Large Area, Flexible Electronics TWG Chair: Dan Gamota, Jabil
Large Area Flexible Electronics Roadmap History 09/2005 inemi Stakeholders identify Flexible Electronics as Future Growth Market and authorize formation of TWG 2006 Flexible Electronics TWG formed 2007 1 st Edition inemi Roadmap released 2009 2 nd Edition inemi Roadmap released 2011 3 rd Edition inemi Roadmap released 2013 4 th Edition inemi Roadmap released 2015 5 th Edition inemi Roadmap released 1 st Edition Released at APEX 2007
Large Area Flexible Electronics Roadmap Contents
Roadmap Contents Roadmap of Quantified Key Attribute Needs, Gaps, and Showstoppers Functional Inks: Technology Requirements Substrates: Technology Requirements Packaging/Barriers: Technology Requirements Manufacturing Platforms and Processing Equipment: Technology Requirements In-line Characterization Tools: Technology Requirements Off-line Characterization Tools: Technology Requirements Devices and Circuits: Technology Requirements Flexible Electronics: Technology Requirements Reliability: Technology Requirements Standards: Technology Requirements
inemi Large Area Flexible Electronics Roadmap TWG Group Participants Core group sustaining TWG (participated in multiple chapter editions) Continually seeking new participants Engaged» Singapore representatives» Germany/EU representatives» US representatives» Sought representatives from China 2015 Edition What is new? Identification of flexible hybrid electronics (FHE) based products as near-term commercialization opportunity medical, automotive, wearables/consumer. Updated sections 4
inemi Large Area Flexible Electronics Roadmap Drivers of Change Market Increased consumer demand for novel form factor wearable and flexible products. Growing demand by consumer electronics, automotive, and aerospace industries for touch control, lighting, sensors, low-frequency wireless devices, innovative signage, photovoltaic, and flexible displays. Commercialization and near-commercialization of flexible hybrid electronics (FHE) products which combine printed electronics with conventional electronics. 5
inemi Large Area Flexible Electronics Roadmap Drivers of Change Government Singapore, Japan, EU, Korea, and China continue to make wellpublicized commitments by funding multi-million dollar precompetitive and competitive technology development efforts. US - On February 10, 2015 the US Department of Defense released a solicitation for proposals to initiate and sustain a Flexible Hybrid Electronics Manufacturing Innovation Institute (FHE-MII) as part of the National Network for Manufacturing Innovation (http://www.manufacturing.gov/fhe-mii.html). 6
inemi Large Area Flexible Electronics Roadmap Drivers of Change Technology Flexible Hybrid Electronics - electronics components, modules, and products that comprise 1) thinned, compliant elements such as but not limited to electronic, electro-mechanical, electro-optical, electro-chemical, and electro-biological that are fabricated using traditional processes (e.g. photolithography, etching, grinding, plasma, vacuum deposition) and 2) elements that are fabricated using a printing process (e.g. gravure, flexography, needle dispensing, ink jet) which are integrated on a flexible substrate (e.g. metal, organic, or inorganic). Availability of higher performance OLED, OPV, and semiconductor (p and n type) materials: solution processable small molecule, inorganic precursors, nanoscale inorganic semiconductor materials, and other novel inorganic and organic dispersions. Commercialization/near-commercialization of enhanced barrier materials. Commercialization/near-commercialization of higher performance conductive inks, dielectric materials, and substrates. Development of large area, lower-cost manufacturing processes leveraging roll-to-roll equipment infrastructure. 7
inemi Large Area Flexible Electronics Roadmap Drivers of Change Standards IPC published two standards:1) IPC/JPCA-4921 Requirements for Printed Electronics Base Materials and 2) IPC/JPCA-4591 Requirements for Printed Electronics Functional Materials. Also, a design guideline was published: IPC/JPCA 2291 Design Guidelines for Printed Electronics. IEC TC119 Printed Electronics Standards Technical Committee has established several Working Groups as well as Ad-hoc Groups to identify potential standards topics. Also, TC119 has involved other organizations to act as advisors during the development of standards e.g. IPC and COLAE. IEEE maintains IEEE 1620-2008 Test Methods for the Characterization of Organic Transistors and Materials and IEEE 1620.1-2012 Standard for Test Methods for the Characterization of Organic Transistor-Based Ring Oscillators. 8
Shift in Roadmap Topic Participation Movement Along Supply Chain Materials Substrates Packaging Processing/ Equipment Platforms Testing Equipment Applications 2007 Roadmap greatest participation in Materials. 2009 Roadmap greatest participation in Substrates and Processing Equipment. 2011 Roadmap greatest participation in Processing Equipment and Applications. 2013 Roadmap greatest participation in Applications and Standards. 2015 Roadmap greatest participation in Applications and Standards.
Products and Applications Lighting & Displays Sensors Energy