with copper trace in the target application layout. 4. The recommended component values are dependent upon the frequency of operation. 5. All components are of 6 size unless stated on the schematic. Bill of Material -PCB_IF Reference Des. Value Description Manuf. Part Number n/a n/a Printed Circuit Board TriQuint 764 U n/a TriQuint C, C6 pf CAP, 6, 5%, 5V, X7R various C. uf CAP, 6, 5%, 5V, X7R various L nh IND, 6, 5% CoilCraft 6CS-RXJL B Ω RES, 6 various L, D, C, C4 DNP n/a n/a n/a Note: Performances can be optimized at frequency of interest by using recommended component values shown in the table below. Inductors are wirewound Coilcraft. Reference Designation 5 5 5 5 C, C6. uf pf pf pf pf pf L 47 nh nh 8 nh nh 8 nh 5 nh Datasheet: Rev M 6--5-6 of - Disclaimer: Subject to change without notice
OIP (dbm) PdB (dbm) S (db) Noise Figure (db) Gain (db) S (db) RFMD + TriQuint = Qorvo Typical Performance -PCB_IF Test conditions unless otherwise noted: VDD=+5V, IDD=85 ma typ., Temp= Parameter Conditions Typical Values Units Frequency 7 5 MHz Gain...9. db Input Return Loss db Output Return Loss 9 9 db Output PdB +9.8 +. +9.9 +9.9 dbm OIP Pout = + dbm/tone, f= MHz +7 +7 +7 +7 dbm Noise figure...8. db Performance Plots -PCB_IF Test conditions unless otherwise noted: VDD=+5V, Temp.= 6 Gain vs. Frequency over Temp S vs. Frequency over Temp 4 8-5 - -5 6 4 5-4 5 S vs. Frequency over Temp 4 Noise Figure vs. Frequency over Temp -5 - -5-4 5 4 5 45 OIP vs. Frequency over Temp PdB vs. Frequency over Temp 4 5 8 6 5 4 5 4 4 5 Datasheet: Rev M 6--5-7 of - Disclaimer: Subject to change without notice
Pin Configuration and Description Pin Reference Mark RF In 6 5 4 4 9 5 6 7 8 RF Out / V DD Backside Pad - RF/DC GND Pin No. Label Description RF In RF input matched to 5 ohms. External DC Block is required. RF Out / VDD RF output matched to 5 ohms. Bias voltage and external DC Block required. All other pins No internal connection. Provide grounded PCB land pads for optimal isolation and mounting integrity. Backside Pad RF/DC GND RF/DC ground. Use recommended via pattern to minimize inductance and thermal resistance. See PCB Mounting Pattern. Evaluation Board PCB Information TriQuint PCB 764 Material and Stack-up.4".6" ±.6" Finished Board Thickness.4" Nelco N-4- Nelco N-4- ε r =.9 typ. Nelco N-4- oz. Cu top layer oz. Cu inner layer oz. Cu inner layer oz. Cu bottom layer 5 ohm line dimensions: width =.9, spacing =.5 Datasheet: Rev M 6--5-8 of - Disclaimer: Subject to change without notice
Package Marking and Dimensions Package Marking: Part number 98 Year/week/country code YYWW Lot code axxxx Pin Locator.±.5 98 YYWW axxxx.7±.5 Exp.DAP.±.5.±.5.5 Bsc PIN # IDENTIFICATION CHAMFER. X 45.7±.5 Exp.DAP.-.5.85±.5 Side View. Ref. Top View.8±.5.5 Ref. Exposed Pad (EP) Bottom View Notes:. All dimensions are in millimeters. Angles are in degrees.. Dimension and tolerance formats conform to ASME Y4.4M-994.. The terminal # identifier and terminal numbering conform to JESD 95- SPP-. PCB Mounting Pattern.7 (.7) Package Outline.5 (.). (.).7 (.7).57 (.) 5X Ø.5 (.).5 (.). (.4). (.) 6X.5 (.). (.4).5 (.) COMPONENT SIDE Notes:. All dimensions are in millimeters (inches). Angles are in degrees.. Use oz. copper minimum for top and bottom layer metal.. Ground/thermal vias are required for the proper operation of this device. We recommend a.5mm (#8/.5") diameter bit for drilling via holes and a final plated thru diameter of.5mm (. ). 4. Ensure good package backside exposed pad (EP) solder attach for best electrical and thermal performance. Datasheet: Rev M 6--5-9 of - Disclaimer: Subject to change without notice
Product Compliance Information ESD Sensitivity Ratings Caution! ESD-Sensitive Device ESD Rating: Class A Value: Passes 5 V to < 5 V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD-A4 ESD Rating: Class C Value: Passes V Test: Charged Device Model (CDM) Standard: JEDEC Standard JESD-C MSL Rating MSL Rating: Level Test: 6 C convection reflow Standard: JEDEC Standard IPC/JEDEC J-STD- Solderability Compatible with both lead-free (6 C max. reflow temperature) and tin/lead (45 C max. reflow temperature) soldering processes. Contact plating: Annealed Matte Tin RoHs Compliance This part is compliant with EU /95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). This product also has the following attributes: Lead Free Halogen Free (Chlorine, Bromine) Antimony Free TBBP-A (C5HBr4) Free PFOS Free SVHC Free Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Tel: +.5.65.9 Email: info-sales@tqs.com Fax: +.5.65.89 For technical questions and application information: Email: sjcapplications.engineering@tqs.com Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or lifesustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Datasheet: Rev M 6--5 - of - Disclaimer: Subject to change without notice