Optical measurement of narrow holes

Similar documents
Roughness Pad - Measurements Report

Optimet. Optimet Industrial. Catalog Beyond any measure

MEASUREMENT APPLICATION GUIDE OUTER/INNER

Manufacturing Metrology Team

Standard Operating Procedure of Atomic Force Microscope (Anasys afm+)

EXPRIMENT 3 COUPLING FIBERS TO SEMICONDUCTOR SOURCES

Technical Explanation for Displacement Sensors and Measurement Sensors

Notes on the VPPEM electron optics

Silicon wafer thickness monitor

Outline: Introduction: What is SPM, history STM AFM Image treatment Advanced SPM techniques Applications in semiconductor research and industry

Beamscope-P8 Wavelength Range. Resolution ¼ - 45 ¼ - 45

immersion optics Immersion Lithography with ASML HydroLith TWINSCAN System Modifications for Immersion Lithography by Bob Streefkerk

Starting Modela Player 4

Thickness Measurement with Laser Displacement Sensors

MICROBUMP LITHOGRAPHY FOR 3D STACKING APPLICATIONS

A LARGE COMBINATION HORIZONTAL AND VERTICAL NEAR FIELD MEASUREMENT FACILITY FOR SATELLITE ANTENNA CHARACTERIZATION

Coaxial Lights LFV3 series

Laser diffuse reflection light scanner with background suppression. Dimensioned drawing

Surface Finish Measurement Methods and Instrumentation

Application Note. Thickness measurement with two sensors

Sensors and Metrology - 2 Optical Microscopy and Overlay Measurements

Exercise questions for Machine vision

Point Autofocus Probe Surface Texture Measuring Instrument. PF-60 technical report

MicroPG 101 Pattern Generator Standard Operating Procedure Draft v.0.2

Laser diffuse reflection light scanner with background suppression. Dimensioned drawing

MEMS Optical Scanner "ECO SCAN" Application Notes. Ver.0

Sintec Optronics Technology Pte Ltd 10 Bukit Batok Crescent #07-02 The Spire Singapore Tel: Fax:

PROCEEDINGS OF SPIE. Automated asphere centration testing with AspheroCheck UP

Coherent Laser Measurement and Control Beam Diagnostics

Lithography. 3 rd. lecture: introduction. Prof. Yosi Shacham-Diamand. Fall 2004

Systematic Workflow via Intuitive GUI. Easy operation accomplishes your goals faster than ever.

Certificate of Accreditation

CCD-array with RTSC. Laserdiode. Multi-lens optics. Filter

LFV3-100SW LFV3-40SW. Transmittance rate (High) LED side. Move to LED side. LED side. Default position LFV3-CP-13RD. Wavelength/ color.

The End of Thresholds: Subwavelength Optical Linewidth Measurement Using the Flux-Area Technique

Fast Optical Form Measurements of Rough Cylindrical and Conical Surfaces in Diesel Fuel Injection Components

ANALYSIS OF MEASUREMENT ACCURACY OF CONTACTLESS 3D OPTICAL SCANNERS

Optotop. 3D Topography. Roughness (Ra opt, Rq opt, and Rz opt) Height Distribution. Porosity Distribution. Effective Contact Area

1.6 Beam Wander vs. Image Jitter

ADVANCED OPTICS LAB -ECEN 5606

Titelfoto. Advanced Laser Beam Shaping - for Optimized Process Results and Quality Inspection in the PV Production - Maja Thies.

Evaluating Commercial Scanners for Astronomical Images. The underlying technology of the scanners: Pixel sizes:

Contouring aspheric surfaces using two-wavelength phase-shifting interferometry

Part 5-1: Lithography

Results of Proof-of-Concept 50keV electron multi-beam Mask Exposure Tool (emet POC)

The Mobile CNC Measurement and 3D Scanning System. WENZEL ScanTec MobileScan3D

Adaptive Optics for LIGO

Spatially Resolved Backscatter Ceilometer

New methodology for through silicon via array macroinspection

Autotracker III. Applications...

