FSBB10CH120D Motion SPM 3 Series

FSBB10CH120D Motion SPM 3 Series Features 1200 V - 10 A 3-Phase IGBT Inverter with Integral Gate Drivers and Protection Low-Loss, Short-Circuit Rated IGBTs Very Low Thermal Resistance Using Al 2 O 3 DBC Substrate Dedicated Vs Pins Simplify PCB Layout Separate Open-Emitter Pins from Low-Side IGBTs for Three-Phase Current Sensing Single-Grounded Power Supply Isolation Rating: 2500 V rms / 1 min. General Description April 2014 FSBB10CH120D is an advanced Motion SPM 3 module providing a fully-featured, high-performance inverter output stage for AC Induction, BLDC, and PMSM motors. These modules integrate optimized gate drive of the built-in IGBTs to minimize EMI and losses, while also providing multiple on-module protection features including under-voltage lockouts, over-current shutdown, and fault reporting. The built-in, high-speed HVIC requires only a single supply voltage and translates the incoming logic-level gate inputs to the highvoltage, high-current drive signals required to properly drive the module's internal IGBTs. Separate negative IGBT terminals are available for each phase to support the widest variety of control algorithms. Applications Motion Control - Industrial Motor (AC 400V Class) Related Resources AN-9044 - Motion SPM 3 Series Users Guide Figure 1. Package Overview Package Marking and Ordering Information Device Device Marking Package Packing Type Quantity FSBB10CH120D FSBB10CH120D SPMMC-027 Rail 10 2014 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com

Integrated Power Functions 1200 V - 10 A IGBT inverter for three-phase DC / AC power conversion (refer to Figure 3) Integrated Drive, Protection and System Control Functions For inverter high-side IGBTs: gate drive circuit, high-voltage isolated high-speed level shifting control circuit, Under-Voltage Lock-Out Protection (UVLO), Available bootstrap circuit example is given in Figures 5 and 14. For inverter low-side IGBTs: gate drive circuit, Short-Circuit Protection (SCP) control circuit, Under-Voltage Lock-Out Protection (UVLO) Fault signaling: corresponding to UVLO (low-side supply) and SC faults Input interface: active-high interface, works with 3.3 / 5 V logic, Schmitt-trigger input Pin Configuration Case Temperature (T C ) Detecting Point (27) P (26) W (25) V (24) U (20) V S(W) (19) V B(W) (18) V CC(WH) (17) (WH) (16) V S(V) (15) V B(V) (14) V CC(VH) (13) (VH) (12) V S(U) (11) V B(U) (10) V CC(UH) (9) (UH) (8) C SC (7) C FOD (23) N W (6) V FO (5) (WL) (22) N V (4) (VL) (3) (UL) (21) N U (2) (1) V CC(L) Figure 2. Top View 2014 Fairchild Semiconductor Corporation 2 www.fairchildsemi.com

Pin Descriptions Pin Number Pin Name Pin Description 1 V CC(L) Low-Side Common Bias Voltage for IC and IGBTs Driving 2 Common Supply Ground 3 (UL) Signal Input for Low-Side U Phase 4 (VL) Signal Input for Low-Side V Phase 5 (WL) Signal Input for Low-Side W Phase 6 V FO Fault Output 7 C FOD Capacitor for Fault Output Duration Time Selection 8 C SC Capacitor (Low-Pass Filter) for Short-Current Detection Input 9 (UH) Signal Input for High-Side U Phase 10 V CC(UH) High-Side Bias Voltage for U Phase IC 11 V B(U) High-Side Bias Voltage for U Phase IGBT Driving 12 V S(U) High-Side Bias Voltage Ground for U Phase IGBT Driving 13 (VH) Signal Input for High-Side V Phase 14 V CC(VH) High-Side Bias Voltage for V Phase IC 15 V B(V) High-Side Bias Voltage for V Phase IGBT Driving 16 V S(V) High-Side Bias Voltage Ground for V Phase IGBT Driving 17 (WH) Signal Input for High-Side W Phase 18 V CC(WH) High-Side Bias Voltage for W Phase IC 19 V B(W) High-Side Bias Voltage for W Phase IGBT Driving 20 V S(W) High-Side Bias Voltage Ground for W Phase IGBT Driving 21 N U Negative DC-Link Input for U Phase 22 N V Negative DC-Link Input for V Phase 23 N W Negative DC-Link Input for W Phase 24 U Output for U Phase 25 V Output for V Phase 26 W Output for W Phase 27 P Positive DC-Link Input 2014 Fairchild Semiconductor Corporation 3 www.fairchildsemi.com

