High Power C Band Limiter Module: Ultra Low Flat Leakage & Fast Recovery Time

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PRELIMINARY RFLM-502602HC-491 High Power C Band Limiter Module: Ultra Low Flat Leakage & Fast Recovery Time Features: C Band SMT Limiter Module 6mm x 9mm x 2.5mm Frequency Range: 5.0 to 6.0 GHz High Average Power Handling: +48 dbm (CW) @ T case =+85 o C +50 dbm (CW) @ T case =+55 o C High Peak Power Handling: +57 dbm (Peak): PW=25 usec, PRR=5% T amb =85 o C Low Insertion Loss: <0.6 db Return Loss: >15 db Low Flat Leakage Power: <14 dbm Low Spike Energy Leakage: <0.5 ergs Ultra Fast Recovery Time: 500 nsec DC Blocking Capacitors Always On Protection o - No external control lines or power supply required RoHS Compliant Description: The RFLM-502602HC-491 SMT Silicon PIN Diode Limiter Module offers Always On High Power CW and Peak protection in the C-Band region. This Limiter Modules are based on proven hybrid assembly technique utilized extensively in high reliability, mission critical applications. The RFLM-502602HC-491 offers excellent thermal characteristics in a compact, low profile 6mm x 9mm x 2.5mm package. They designed for optimal small signal insertion loss permitting extremely low receiver noise figure while simultaneously offering excellent large input signal Flat Leakage for effective receiver protection in the C Band frequency range. The RFLM-502602HC-491 Limiter Module provides outstanding passive receiver protection (Always on) which protects against High Average Power up to +48 dbm @ Tcase=+85 o C, High Peak Power up to +57 dbm (Peak) Pulse Width = 25 usec, Pulse Repetition Rate = 5%, Tcase=+85 o C, maintains low flat leakage to less than 14 dbm (typ), and reduces Spike Leakage to less than 0.5 ergs(typ). ESD and Moisture Sensitivity Rating The RFLM-502602HC-491 Limiter Module carries a Class 1C ESD rating (HBM) and an MSL 1 moisture rating. Thermal Management Features Wei Bo Associates HK, Ltd. sales@weiboassociates.com.hk www.weiboassociates.com.hk 1

The proprietary design methodology minimizes the thermal resistance from the PIN Diode junction to base plate (R THJ -A) to less than 25 o C/W. The two stage limiter design employs a two stage detector circuit which enables ultra-fast turn on of the High Power PIN Diodes. This circuit topology coupled with the thermal characteristic of the substrate design enables the Limiter Module to reliably handling High Input RF Power up to +48 dbm CW and RF Peak Power levels up to +57 dbm (25 usec pulse width @ 5.0% duty cycle) with base plate temperature at +85 o C.The RFLM-502602HC-491 based substrate has been design to offer superior long term reliability in the customer s application by utilizing ultra-thin Au plating to combat Au embrittlement concerns. Absolute Maximum Ratings @ Z o =50Ω, T A = +25 o C as measured on the base ground surface of the device. Parameter Conditions Absolute Maximum Value Operating Temperature Storage Temperature Junction Temperature -65 o C to 125 o C -65 o C to 150 o C 175 o C Assembly Temperature T = 30 seconds 260 o C RF Peak Incident Power RF CW Incident Power RF CW Incident Power θ JC Thermal Resistance RF Input & Output DC Block Capacitor Voltage Breakdown T CASE =85 o C, source and load VSWR < 1.2:1, RF Pulse width = 25 usec, duty cycle = 5%, derated linearly to 0 W at T CASE =150 o C (note 1) T CASE =+85 o C, source and load VSWR < 1.2:1, derated linearly to 0 W at T CASE =150 o C (note 1) T CASE =+55 o C, source and load VSWR < 1.2:1, derated linearly to 0 W at T CASE =150 o C (note 1) From Diode Junction to bottom surface of package +57 dbm +48 dbm +50 dbm 25 o C/W 100 V DC Note 1: T CASE is defined as the temperature of the bottom ground surface of the device. Wei Bo Associates HK, Ltd. sales@weiboassociates.com.hk www.weiboassociates.com.hk 2