Hartmann wavefront sensing Beamline alignment

Deformable MEMS Micromirror Array for Wavelength and Angle Insensitive Retro-Reflecting Modulators Trevor K. Chan & Joseph E. Ford

Supplementary Figure 1

Confocal chromatic sensors and confocal microscope Micrometer measurement of thickness, displacement, position

Assembly and Experimental Characterization of Fiber Collimators for Low Loss Coupling

ADVANCED OPTICS LAB -ECEN Basic Skills Lab

SUPRA Optix 3D Optical Profiler

PAD Correlator Computer

On Line Measuring in PM complex Parts by Conoscopic Holography

Mode analysis of Oxide-Confined VCSELs using near-far field approaches

Semiconductor Manufacturing Technology. Semiconductor Manufacturing Technology. Photolithography: Resist Development and Advanced Lithography

FemtoFAB. Femtosecond laser micromachining system. tel fax Konstitucijos ave. 23C LT Vilnius, Lithuania

WaveMaster IOL. Fast and Accurate Intraocular Lens Tester

MICROMACHINED INTERFEROMETER FOR MEMS METROLOGY

BENCHTOP POLARIZATION EXTINCTION RATIO METER

Process Optimization

WaveMaster IOL. Fast and accurate intraocular lens tester

RELM20 high accuracy linear scale

Experiment 10. Diffraction and interference of light

Growing a NASA Sponsored Metrology Project to Serve Many Applications and Industries. James Millerd President, 4D Technology

D U A L S T E P H E I G H T. Calibration Standards

Industrial quality control HASO for ensuring the quality of NIR optical components

Measurement of Microscopic Three-dimensional Profiles with High Accuracy and Simple Operation

Will contain image distance after raytrace Will contain image height after raytrace

Geometry of Aerial Photographs

Copyright 1997 by the Society of Photo-Optical Instrumentation Engineers.

Prepare Sample 3.1. Place Sample in Stage. Replace Probe (optional) Align Laser 3.2. Probe Approach 3.3. Optimize Feedback 3.4. Scan Sample 3.

SpeedMark Tutorial 4 Using the rotary indexer

DIMENSIONAL MEASUREMENT OF MICRO LENS ARRAY WITH 3D PROFILOMETRY

You won t be able to measure the incident power precisely. The readout of the power would be lower than the real incident power.

Applications of Maskless Lithography for the Production of Large Area Substrates Using the SF-100 ELITE. Jay Sasserath, PhD

Optical Requirements

CATALOG LISTING SPECIFICATIONS 11 30mA 22 to 130mm (White Paper), 22 to 70mm (Black Paper) 3 to 130mm (White Paper) Ambient light Seal

Smart_Projector. The Next Generation Profile Projector. State-of-the-art Video Measuring Machine NEW 2015 VERSION. 10 Mpx Industrial Camera

InvenSense IDG-300 Dual-Axis Angular Rate Gyroscope Sensor

ProSeries Scan Head 2-Axis, Enclosed

PICO MASTER 200. UV direct laser writer for maskless lithography

Use of Computer Generated Holograms for Testing Aspheric Optics

OPTIV CLASSIC 321 GL TECHNICAL DATA

Capacitive sensors capancdt

Who We Are. Antennas Space Terahertz

Z500. High-Precision Sensor that Measures and Displays an Object's Profile. Profile Measuring System

Park NX-Hivac The world s most accurate and easy to use high vacuum AFM for failure analysis.

Parallel Mode Confocal System for Wafer Bump Inspection

450mm patterning out of darkness Backend Process Exposure Tool SOKUDO Lithography Breakfast Forum July 10, 2013 Doug Shelton Canon USA Inc.

X-ray generation by femtosecond laser pulses and its application to soft X-ray imaging microscope

SCANNING ELECTRON MICROSCOPE (SEM) INSPECTION OF SEMICONDUCTOR DICE. ESCC Basic Specification No

OPTICAL MEASUREMENT ON THE SHOPFLOOR

Automated Spectrophotometric Spatial Profiling of Coated Optical Wafers

Gravitational Lensing Experiment

Transcription:

Optical measurement of narrow holes By: Roei Yiftah, Industrial Product Manager; Moshe Danziger, Application Engineer, and Shmulik Barzilay, International Sales Manager, Optimet General: Measuring deep and narrow holes with an aspect ratio of 1:5 (Diameter : Height) has always been a difficult and largely an unsolved problem. This is even more problematic if not only the bottom surface needs to be measured, but also the side walls, which are characterized with very steep angles. Optimet's non-contact distance sensors use a unique technology which has the largest angular coverage in the market (±85 ) and is also co-linear. These advantages enable measurement of the side walls as well as the bottom surface. Some applications require measurement of 90 falling walls. This can be solved by integrating two ConoPoint-10 sensors each tilted at ±7 relative to the top surface, which can accurately measure the walls and return the inner diameter within micron level. Each sensor covers the steep angle of one wall. Profiles can then be simply merged, achieving measurement of parallel walls inside narrow holes 1