Internal Equivalent Circuit and Input/Output Pins Figure 3. Internal Block Diagram Notes: 1. Inverter low-side is composed of three IGBTs, freewheeling diodes for each IGBT, and one control IC. It has gate drive and protection functions. 2. Inverter power side is composed of four inverter DC-link input terminals and three inverter output terminals. 3. Inverter high-side is composed of three IGBTs, freewheeling diodes, and three drive ICs for each IGBT. 2014 Fairchild Semiconductor Corporation 4 www.fairchildsemi.com

Absolute Maximum Ratings (T J = 25 C, unless otherwise specified) Inverter Part Symbol Parameter Conditions Rating Unit V PN Supply Voltage Applied between P - N U, N V, N W 900 V V PN(Surge) Supply Voltage (Surge) Applied between P - N U, N V, N W 1000 V V CES Collector - Emitter Voltage 1200 V ± I C Each IGBT Collector Current T C = 25 C, T J 150 C (Note 4) 10 A ± I CP Each IGBT Collector Current (Peak) T C = 25 C, T J 150 C, Under 1 ms Pulse Width (Note 4) Control Part 20 A P C Collector Dissipation T C = 25 C per One Chip (Note 4) 69 W T J Operating Junction Temperature -40 ~ 150 C Symbol Parameter Conditions Rating Unit V CC Control Supply Voltage Applied between V CC(H), V CC(L) - 20 V V BS High-Side Control Bias Voltage Applied between V B(U) - V S(U), V B(V) - V S(V), V B(W) - V S(W) 20 V V Input Signal Voltage Applied between (UH), (VH), (WH), (UL), (VL), (WL) - -0.3 ~ V CC +0.3 V V FO Fault Output Supply Voltage Applied between V FO - -0.3 ~ V CC +0.3 V I FO Fault Output Current Sink Current at V FO pin 2 ma V SC Current Sensing Input Voltage Applied between C SC - -0.3 ~ V CC +0.3 V Total System Symbol Parameter Conditions Rating Unit V PN(PROT) Thermal Resistance Notes: Self Protection Supply Voltage Limit (Short Circuit Protection Capability) 4. These values had been made an acquisition by the calculation considered to design factor. 5. For the measurement point of case temperature (T C ), please refer to Figure 2. V CC = V BS = 13.5 ~ 16.5 V, T J = 150 C, Non-repetitive, < 2 ms 800 V T C Module Case Operation Temperature See Figure 2-40 ~ 125 C T STG Storage Temperature -40 ~ 125 C V ISO Isolation Voltage 60 Hz, Sinusoidal, AC 1 minute, Connection Pins to Heat Sink Plate 2500 V rms Symbol Parameter Conditions Min. Typ. Max. Unit R th(j-c)q Junction-to-Case Thermal Resistance Inverter IGBT part (per 1 / 6 module) - - 1.80 C / W R th(j-c)f (Note 5) Inverter FWD part (per 1 / 6 module) - - 2.75 C / W 2014 Fairchild Semiconductor Corporation 5 www.fairchildsemi.com

Electrical Characteristics (T J = 25 C, unless otherwise specified) Inverter Part Symbol Parameter Conditions Min. Typ. Max. Unit V CE(SAT) Collector - Emitter Saturation Voltage V CC = V BS = 15 V V = 5 V I C = 10 A, T J = 25 C - 2.20 2.80 V V F FWDi Forward Voltage V = 0 V I F = 10 A, T J = 25 C - 2.20 2.80 V HS t ON Switching Times V PN = 600 V, V CC = 15 V, I C = 10 A 0.45 0.85 1.35 ms t C(ON) T J = 25 C V = 0 V «5 V, Inductive Load - 0.25 0.60 ms t OFF See Figure 5-0.95 1.50 ms t C(OFF) (Note 6) - 0.10 0.45 ms t rr - 0.25 - ms LS t ON V PN = 600 V, V CC = 15 V, I C = 10 A 0.35 0.75 1.25 ms t C(ON) T J = 25 C V = 0 V «5 V, Inductive Load - 0.20 0.55 ms t OFF See Figure 5-0.95 1.50 ms t C(OFF) (Note 6) - 0.10 0.45 ms I CES t rr - 0.20 - ms Collector - Emitter Leakage Current V CE = V CES - - 5 ma Note: 6. t ON and t OFF include the propagation delay time of the internal drive IC. t C(ON) and t C(OFF) are the switching time of IGBT itself under the given gate driving condition internally. For the detailed information, please see Figure 4. 100% I C 100% I C t rr V CE I C I C V CE V V t ON t OFF t C(ON) t C(OFF) 10% I C V (ON) 90% I C 10% V CE (a) turn-on V (OFF) 10% V CE 10% I C (b) turn-off Figure 4. Switching Time Definition 2014 Fairchild Semiconductor Corporation 6 www.fairchildsemi.com

