Data and signal line chokes

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Transcription:

common-mode chokes for CAN bus systems, EIA 1812 51... 100 μh, 150... 200 ma Series/Type: Date: February 2016 a~í~=püééí EPCOS AG 2016. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS prior express consent is prohibited. EPCOS AG is a TDK Group Company.

Rated voltage 50 V DC Rated inductance 51... 100 μh Rated current 150... 200 ma Construction Current-compensated double choke Ferrite I core Winding: enamel copper wire Winding welded to terminals Features Operating temperature range: 40... +150 C Qualified to AEC-Q200 Suitable for lead-free reflow soldering as referenced in JEDEC J-STD 020D RoHS-compatible Function Suppression of assymetrical interference coupled in on lines, whereas data signals up to some MHz can pass unaffectedly. Applications Automotive CAN bus systems Terminals One-sided tinned terminals: Base material CuSn8 Electro-plating Sn with Ni underlayer Lead-free tinned Marking Marking on component: L value ("G" = 51 µh, "H" = 100 µh), date of manufacture (YWWD), two last digits of production order (underlined) Delivery mode and packing unit 12-mm blister tape, wound on 330-mm reel Packing unit: 2500 pcs./reel 2 02/16

Dimensional drawing and pin configurationlayout recommendation Dimensions in mm Circuit diagram Taping and packing Blister tape Reel Dimensions in mm 3 02/16

Technical data and measuring conditions Rated voltage V R 50 V DC Max. component temperature +150 C Rated current I R Referred to 50 Hz and +20 C Rated inductance L R Measured with Agilent 4284A at 100 khz, 100 mv, +20 C Inductance is specified in common-mode Inductance tolerance 30/+50% at +20 C Stray inductance L stray,typ DC resistance R max Insulation resistance (min) Rated impedance Z min Rated impedance Z typ Solderability Measured with Agilent 4284A at 100 khz, 100 mv, +20 C, typical values Measured at +20 C, specified per winding 10 M, measured at 50 V DC Measured at +20 C, 10 MHz, 100 mv in common-mode Measured at +20 C, 10 MHz, 100 mv in common-mode Dip and look method Sn95.5Ag3.8Cu0.7: +(245 5) C, (3 0.3) s Wetting of soldering area 90% (based on IEC 60068-2-58) Resistance to soldering heat +260 C, 40 s as referenced in JEDEC J-STD 020D Climatic category 40/150/56 (to IEC 60068-1) Storage conditions (packaged) Weight 25 C +40 C, 75% RH Approx. 0.14 g Characteristics and ordering codes L R µh L stray,typ µh I R ma R max Z min Z typ Internal code Ordering code 51 0.15 200 1.0 1000 2800 B82787C0513H002-510-2P-TL003 100 0.20 150 2.0 2000 5800 B82787C0104H002-101-2P-TL003 4 02/16

Impedance versus frequency -510-2P-TL003-101-2P-TL003 5 02/16

Cautions and warnings Please note the recommendations in our Inductors data book (latest edition) and in the data sheets. Particular attention should be paid to the derating curves given there. The soldering conditions should also be observed. Temperatures quoted in relation to wave soldering refer to the pin, not the housing. If the components are to be washed varnished it is necessary to check whether the washing varnish agent that is used has a negative effect on the wire insulation, any plastics that are used, or on glued joints. In particular, it is possible for washing varnish agent residues to have a negative effect in the long-term on wire insulation. Washing processes may damage the product due to the possible static or cyclic mechanical loads (e.g. ultrasonic cleaning). They may cause cracks to develop on the product and its parts, which might lead to reduced reliability or lifetime. The following points must be observed if the components are potted in customer applications: Many potting materials shrink as they harden. They therefore exert a pressure on the plastic housing or core. This pressure can have a deleterious effect on electrical properties, and in extreme cases can damage the core or plastic housing mechanically. It is necessary to check whether the potting material used attacks or destroys the wire insulation, plastics or glue. The effect of the potting material can change the high-frequency behaviour of the components. Ferrites are sensitive to direct impact. This can cause the core material to flake, or lead to breakage of the core. Even for customer-specific products, conclusive validation of the component in the circuit can only be carried out by the customer. Display of ordering codes for EPCOS products The ordering code for one and the same product can be represented differently in data sheets, data books, other publications and the website of EPCOS, or in order-related documents such as shipping notes, order confirmations and product labels. The varying representations of the ordering codes are due to different processes employed and do not affect the specifications of the respective products. Detailed information can be found on the Internet under www.epcos.com/orderingcodes. 6 02/16

Important notes The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the General Terms of Delivery for Products and Services in the Electrical Industry published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, Alu-X, CeraDiode, CeraLink, CeraPad, CeraPlas, CSMP, CSSP, CTVS, DeltaCap, DigiSiMic, DSSP, ExoCore, FilterCap, FormFit, LeaXield, MiniBlue, MiniCell, MKD, MKK, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, PhiCap, PQSine, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SiMic, SIMID, SineFormer, SIOV, SIP5D, SIP5K, TFAP, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks. 7 02/16