Case Study of Silicon Shower Head 1. This report summarizes the scans and analysis done on Silicon Shower Head of semiconductor components. 2. The objective was to measure the depth of the holes in the wafer until reaching the neck diameter of 0.5mm, and demonstrating the abilities of Optimet sensors at achieving the measurement of the entire hole up to that neck. 3. In order to filter out multiple reflections from the hole slopes but still receive good data from the points that were scanned, we've added a few mechanical and optical elements which clean the signals from the multiple reflections and can see both the top reflective surface (which has also a diffusive signal in it) and into the hole in one scanning session. The use of these elements is possible only due to Optimet's unique capabilities and technology, and increase the measurement accuracy without reducing the measurement range. 4. The scans were performed using a CP-10 with optical filter and 50mm lens with QWP (Quarter wave plate) on Optimet s laboratory demonstrator scanner as depicted in figure 1. 5. Since the angular coverage of Optimet sensors with that configuration is ±85 and the request was to get a FULL ±90 angular coverage of the hole s walls it was necessary to tilt the sample by ±7 (2 different tilts, one in each angle) to ensure a full measurement of the hole s side walls. 6. In order to confirm the accuracy of our scan results we ve made impressions of various holes of the wafer and measured them for comparison as depicted in figure 2. 2

Figure 1: CP-10 with optical filter and 50mm lens with QWP Figure 2: impression taken of some holes Customer requirement 1. Measure height from top surface to where the hole reaches minimum diameter of 0.5mm. 2. Measure up to ±90 of hole s walls. Test Set Up 1. An impression of various holes was taken and measured using CP10 with Optical filter and 50mm lens. (we used the same sensor configuration and the scans of the wafer for comparison) 2. The wafer was scanned at the same hole the impression was taken from. 3. The scans on the wafer were taken in 3 different angles: 0, +7 and -7 as shown in pictures below. 4. The analysis was done in 2 stages: a. On each of the scans separately by using Optimet s Viewer SW to measure angle, height and hole diameter b. By combining two scans, the +7 and -7, and aligning them together, and then measuring the minimum hole diameter using GeoMagic SW 3

Wafer at 0 Wafer at -7 Wafer at +7 0-7 +7 Sensor parameters: Type: ConoPoint-10 Lens: 50mm with QWP Other elements: Optical filter Main sensor specifications: Lens type 25mm Measurement range (mm) 6 Standoff (mm) 44 Accuracy (µm) 5 Scanning parameters: Lateral resolution [X*Y]: Scanning axis: Measurement frequency: Laser power: Auto exposure: 5μm X 10μm X axis 3000Hz Max on Scanner system: Laboratory Conoscan3000 4

Measurement analysis Impression scan: 0.554mm 3.636mm As can be seen in the pictures above, the impression gves very clear data and can be measured up to an angle of 85, above that angle there is no data. The diameter of the impression at 85 is 0.554mm and the height from th wafer s surface to that minimum diameter is 3.636mm Hole scan: A scan was done on the same hole as the impression above was taken. 2 holes were scanned in order to do a correct alignment when combining the scans: Wafer at -7 Wafer at +7 5

After combining the scans and tilting them to 0 : Same hole as impression above Hole dimensions: 3.649mm 0.551mm The slight difference between the impression scan and the wafer s scan might be due to the difference in the angles measured since by combining the 2 scans of the wafer we were able to reach ±90 (impression only ±85 ) The difference between nominal diameter from customer (0.5mm) and actual diameter measured might be due to inaccuracies in alignment of the 2 scans. 6

In order to try and get a more accurate alignment of the 2 scans we used GeoMagic SW. the results are presented in the following pictures: As can be seen from the pictures above, the hole s dimensions are the same as measured before: 0.552mm diameter The 2 nd hole has a diameter of 0.563mm, but I didn t take an impression of it so I can t compare. (The neck might be deeper than the first hole and is either out of WR or I didn t tilt the wafer to a steep enough angle to reach the 90 wall) 7

Results 1. Requirements: a. Measure height from top surface to where the hole reaches minimum diameter of 0.5mm Accomplished. Diameter measured: ~0.55mm b. Measure up to ±90 of hole s walls Accomplished 2. As seen from the pictures above, the CP-10 with optical filter and 50mm lens is fully capable of measuring the requested diameter even if it s >3.5mm deep. That gives an aspect ratio of 1:7 the largest in the market by far! 3. Suggestion for this application : Use 2 ConoPoint-10 sensors at which each sensor is tilted 5-7 compared to the sample s top surface as shown in the illustration below (need to ad optical filters): Each sensor will cover the steep angles of the other wall, so one wall will always be deeper than the second. Then the profiles need to be tilted to align the top surface to 0, and then correlate both scans to find where the neck reaches 0.5mm. Optimet is the only company which can get these results, no other technology can reach our abilities and doesn t match us in this application. 8