5V 0V V HS Switching LS Switching VCC V +15V D BS RBS CBS 4.7kΩ V +5V One-Leg Diagram of SPM 3 V CC VCC V FO C FOD C SC V B V S Figure 5. Example Circuit for Switching Test P U,V,W N U,V,W LS Switching Inductor HS Switching I C V PN V 600V Figure 6. Switching Loss Characteristics (Typical) Figure 7. Allowable Maximum Output Current Note: 7. This allowable output current value is the reference data for the safe operation of this product. This may be different from the actual application and operating condition. 2014 Fairchild Semiconductor Corporation 7 www.fairchildsemi.com

Control Part Symbol Parameter Conditions Min. Typ. Max. Unit I QCCH Quiescent V CC Supply Current V CC(UH,VH,WH) = 15 V, (UH,VH,WH) = 0 V V CC(UH) -, V CC(VH) -, V CC(WH) - - - 0.15 ma I QCCL V CC(L) = 15 V, (UL,VL, WL) = 0 V V CC(L) - - - 5.00 ma I PCCH I PCCL I QBS I PBS Operating V CC Supply Current Quiescent V BS Supply Current Operating V BS Supply Current V CC(UH,VH,WH) = 15 V, f PWM = 20 khz, duty = 50%, applied to one PWM signal input for High-Side V CC(L) = 15V, f PWM = 20 khz, duty = 50%, applied to one PWM signal input for Low-Side V CC(UH) -, V CC(VH) -, V CC(WH) - V BS = 15 V, (UH, VH, WH) = 0 V V B(U) - V S(U), V B(V) - V S(V), V B(W) - V S(W) V CC = V BS = 15 V, f PWM = 20 khz, duty = 50%, applied to one PWM signal input for High-Side - - 0.30 ma V CC(L) - - - 8.50 ma V B(U) - V S(U), V B(V) - V S(V), V B(W) - V S(W) - - 0.30 ma - - 4.50 ma V FOH Fault Output Voltage V CC = 15 V, V SC = 0 V, V FO Circuit: 4.7 kw to 5 V Pull-up 4.5 - - V V FOL V CC = 15 V, V SC = 1 V, V FO Circuit: 4.7 kw to 5 V Pull-up - - 0.5 V V SC(ref) Short Circuit Trip Level V CC = 15 V (Note 8) C SC - 0.43 0.50 0.57 V UV CCD Supply Circuit Under- Detection Level 10.3-12.8 V UV CCR Voltage Protection Reset Level 10.8-13.3 V UV BSD Detection Level 9.5-12.0 V UV BSR Reset Level 10.0-12.5 V t FOD Fault-Out Pulse Width C FOD = open (Note 9) 50 - - ms C FOD = 2.2 nf 1.7 - - ms V (ON) ON Threshold Voltage Applied between (UH, VH, WH) -, (UL, VL, WL) - - - 2.6 V V (OFF) OFF Threshold Voltage 0.8 - - V Notes: 8. Short-circuit current protection is functioning only at the low-sides. 9. The fault-out pulse width t FOD depends on the capacitance value of C FOD according to the following approximate equation : t FOD = 0.8 x 10 6 x C FOD [s]. Recommended Operating Conditions Symbol Parameter Conditions Note: 10. This product might not make output response if input pulse width is less than the recommanded value. Value Min. Typ. Max. V PN Supply Voltage Applied between P - N U, N V, N W 300 600 800 V V CC Control Supply Voltage Applied between V CC(UH, VH, WH) -, V CC(L) - 13.5 15.0 16.5 V V BS High-Side Bias Voltage Applied between V B(U) - V S(U), V B(V) - V S(V), V B(W) - V S(W) 13.0 15.0 18.5 V dv CC / dt, dv BS / dt t dead Control Supply Variation Blanking Time for Preventing Arm - Short Unit -1-1 V / ms For Each Input Signal 2.0 - - ms f PWM PWM Input Signal -40 C T C 125 C, -40 C T J 150 C - - 20 khz V SEN Voltage for Current Sensing Applied between N U, N V, N W - (Including Surge Voltage) -5 5 V PW (ON) Minimun Input Pulse I C 20 A, Wiring Inductance between N U, V, W and DC Link 1.5 - - ms PW (OFF) Width N < 10nH (Note 10) 1.5 - - T J Junction Temperature -40-150 C 2014 Fairchild Semiconductor Corporation 8 www.fairchildsemi.com

