VC1. Input Match RF IN. Product Description. Ordering Information. Standard 25 piece bag Standard 2500 piece reel. GaAs HBT GaAs MESFET InGaP HBT

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3.3V, 5GHz LINEAR POWER AMPLIFIER Package Style: QFN, 8-Pin, 2.2mmx2.2mmx0.45mm Features Single Supply Voltage 3.0V to 5.0V No external matching components 28dB Typical Gain Across Band P OUT =17dBm@<4% TYP EVM across Operating Band 4900MHz to 5850MHz Frequency Range Applications IEEE802.11a/n and IEEE802.16e Applications HyperLAN WiFi Systems Commercial and Consumer Systems Portable Battery-Powered Equipment Spread-Spectrum and MMDS Systems VC1 RF IN Product Description Ordering Information 8 1 6 Input VC2 2 5 3 VREG Interstage Bias Interstage VC3 Functional Block Diagram 7 4 PDETECT Output RF OUT RF OUT The RF5355 is a linear, medium-power, high-efficiency power amplifier IC designed specifically for battery-powered WiFi applications such as PC cards, mini PCI, and compact flash applications. It is also designed to meet IEEE802.11a, IEEE802.11n, IEEE802.16e (4.9GHz to 5.850GHz only) WiMax, FCC, and ETSI requirements for operation in the 4.9GHz to 5.850GHz band. The device is manufactured on an advanced InGap GaAs Heterojunction Bipolar Transistor process, and has been designed for use as the final RF amplifier in 5GHz WiFi and other spread-spectrum transmitters. The device is provided in a QFN, 8-pin, 2.2mmx2.2mmx0.45mm, leadless chip carrier with backside ground. The RF5355 operates from a single supply and will be easily incorporated into WiFi and other designs with minimal external components. RF5355 RF5355SR RF5355TR7 RF5355PCK-410 Standard 25 piece bag Standard 100 piece reel Standard 2500 piece reel Fully Assembled Evaluation Board and 5 loose sample pieces. Optimum Technology ing Applied GaAs HBT GaAs MESFET InGaP HBT SiGe BiCMOS Si BiCMOS SiGe HBT GaAs phemt Si CMOS Si BJT GaN HEMT RF MEMS LDMOS RF MICRO DEVICES, RFMD, Optimum Technology ing, Enabling Wireless Connectivity, PowerStar, POLARIS TOTAL RADIO and UltimateBlue are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. 2006, RF Micro Devices, Inc. 1 of 11

Absolute Maximum Ratings Parameter Rating Unit Caution! ESD sensitive device. Supply Voltage (No RF Applied) -0.5 to +6.0 V DC Supply voltage (RF Applied) -0.5 to 5.25 V DC Power Control Voltage (V REG ) -0.5 to 3.5 V DC Supply Current 400 ma Input RF Power +10 dbm Operating Ambient Temperature -30 to +85 C Storage Temperature -40 to +150 C Moisture sensitivity JEDEC Level 3 Parameter Specification Min. Typ. Max. Unit Exceeding any one or a combination of the Absolute Maximum Rating conditions may cause permanent damage to the device. Extended application of Absolute Maximum Rating conditions to the device may reduce device reliability. Specified typical performance or functional operation of the device under Absolute Maximum Rating conditions is not implied. RoHS status based on EUDirective2002/95/EC (at time of this document revision). The information in this publication is believed to be accurate and reliable. However, no responsibility is assumed by RF Micro Devices, Inc. ("RFMD") for its use, nor for any infringement of patents, or other rights of third parties, resulting from its use. No license is granted by implication or otherwise under any patent or patent rights of RFMD. RFMD reserves the right to change component circuitry, recommended application circuitry and specifications at any time without prior notice. Condition T=+25 C; V CC =3.3V; V REG =2.85V; pulsed at 1% to 100% duty cycle; Freq=4.9GHz to 5.85GHz; unless otherwise Compliance noted. IEEE802.11a; IEEE802.11n; IEEE802.16e (4.9GHz to 5.85GHz) Frequency Range 4.90 5.85 GHz Lower, middle and upper U-NII Output Power 16 17 dbm -30 to +85C, over V CC range, over frequency, and nominal V REG EVM* 3 4 % RMS, mean @ P OUT =17dBm at nominal conditions. Measured with a standard IEEE802.11a waveform, 54Mbps, 64QAM. Gain At P OUT =17dBm 25 28 33 db 4.9GHz to 5.1GHz 25 28 33 db 5.15GHz to 5.35GHz 25 28 32 db 5.70GHz to 5.85GHz Gain Variance 1.5 ±db 4.9GHz to 5.850GHz, -30 C to +85 C (in any 200MHz frequency) OP1dB 25 dbm V CC =3.3V, V REG =2.85V, and using CW waveform at 5.85GHz Power Detector P OUT @8dBm 0.7 0.8 0.9 V At nominal conditions, over operating temperature P OUT @17dBm 1.4 1.6 1.7 V At nominal conditions, over operating temperature Power Added Efficiency 6.6 10.8 13.7 % At P OUT =+17dBm, over temperature -30 C to +85 C, over V CC range, and over frequency at nominal V REG Power Supply 3.0 3.3 4.0 V V REG Voltage 2.75 2.85 2.95 V Recommended Operating V REG range 3.3 V V REG should not exceed this level Current Operating 120 140 170 ma At RF P OUT =+17dBm with IEEE802.11a waveform and 54Mbps data rate over operating temperature range Quiescent 95 110 ma At nominal conditions, over operating temperature range I REG 10 ma Shutdown 5 A Output VSWR 4:1 Stable and no spurs above -47dBm 10:1 No damage *The EVM specification includes a source EVM level of 0.5% to 0.7%. 2 of 11

