v3.13 HMC9 Typical Applications The HMC9 is ideal for use as either a LNA or driver amplifier for: Point-to-Point Radios Point-to-Multi-Point Radios VSAT Military & Space Functional Diagram Features Noise Figure: db Output P1dB: +6 dbm Gain: 7 db Output IP3: +35 dbm Supply Voltage: +5V 5 Ohm Matched Input/Output Die Size:.78 x 1.6 x.1 mm General Description The HMC9 is a high dynamic range GaAs PHEMT MMIC Low Noise Amplifier which operates between 1 and 17 GHz. The HMC9 provides 7 db of gain, db noise figure and an output IP3 of 35 dbm from a +5V supply voltage. The amplifier chip can easily be integrated into Multi-Chip-Modules (MCMs) due to its small size. All data is tested with the chip in a 5 Ohm test fixture connected via.5mm (1 mil) diameter wire bonds of minimal length.31mm (1 mils). Electrical Specifications, T A = +5 C, Vdd = 5V, Idd = ma* Parameter Min. Typ. Max. Min. Typ. Max. Units Frequency Range 1-1 1-17 GHz Gain 6.5 7 db Gain Variation Over Temperature.3..3. db/ C Noise Figure.5. db Input Return Loss 8 1 db Output Return Loss 8 9 db Output Power for 1 db Compression (P1dB) 5 3 6 dbm Saturated Output Power (Psat) 7 8 dbm Output Third Order Intercept (IP3) 3 35 dbm Supply Current (Idd)(Vdd = 5V, Vgg = -.8V Typ.) 5 5 ma * Adjust Vgg between -. to V to achieve Idd = ma typical. 1 For price, delivery and to place orders: Hittite Microwave Corporation, For price, delivery, Elizabeth and to Drive, place Chelmsford, orders: Analog MA Devices, 18 Inc., One Technology Way, P.O. Box 916, Norwood, MA 6-916 Phone: 978-5-333 Fax: 978-5-3373 Phone: Order 781-39-7 On-line at www.hittite.com Application Support: Phone: 978-5-333 Application or apps@hittite.com Support: Phone: 1-8-ANALOG-D
v3.13 HMC9 Broadband Gain & Return Loss RESPONSE (db) 3 1-1 - 8 1 1 1 16 18 S1 S11 S Input Return Loss vs. Temperature RETURN LOSS (db) - -8-1 -16 Gain vs. Temperature GAIN (db) 3 3 8 6 18 16 1 1 1 1 11 1 13 1 15 16 17 18 Output Return Loss vs. Temperature RETURN LOSS (db) - - -6-8 -1-1 - 1 11 1 13 1 15 16 17 18-1 1 11 1 13 1 15 16 17 18 Noise Figure vs. Temperature 1 Output IP3 vs. Temperature 8 35 NOISE FIGURE (db) 6 IP3 (dbm) 3 5 15 1 11 1 13 1 15 16 17 18 1 1 11 1 13 1 15 16 17 18 For price, delivery and to place orders: Hittite Microwave Corporation, For price, delivery, Elizabeth and to Drive, place Chelmsford, orders: Analog MA Devices, 18 Inc., One Technology Way, P.O. Box 916, Norwood, MA 6-916 Phone: 978-5-333 Fax: 978-5-3373 Phone: Order 781-39-7 On-line at www.hittite.com Application Support: Phone: 978-5-333 Application or apps@hittite.com Support: Phone: 1-8-ANALOG-D
v3.13 HMC9 P1dB vs. Temperature 3 Psat vs. Temperature 3 P1dB (dbm) 8 16 1 8 1 11 1 13 1 15 16 17 18 Gain & Noise Figure vs. Supply Voltage@ 1 GHz, Idd= ma GAIN (db) 3 8 6 5 3 1 NOISE FIGURE (db) Psat (dbm) 8 16 1 8 1 11 1 13 1 15 16 17 18 Power Compression @ 1 GHz Pout (dbm), GAIN (db), PAE (%) 35 3 5 15 1 5 3 3.5.5 5 5.5 Vdd (V) -1-8 -6 - - 6 INPUT POWER (dbm) Gain Noise Figure Pout Gain PAE Gain, Noise Figure & Output IP3 vs. Supply Current @ 1 GHz, Vdd= 5V* 3 5 Power Dissipation GAIN (db), IP3 (dbm) 3 6 18 3 1 NOISE FIGURE (db) POWER DISSIPATION (W) 1.8 1.6 1. 1. 1.8.6 1 1 15 15 175 Idd (ma). -1-8 -6 - - 6 INPUT POWER (dbm) Gain IP3 Noise Figure * Idd is controlled by varying Vgg Max Pdis @ 85C 1 GHz 13 GHz 1 GHz 15 GHz 16 GHz 3 For price, delivery and to place orders: Hittite Microwave Corporation, For price, delivery, Elizabeth and to Drive, place Chelmsford, orders: Analog MA Devices, 18 Inc., One Technology Way, P.O. Box 916, Norwood, MA 6-916 Phone: 978-5-333 Fax: 978-5-3373 Phone: Order 781-39-7 On-line at www.hittite.com Application Support: Phone: 978-5-333 Application or apps@hittite.com Support: Phone: 1-8-ANALOG-D