Mechanical Characteristics and Ratings Parameter Conditions Limits Min. Typ. Max. Unit Device Flatness See Figure 8 0 - +150 mm Mounting Torque Mounting Screw: M3 Recommended 0.7 N m 0.6 0.7 0.8 N m See Figure 9 Recommended 7.1 kg cm 6.2 7.1 8.1 kg cm Terminal Pulling Strength Load 19.6 N 10 - - s Terminal Bending Strength Load 9.8 N, 90 deg. bend 2 - - times Weight - 15 - g ( + ) ( + ) Figure 8. Flatness Measurement Position 2 Pre - Screwing : 1 2 Final Screwing : 2 1 1 Note: Figure 9. Mounting Screws Torque Order 11. Do not make over torque when mounting screws. Much mounting torque may cause DBC cracks, as well as bolts and Al heat-sink destruction. 12. Avoid one-side tightening stress. Figure 9 shows the recommended torque order for mounting screws. Uneven mounting can cause the ceramic substrate of package to be damaged. The pre-screwing torque is set to 20 ~ 30% of maximum torque rating. 2014 Fairchild Semiconductor Corporation 9 www.fairchildsemi.com

Time Charts of SPMs Protective Function Input Signal Protection Circuit State Control Supply Voltage Output Current Fault Output Signal UV CCR RESET a1 a2 UV CCD SET a3 a4 a5 RESET a6 a7 Figure 10. Under-Voltage Protection (Low-Side) a1 : Control supply voltage rises: After the voltage rises UV CCR, the circuits start to operate when next input is applied. a2 : Normal operation: IGBT ON and carrying current. a3 : Under-voltage detection (UV CCD ). a4 : IGBT OFF in spite of control input condition. a5 : Fault output operation starts with a fixed pulse width according to the condition of the external capacitor C FOD. a6 : Under-voltage reset (UV CCR ). a7 : Normal operation: IGBT ON and carrying current by triggering next signal from LOW to HIGH. Input Signal Protection Circuit State RESET SET RESET Control Supply Voltage UV BSR b1 b2 UV BSD b3 b4 b5 b6 Output Current Fault Output Signal High-level (no fault output) Figure 11. Under-Voltage Protection (High-Side) b1 : Control supply voltage rises: After the voltage reaches UV BSR, the circuits start to operate when next input is applied. b2 : Normal operation: IGBT ON and carrying current. b3 : Under-voltage detection (UV BSD ). b4 : IGBT OFF in spite of control input condition, but there is no fault output signal. b5 : Under-voltage reset (UV BSR ). b6 : Normal operation: IGBT ON and carrying current by triggering next signal from LOW to HIGH. 2014 Fairchild Semiconductor Corporation 10 www.fairchildsemi.com

Lower arms control input Protection Circuit state SET RESET Internal IGBT Gate-Emitter Voltage Output Current Sensing Voltage of sense resistor SC current trip level c1 c6 c4 c3 c2 Internal delay at protection circuit c7 SC Reference Voltage c8 Fault Output Signal c5 RC Filter circuit time constant delay Figure 12. Short-Circuit Current Protection (Low-Side Operation only) (with the external sense resistance and RC filter connection) c1 : Normal operation: IGBT ON and carrying current. c2 : Short circuit current detection (SC trigger). c3 : All low-side IGBT s gate are hard interrupted. c4 : All low-side IGBTs turn OFF. c5 : Fault output operation starts with a fixed pulse width. c6 : Input HIGH: IGBT ON state, but during the active period of fault output the IGBT doesn t turn ON. c7 : Fault output operation finishes, but IGBT doesn t turn on until triggering next signal from LOW to HIGH. c8 : Normal operation: IGBT ON and carrying current. Input/Output Interface Circuit +5V (MCU or Control power ) 4.7 kω SPM,, (UH) (VH) (WH) MCU,, (UL) (VL) (WL) V FO Note: Figure 13. Recommended MCU I/O Interface Circuit 13. RC coupling at each input (parts shown dotted) might change depending on the PWM control scheme used in the application and the wiring impedance of the application s printed circuit board. The input signal section of the Motion SPM 3 product integrates 5 kw (typ.) pull-down resistor. Therefore, when using an external filtering resistor, please pay attention to the signal voltage drop at input terminal. 2014 Fairchild Semiconductor Corporation 11 www.fairchildsemi.com