Parameter IEEE802.11a Spectral Mask per FCC Part 15.205 Specification Min. Typ. Max. Unit Condition -43 dbm Amplifier set up for best IEEE802.11a performance; F C =5180MHz; RF P OUT =+17dBm; T=+25 C, Measured @ 5150MHz -43 dbm Amplifier set up for best IEEE802.11a performance; F C =5320MHz; RF P OUT =+17dBm; T=+25 C, Measured @ 5350MHz Second Harmonic -14 dbm At nominal conditions, at P OUT =+17dBm, measured in 1MHz RBW with 6Mbps 11a signal, Fundamental Frequency is between 4.9GHz to 5.299GHz. -23 dbm At nominal conditions, at P OUT =+17dBm, measured in 1MHz RBW with 6Mbps 11a signal, Fundamental Frequency is between 5.3GHz to 5.85GHz. Input Return Loss -10 db Turn-on Time 0.5 1.5 S Output stable to within 90% of final gain 3 of 11

Pin Function Description Interface Schematic 1 VC1 First stage supply voltage. 2 RF IN RF input. Input is matched to 50 and DC block is provided internally. VC1 3 VREG First, second and third stage bias voltage combined on the die to one external voltage. This pin requires regulated supply for best performance. 4 PDETECT Power detector voltage is proportional to RF output power. May need external decoupling capacitor for module stability. May need external circuitry to bring output voltage to desired level. 5 RF OUT RF output is internally matched to 50 and DC-blocking capacitor of about 1.8pF to 5.6pF depending on the layout is required externally if a switch is used immediately after the PA that has DC voltage at the switch input which is the same node at the RF output of the PA. 6 RF OUT Same as pin 5. See pin 5. 7 VC3 Supply voltage for the third stage. 8 VC2 Supply voltage for the second stage. Pkg GND Ground connection. The backside of the package should be connected to the ground plane through a short path (i.e., vias under the device will be Base required). INPUT MATCH VC3 INTERSTAGE MATCH OUTPUT MATCH 4 of 11

INDEX AREA 2.20 -C- -B- -A- Package Drawing QFN, 8-Pin, 2.2x2.2x0.45mm 2 PLCS 0.10 C 2.20 Dimensions in mm. Shaded lead is pin 1. 0.65 1.20 1.00 TYP 0.10 C 2 PLCS 0.28 0.18 0.50 0.40 SEATING PLANE 0.10 MAX 0.10 M C AB 0.05 0.00 0.31 0.21 0.152 REF 5 of 11

PCB Design Requirements PCB Surface Finish The PCB surface finish used for RFMD's qualification process is electroless nickel, immersion gold. Typical thickness is 3 microinch to 8 micro-inch gold over 180 micro-inch nickel. PCB Land Pattern Recommendation * PCB land patterns for RFMD components are based on IPC-7351 standards and RFMD empirical data. The pad pattern shown has been developed and tested for optimized assembly at RFMD. The PCB land pattern has been developed to accommodate lead and package tolerances. Since surface mount processes vary from company to company, careful process development is recommended. PCB Metal Land Pattern PCB Solder Mask Pattern 6 of 11