v3.13 HMC9 Reverse Isolation vs. Temperature ISOLATION (db) Absolute Maximum Ratings Drain Bias Voltage (Vdd1, Vdd, Vdd3) -1 - -3 - -5-6 -7 1 11 1 13 1 15 16 17 18 +5.5 Vdc Gate Bias Voltage (Vgg1, Vgg, Vgg3) - to Vdc RF Input Power (RFIN)(Vdd = +5 Vdc) +1 dbm Channel Temperature 175 C Continuous Pdiss (T= 85 C) (derate 19. mw/ C above 85 C) 1.73 W Thermal Resistance (channel to die bottom) 5 C/W Storage Temperature -65 to +15 C Operating Temperature -55 to +85 C Typical Supply Current vs. Vdd Vdd (Vdc) Idd (ma) +.5 191 +5. +5.5 8 +3. 189 +3.5 +. 8 Note: Amplifier will operate over full voltage ranges shown above. Vgg adjusted to achieve Idd= ma at +5.V and +3.5V. ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS For price, delivery and to place orders: Hittite Microwave Corporation, For price, delivery, Elizabeth and to Drive, place Chelmsford, orders: Analog MA Devices, 18 Inc., One Technology Way, P.O. Box 916, Norwood, MA 6-916 Phone: 978-5-333 Fax: 978-5-3373 Phone: Order 781-39-7 On-line at www.hittite.com Application Support: Phone: 978-5-333 Application or apps@hittite.com Support: Phone: 1-8-ANALOG-D
v3.13 HMC9 Outline Drawing NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM]. DIE THICKNESS IS. 3. TYPICAL BOND IS. SQUARE. BACKSIDE METALLIZATION: GOLD 5. BOND PAD METALLIZATION: GOLD 6. BACKSIDE METAL IS GROUND. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. Die Packaging Information [1] Standard Alternate GP- (Gel Pack) [] [1] Refer to the Packaging Information section for die packaging dimensions. [] For alternate packaging information contact Hittite Microwave Corporation. 5 For price, delivery and to place orders: Hittite Microwave Corporation, For price, delivery, Elizabeth and to Drive, place Chelmsford, orders: Analog MA Devices, 18 Inc., One Technology Way, P.O. Box 916, Norwood, MA 6-916 Phone: 978-5-333 Fax: 978-5-3373 Phone: Order 781-39-7 On-line at www.hittite.com Application Support: Phone: 978-5-333 Application or apps@hittite.com Support: Phone: 1-8-ANALOG-D
v3.13 HMC9 Pad Descriptions Pad Number Function Description Interface Schematic 1,8, 7 Vgg1,, 3 RFIN 3,, 5 Vdd1,, 3 6 RFOUT Assembly Diagram Gate control for amplifier. Adjust to achieve Id of ma. Please follow MMIC Amplifier Biasing Procedure Application Note. External bypass capacitors of 1 pf and.1 µf are required. This pad is AC coupled and matched to 5 Ohms. Power Supply Voltage for the amplifier. External bypass capacitors of 1 pf and.1 µf are required. This pad is AC coupled and matched to 5 Ohms. Die Bottom GND Die Bottom must be connected to RF/DC ground. For price, delivery and to place orders: Hittite Microwave Corporation, For price, delivery, Elizabeth and to Drive, place Chelmsford, orders: Analog MA Devices, 18 Inc., One Technology Way, P.O. Box 916, Norwood, MA 6-916 Phone: 978-5-333 Fax: 978-5-3373 Phone: Order 781-39-7 On-line at www.hittite.com Application Support: Phone: 978-5-333 Application or apps@hittite.com Support: Phone: 1-8-ANALOG-D 6