RFLM-2062352HC-491 Electrical Specifications @ Z o=50ω, TA= +25 o C as measured on the base ground surface of the device. Parameters Symbol Test Conditions Min Value Typ Value Max Value Units Frequency F 5.0 GHz F 6.0 GHz 5.0 6.0 GHz Insertion Loss IL 5.0 GHz F 6.0 GHz, P in= -10dBm 0.5 0.6 db Insertion Loss Rate of Change vs Operating Temperature IL 5.0 GHz F 6.0 GHz, Pin -10 dbm 0.005 db/ o C Return Loss RL 5.0 GHz F 6.0 GHz, Pin= - 10dBm 15 db Input 1 db Compression Point IP 1dB 5.0 GHz F 6.0 GHz 0 9 10 dbm 2 nd Harmonic 2F o P in= -10 dbm, F o= 3.0 GHz -40-30 dbc Peak Incident Power P inc (PK) RF Pulse = 25 usec, duty cycle = 5%, t rise 3us, t fall 3usec +57 dbm CW Incident Power P inc(cw) 5.0 GHz F 6.0 GHz T case = +85 o C +48 dbm Flat Leakage FL P in = +57 dbm, RF Pulse width = 25 us, duty cycle = 5%, t rise 3 us, t fall 3 us 14 dbm Spike Leakage SL Pin = +57 dbm, RF Pulse width = 25 us, duty cycle = 5% 0.5 erg Recovery Time T R db IL, Pin = +57 dbm peak, RF PW = 25 us, duty cycle = 5%, trise 50% falling edge of RF Pulse to 1 3us, t fall 3usec 500 700 nsec Wei Bo Associates HK, Ltd. sales@weiboassociates.com.hk www.weiboassociates.com.hk 3

Assembly Instructions The RFLM-502602HC-491may be attached to the printed circuit card using solder reflow procedures using either RoHS or Sn63/ Pb37 type solders per the Table and Temperature Profile Graph shown below: Profile Parameter Sn-Pb Assembly Technique RoHS Assembly Technique Average ramp-up rate (T L to T P ) 3 o C/sec (max) 3 o C/sec (max) Preheat Temp Min (T smin ) Temp Max (T smax ) Time ( min to max) (t s ) T smax to T L Ramp up Rate 100 o C 150 o C 60 120 sec 100 o C 150 o C 60 180 sec 3 o C/sec (max) Peak Temp (T P ) 225 o C +0 o C / -5 o C 260 o C +0 o C / -5 o C Time within 5 o C of Actual Peak Temp (T P ) 10 to 30 sec 20 to 40 sec Time Maintained Above: Temp (T L ) Time (t L ) 183 o C 60 to 150 sec 217 o C 60 to 150 sec Ramp Down Rate 6 o C/sec (max) 6 o C/sec (max) Time 25 o C to T P 6 minutes (max) 8 minutes (max) Solder Re-Flow Time-Temperature Profile Wei Bo Associates HK, Ltd. sales@weiboassociates.com.hk www.weiboassociates.com.hk 4

RFLM-502602HC-491 Limiter Module Package Outline Drawing Notes: 1) Metalized area on backside is the RF, DC and Thermal ground. In user s end application this surface temperature must be managed to meet the power handling requirements. 2) Back side metallization is thin Au termination plating to combat Au embrittlement (Au plated over Cu). 3) Unit = mils Thermal Design Considerations: The design of the RFLM-502602HC-491Limiter Module permits the maximum efficiency in thermal management of the PIN Diodes while maintaining extremely high reliability. Optimum Limiter performance and reliability of the device can be achieved by the maintaining the base ground surface temperature of less than 85 o C. Wei Bo Associates HK, Ltd. sales@weiboassociates.com.hk www.weiboassociates.com.hk 5

There must be a minimal thermal and electrical resistance between the limiter module and ground. Adequate thermal management is required to maintain a Tjc at less than +175 o C and thereby avoid adversely affectingthe semiconductor reliability. Special care must be taken to assure that minimal voiding occurs in the solder connection in the areas shade in red in the figure shown below. Recommended RF Circuit Solder Footprint for the RFLM-502602HC-491 Notes: 1) Recommended PCB material is Rogers 4350B, 20 mils thick (RF Input and Output trace width needs to be adjusted from the recommended footprint.) 2) Hatched area is RF, DC and Thermal Ground. Vias should be solid Cu filled and Au plated for optimal heat transfer from backside of Limiter Module through circuit vias to thermal ground. 3) Unit = mils Part Number Ordering Detail: The RFLM-502602HC-491 Limiter Module is available in either tube or Tape & Reel format. Part Number Description Packaging RFLM-502602HC-491 C Band Limiter with Input & Output DC Blocking Caps Tube RFLM-502602HC-491TR C Band Limiter with Input & Output DC Blocking Caps TR (250 pcs) Wei Bo Associates HK, Ltd. sales@weiboassociates.com.hk www.weiboassociates.com.hk 6