FEATURES High Power Low Profile Surface Mount Package Very Low Insertion Loss Excellent Amplitude and Phase Balance High Isolation RoHS Tape and Reel for High Volume Production APPLICATIONS Power Amplifiers Signal Distribution Networks Antenna Feeds Switch Networks High Power Combiners/Splitters Phase Shifters GENERAL DESCRIPTION The HDD2F is a high performance 3dB hybrid coupler in a surface mount package. This low profile coupler handles up to 200 watts of CW power. The HDD2F is designed for those demanding applications where low loss, excellent amplitude and phase balance are required. The HDD2F is manufactured with materials that have thermal expansion characteristics compatible with industry standard board materials like RO3003, RO4350, FR4 and others. The couplers are available in a RoHS complaint finish and packaged in both reel and tube. ELECTRICAL SPECIFICATIONS* 3dB HYBRID COUPLER Frequency MHz Isolation db (min) Insertion Loss db (max) VSWR Amplitude Balance db (max) Phase Error Power Handling ** Watts CW ΘJC C/Watt Operating Temperature C 800-1000 26 0.15 1.15 ± 0.30 90 ± 2 200 15-55 to +85 811-869 26 1.14 ± 0.25 90 ± 2 200 15-55 to +85 870-960 30 0.14 1.10 ± 0.20 90 ± 2 200 15-55 to +85 Specification Notes: * Measured on Florida RF Labs test fixture 008-40-077. Specifications are subject to change without notice. ** Power rating is specified at 85 C base temperature
700MHZ - 1100MHZ RF PERFORMANCE AT 25 C (78PCS) -2 COUPLING 1.4 VSWR -2.5 1.35 1.3-3 1.25 1.2-3.5 1.15-4 1.1 5-4.5 1-20 -22-24 -26-28 -30-32 -34-36 -38-40 ISOLATION -5-0.1-0.15-0.2-0.25-0.3-0.35-0.4 INSERTION LOSS 1 0.9 0.8 0.7 0.6 0.4 0.3 0.2 0.1 0 AMPLITUDE DIFFERENCE 8 7 6 5 4 3 2 1 0 PHASE ERROR 2 emct.com rflabs.com 772-286-9300
800MHZ - 1000MHZ STATISTICAL ANALYSIS AT 25 C (78PCS) 14.00 10 1 8.00 6.00 4.00 0 8 7 6 5 4 3 2 1 0.80 0.70 0.60 0 0.40 0.30 0.20-31.71-31.46 0.27 0.29 0.30 0.31 0.33 0.34 0.36 0.37 0.38 0.40 0.41 0.43 0.44 0.45 0.47 0.48 0 1 2 4 5 7 8 9 0.11 0.11 0.11 0.11 0.13 0.13 0.13 0.13 0.14 0.14 0.14 0.14 0.15 0.15 0.15-31.20-30.95-30.70-30.44-30.19-29.94-29.68-29.43-29.18-28.92-28.67-28.42-28.16-27.91-27.66-27.40-27.15-26.90-26.64-26.39 AMPLITUDE DIFFERENCE 3.5 Upper Spec Limit 0.600 2.5 1.5 INSERTION LOSS -26.14-25.88 4.5 4.0 3.5 2.5 1.5 ISOLATION 4.5 4.0 3.5 2.5 1.5 Lower Spec Limit 0.300 Mean 0.433 Standard Deviation 32 Cp 1.546 Cpk 1.372 Upper Spec Limit 0.150 Lower Spec Limit 0 Mean 4 Standard Deviation 6 Cp 1.471 Cpk 1.394 Upper Spec Limit -26.000 Lower Spec Limit -300 Mean -28.786 Standard Deviation 85 Cp 1.711 Cpk 1.589 3 emct.com rflabs.com 772-286-9300
800MHZ - 1000MHZ STATISTICAL ANALYSIS AT 25 C (78PCS) CONT D 5 45.00 4 35.00 3 25.00 2 15.00 1 5.00 1.60 1.40 1.20 0 0.80 0.60 0.40 0.20-0.76-0.64 3 3 4 4 4 5 5 6 6 6 7 7 8 8 8 9 9 1.10 1.10 1.10 1.11 1.11 1.12 1.12-1 -0.38-0.26-0.13 0.25 0.38 0 0.63 0.76 0.88 1 1.14 1.26 1.39 1.52 1.64 1.77 1.89 2 2.15 6.0 5.0 4.0 VSWR PHASE ERROR 4.5 4.0 3.5 2.5 1.5 Upper Spec Limit 1.120 Lower Spec Limit 30 Mean 74 Standard Deviation 9 Cp 1.614 Cpk 1.580 Upper Spec Limit 00 Lower Spec Limit -00 Mean 0.697 Standard Deviation 0.292 Cp 1.427 Cpk 1.367 4 emct.com rflabs.com 772-286-9300
POWER 250 POWER DERATING Power, W 200 150 100 y = -1.7391x + 347.83 183 W 50 0-55 -5 45 95 145 195 245 Base Temperature, C 5 emct.com rflabs.com 772-286-9300
COUPLER PIN CONFIGURATION AND MECHANICAL OUTLINE 6 emct.com rflabs.com 772-286-9300
MOUNTING INSTRUCTIONS To ensure proper operation, all transmission lines must have a characteristic impedance of 50Ω. Grounding is also vital for proper performance. Grounding can be improved by increasing the number of vias to minimize ground inductance. In creased vias allow for low impedance ground connection and good thermal conduction. The device is attached to the PCB by using solder paste positioned at the location where RF terminals come into contact with the trace and where the device contact ground. The coupler is then positioned in such a way that the RF terminals must come into contact and align with the PCB trace and solder. In addition, the device ground plane must align with the solder to have good connection to ground. The conventional reflow method, where controlled temperature hot air is used to cause solder reflow, is the recommended to attach the device to the PCB. The max reflow temperature should never exceed 260 C. The use of conventional irons may cause damage to the device and should be avoided. 7 emct.com rflabs.com 772-286-9300
COMMONLY USED ATTACHMENT MATERIALS Material Composition Thermal Conductivity ( Watts/cm/ C ) Melting Temperature ( C ) Gold-Tin Solder 80% Gold / 20% Tin 8 280 Lead-Free Solder 99.3% Tin 0.7% Copper N/A 227 Lead-Free Solder 96.5% Tin / 3.5% Silver 0.33 221 Lead-Free Solder 96.5% Tin / 3% Silver / % Copper N/A 217-220 Sn63 Solder 63% Tin / 37% Lead 0.49 183 Conductive Epoxy Silver Filled 1 to 0.29 N/A CIRCUIT BOARD LAYOUT In order to achieve the specified RF performance, an optimized RF test board must be used for testing this hybrid coupler. Florida RF Labs test board (008-40-077) constructed with Rogers RO3003 high frequency board material is shown below. 8 emct.com rflabs.com 772-286-9300
SOLDERING PROFILE 280 240 200 160 120 AIR COOL 80 40 RAMP-UP 160 ± 5 C 60 sec PRE-FLOW 180 ± 5 C 60 90 sec REFLOW 220 ± 5 C 60 sec PEAK 240 ± 5 C 30 sec AIR COOL 9 emct.com rflabs.com 772-286-9300