v3.13 HMC9 Mounting & Bonding Techniques for Millimeterwave GaAs MMICs The die should be attached directly to the ground plane eutectically or with conductive epoxy (see HMC general Handling, Mounting, Bonding Note). 5 Ohm Microstrip transmission lines on.17mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If.5mm (1 mil) thick alumina thin film substrates must be used, the die should be raised.15mm (6 mils) so that the surface of the die is coplanar with the surface of the substrate. One way to accomplish this is to attach the.1mm ( mil) thick die to a.15mm (6 mil) thick molybdenum heat spreader (moly-tab) which is then attached to the ground plane (Figure ). Microstrip substrates should brought as close to the die as possible in order to minimize bond wire length. Typical die-to-substrate spacing is.76mm to.15 mm (3 to 6 mils). Handling Precautions Follow these precautions to avoid permanent damage. Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment. Once the sealed ESD protective bag has been opened, all die should be stored in a dry nitrogen environment. Cleanliness: Handle the chips in a clean environment. DO NOT attempt to clean the chip using liquid cleaning systems. Static Sensitivity: Follow ESD precautions to protect against ESD strikes. Transients: Suppress instrument and bias supply transients while bias is applied. Use shielded signal and bias cables to minimize inductive pickup..1mm (. ) Thick GaAs MMIC.76mm (.3 ) RF Ground Plane Wire Bond.17mm (.5 ) Thick Alumina Thin Film Substrate Figure 1..1mm (. ) Thick GaAs MMIC.76mm (.3 ) RF Ground Plane Wire Bond.15mm (.5 ) Thick Moly Tab.5mm (.1 ) Thick Alumina Thin Film Substrate Figure. General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The surface of the chip has fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers. Mounting The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy. The mounting surface should be clean and flat. Eutectic Die Attach: A 8/ gold tin preform is recommended with a work surface temperature of 55 C and a tool temperature of 65 C. When hot 9/1 nitrogen/hydrogen gas is applied, tool tip temperature should be 9 C. DO NOT expose the chip to a temperature greater than 3 C for more than seconds. No more than 3 seconds of scrubbing should be required for attachment. Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer s schedule. Wire Bonding Ball or wedge bond with.5mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 15 C and a ball bonding force of to 5 grams or wedge bonding force of 18 to grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible <.31mm (1 mils). 7 For price, delivery and to place orders: Hittite Microwave Corporation, For price, delivery, Elizabeth and to Drive, place Chelmsford, orders: Analog MA Devices, 18 Inc., One Technology Way, P.O. Box 916, Norwood, MA 6-916 Phone: 978-5-333 Fax: 978-5-3373 Phone: Order 781-39-7 On-line at www.hittite.com Application Support: Phone: 978-5-333 Application or apps@hittite.com Support: Phone: 1-8-ANALOG-D
v3.13 HMC9 Notes: For price, delivery and to place orders: Hittite Microwave Corporation, For price, delivery, Elizabeth and to Drive, place Chelmsford, orders: Analog MA Devices, 18 Inc., One Technology Way, P.O. Box 916, Norwood, MA 6-916 Phone: 978-5-333 Fax: 978-5-3373 Phone: Order 781-39-7 On-line at www.hittite.com Application Support: Phone: 978-5-333 Application or apps@hittite.com Support: Phone: 1-8-ANALOG-D 8