M C U Gating WH Gating VH Gating UH Fault R1 R1 R1 C 1 R1 C1 C1 5 V line R3 B R2 R2 R2 C4 D1 C3 C4 D 2 C4 D1 C3 C4 D 2 C 4 D1 C3 C4 D2 R 6 C6 D C5 (17) ( WH) (18) VCC( WH ) (19) VB(W) (20) VS(W) (13) ( VH) (14) VCC( VH ) (15) VB(V) (16) VS(V) (9) I N( UH) (10) VCC( UH ) (11) VB(U) (12) VS( U) (8) CSC (7) CFOD (6) VFO VCC V B VCC V B V CC VB CSC CFOD V FO VS VS VS P (27) W (26) V (25) U (24) NW (23) R 4 M A C 7 V DC Gating WL Gating VL Gating UL R1 R1 R 1 C1 C1 C1 C1 C 1 15 V line (5) (WL) (4) (VL) (3) (UL) (2) (1) VCC( L) VCC NV (22) NU (21) R4 R 4 E Power GND Line D2 C2 C4 Input Signal for Short-Circuit Protection W-Phase Current V-Phase Current U-Phase Current C R5 R5 R5 Control GND Line C5 C5 C5 Notes: Figure 14. Typical Application Circuit 14. To avoid malfunction, the wiring of each input should be as short as possible. (less than 2-3 cm) 15. V FO output is open-drain type. This signal line should be pulled up to the positive side of the MCU or control power supply with a resistor that makes I FO up to 2 ma. Please refer to Figure 14. 16. Fault out pulse width can be adjust by capacitor C 5 connected to the C FOD terminal. 17. Input signal is active-high type. There is a 5 kw resistor inside the IC to pull-down each input signal line to GND. RC coupling circuits should be adopted for the prevention of input signal oscillation. R 1 C 1 time constant should be selected in the range 50 ~ 150 ns. (recommended R 1 = 100 Ω, C 1 = 1 nf) 18. Each wiring pattern inductance of point A should be minimized (recommend less than 10 nh). Use the shunt resistor R 4 of surface mounted (SMD) type to reduce wiring inductance. To prevent malfunction, wiring of point E should be connected to the terminal of the shunt resistor R 4 as close as possible. 19. To prevent errors of the protection function, the wiring of B, C, and D point should be as short as possible. 20. In the short-circuit protection circuit, select the R 6 C 6 time constant in the range 1.0 ~ 1.5 ms. Do enough evaluaiton on the real system because short-circuit protection time may vary wiring pattern layout and value of the R 6 C 6 time constant. 21. Each capacitor should be mounted as close to the pins of the Motion SPM 3 product as possible. 22. To prevent surge destruction, the wiring between the smoothing capacitor C 7 and the P & GND pins should be as short as possible. The use of a high-frequency non-inductive capacitor of around 0.1 ~ 0.22 mf between the P & GND pins is recommended. 23. Relays are used in most systems of electrical equipments in industrial application. In these cases, there should be sufficient distance between the MCU and the relays. 24. The Zener diode or transient voltage suppressor D 2 should be adapted for the protection of ICs from the surge destruction between each pair of control supply terminals (recommanded Zener diode is 22 V / 1 W, which has the lower Zener impedance characteristic than about 15 Ω). 25. Boostrap capacitor C 3 and Bootstrap resistor R 2 values depend on PWM control algorithm. And, C 2 of around seven times larger than bootstrap capacitor C 3 is recommended. 26. Please choose the electrolytic capacitor with good temperature characteristic in C 3. Choose 0.1 ~ 0.2 mf R-category ceramic capacitors with good temperature and frequency characteristics in C 4. 27. Use the bootstrap diode D 1 which has high voltage(v RRM = 1200 V or more), soft, and fast recovery(t RR = less than 100 ns) characteristics. 2014 Fairchild Semiconductor Corporation 12 www.fairchildsemi.com

Detailed Package Outline Drawings (FSBB10CH120D) Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or data on the drawing and contact a FairchildSemiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild s worldwide therm and conditions, specifically the the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/dwg/mo/mod27ba.pdf 2014 Fairchild Semiconductor Corporation 13 www.fairchildsemi.com

2014 Fairchild Semiconductor Corporation 14 www.fairchildsemi.com