PCB Stencil Pattern Note: Thermal vias for center slug C should be in cop orated into the PCB design. The number and size of thermal vias will depend on the application. Example of the number and size of vias can be found on the RFMD evaluation board layout. 7 of 11

Theory of Operation The RF5355 is a three-stage device with a minimum gain of 28dB in the 4.9GHz to 5.850GHz ISM band. The RF5355 is designed primarily for IEEE802.11a, IEEE802.11n, and IEEE802.16e in the 4.9GHz to 5.850GHz band where the available supply voltage and current are limited. This amplifier will operate to (and below) the lowest expected voltage made available by a typical PCMCIA slot in a laptop PC, and will maintain required linearity at decreased supply voltages. The RF5355 requires only a single positive supply of 3.3V nominal (or greater) to operate to full specifications. Power control is provided through one bias pin, V REG. The three bias voltages for the three stages are connected together on the die and only one bias control voltage is needed (V REG ). There is no external matching required on the input and output of the part, thus allowing a minimal bill of material (BOM) parts count in end applications. Both the input and the output of the device are DCblocked. For best results, the PA circuit layout from the evaluation board should be copied as closely as possible, particularly the ground layout and ground vias. Other configurations may also work, but the design process is much easier and quicker if the layout is copied from the RF5355 evaluation board. Gerber files of our designs are available on request. The RF5355 is not a difficult part to implement, but care in circuit layout and component selection is always advisable when designing circuits to operate at 5GHz. The RF5355 has primarily been characterized with a voltage on V REG of 2.85V DC. However, the RF5355 will operate from a wide range of control voltages. If you prefer to use a control voltage that is significantly different than 2.85V DC, contact RFMD Sales or Applications Engineering for additional data and guidance. 8 of 11

Evaluation Board Schematic RF5355PCBA Evaluation Board (4.9GHz to 5.85GHz) VCC J1 RF IN R1 82 C1 39 pf 50 strip R2 22 C17 1 uf C2 N/U 8 1 6 Input 2 5 C11 5.1 pf 3 VREG Interstage Bias Interstage The following components C11, R3, and C8 may be left unpopulated without degradation in performance depending on the layout. 7 4 PDETECT C6 4.7 F C5 1 nf R3 10 Output C3 N/U C8 10 pf 50 strip VCC (V) 3.0 to 4.0 4.0 V to 5.0 V P1 1 P1-2 2 PDETECT P1-3 3 VREG P1-4 4 VCC CON3 J2 RF OUT R1 ( ) 82 120 GND R2 ( ) 22 56 9 of 11

Evaluation Board Layout Board Size 1.2 x 1.2 Board Thickness 0.032, Board Material FR-4, Multi-Layer 10 of 11

EVM (%) Current (ma) IREG (ma) 10 9 8 7 6 5 4 3 2 1 0 200 180 160 140 120 100 80 60 40 20 EVM versus Output Power V CC =3.3V; V REG =2.85V; Temp=25 C 4900 (MHz) 5100 (MHz) 5400 (MHz) 5850 (MHz) 0 2 4 6 8 10 12 14 16 18 20 Output Power (dbm) 0 10.0 9.5 9.0 8.5 8.0 7.5 7.0 I CC versus Output Power V CC =3.3V; V REG =2.85V; Temp=25 C 0 5 10 15 20 Output Power (dbm) I REG versus Output Power V CC =3.3V; V REG = 2.85V; Temp=25 C 4900 (MHz) 5100 (MHz) 5400 (MHz) 5850 (MHz) Gain (db) Power Detector (V) 35 33 31 29 27 25 23 21 19 17 15 3.0 2.5 2.0 1.5 1.0 0.5 0.0 Gain versus Output Power V CC =3.3V; V REG =2.85V; Temp=25 C 4900 (MHz) 5100 (MHz) 5400 (MHz) 5850 (MHz) 0 5 10 15 20 Output Power (dbm) Power Detector versus Output Power V CC =3.3V; V REG =2.85V; Temp=25 C 4900 (MHz) 5100 (MHz) 5400 (MHz) 5850 (MHz) 0 2 4 6 8 10 12 14 16 18 20 Output Power (dbm) 6.5 6.0 5.5 5.0 4900 (MHz) 5100 (MHz) 5400 (MHz) 5850 (MHz) 0 2 4 6 8 10 12 14 16 18 20 Output Power (dbm) 11 of 11