Product Data Sheet 6N135-L / 6N136-L series Spec No.: DS70-2008-0032 Effective Date: 04/12/2016 Revision: A LITE-ON DCC RELEASE BNS-OD-FC001/A4 LITE-ON Technology Corp. / Optoelectronics No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C. Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660 http://www.liteon.com/opto
1. DESCRIPTION The 6N135/ 6N136-L consists of a high efficient AlGaAs Light Emitting Diode and a high speed optical detector. This design provides excellent AC and DC isolation between the input and output sides of the Optocoupler. Connection for the bias of the photodiode improves the speed that of a conventional phototransistor coupler by reducing the base-collector capacitances. The internal shield ensures high common mode transient immunity. A guaranteed common mode transient immunity is up to 1KV/μsec. 1.1 Features High speed 1MBd typical Available in Dual-in-line, Wide lead spacing, Surface mounting package. Storable output. UL, CSA approval 1.2 Applications Isolation in line receivers Digital isolation for A/D, D/A conversion Ground loop elimination Feedback Element in Switching Mode Power Supplier Pulse transformer replacement Power transistor isolation in motor drives Interface between Microprocessor system, computer and their peripheral 1.3 Functional Diagram Truth Table (Positive Logic) LED ON OFF OUT L H A 0.1μF bypass Capacitor must be connected between Pin8 and Pin5 1/15 Part No. :
2. PACKAGE DIMENSIONS 2.1 6N135-L 2.2 6N135M-L 2.3 6N135S-L Notes : 1. Year date code. 2. 2-digit work week. 3. Factory identification mark shall be marked (Y: Thailand, W: China-CZ) 4. For VDE option. Dimensions in millimeters (inches). 2/15 Part No. :
2.4 6N136-L 2.5 6N136M-L 2.6 6N136S-L Notes : 1. Year date code. 2. 2-digit work week. 3. Factory identification mark shall be marked (Y: Thailand, W: China-CZ) 4. For VDE option. Dimensions in millimeters (inches). 3/15 Part No. :
3. TAPING DIMENSIONS 3.1 6N135S-TA-L/ 6N136S-TA-L 3.2 6N135S-TA1-L/ 6N136S-TA1-L Description Symbol Dimension in mm (inch) Tape wide W 16±0.3 (0.63) Pitch of sprocket holes P 0 4±0.1 (0.15) F 7.5±0.1 (0.295) Distance of compartment P 2 2±0.1 (0.079) Distance of compartment to compartment P 1 12±0.1 (0.472) 3.3 Quantities Per Reel Package Type TA / TA1 Quantities (pcs) 1000 4/15 Part No. :
4. RATING AND CHARACTERISTICS 4.1 Absolute Maximum Ratings at Ta=25 C *1 Parameter Symbol Rating Unit Note Average Forward Input Current I F 25 ma 2 Input Reverse Input Voltage V R 5 V Power Dissipation P I 45 mw Junction temperature T J 125 o C Output Collector Current I O 8 ma Output Output Collector Voltage V O 20 V Output Collector Power Dissipation P o 100 mw Junction temperature T J 125 o C Isolation Voltage V ISO 5000 V rms Supply Voltage V CC 15 V Operating Temperature T opr -40 ~ +85 Storage Temperature T stg -55 ~ +125 Lead Solder Temperature *2 T sol 260 o C o C o C 1. Ambient temperature = 25 o C, unless otherwise specified. Stresses exceeding the absolute maximum ratings can cause permanent damage to the device. Exposure to absolute maximum ratings for long periods of time can adversely affect reliability. 2. 260 o C for 10 seconds. Refer to Lead Free Reflow Profile. 5/15 Part No. :
4.2 ELECTRICAL OPTICAL CHARACTERISTICS at T A = 25 C Input Parameters Test Condition Symbol Device Min Typ Max Units Input Forward Voltage I F =16mA, T A=25 V F 6N135 1.4 1.7 V Input Reverse Voltage I R = 10μA T A=25 BV R 6N136 5 - - V Detector Current transfer ratio I F=16mA; Vo=0.4V; V CC=4.5V; T A=25 CTR 6N135 7 18 50 6N136 19 24 50 % Logic low output voltage I F=16mA;Vcc=4.5V; I o=1.1ma; T A=25 I F=16mA;Vcc=4.5V; I o=3ma; T A=25 V OL 6N135-0.18 0.4 6N136-0.25 0.4 V Logic high output current I F=0mA, Vo=Vcc=5.5V; T A=25 6N135 - - 0.5 I OH I F=0mA, Vo=Vcc=15V; T A=25 6N136 - - 1 μa Logic low supply current I F=16mA, V o=open (Vcc=15V) I ccl 6N135 6N136-400 - μa Logic high supply current I F=0mA, V o=open ; T A=25 (Vcc=15V) I cch 6N135 6N136 - - 1 μa * All Typical at T A =25 o C. 6/15 Part No. :
5. SWITCHING SPECIFICATION Parameter Test Condition Symbol Device Min Typ Max Units Propagation Delay Time to Low Output Level T A=25 (R L=4.1KΩ, I F=16mA) T A=25 (R L=1.9KΩ, I F=16mA) t PHL 6N135-0.09 1.5 6N136-0.1 0.8 μs Propagation Delay Time to High Output Level T A=25 (R L=4.1KΩ, I F=16mA) T A=25 (R L=1.9KΩ, I F=16mA) t PLH 6N135-0.8 1.5 6N136-0.4 0.8 μs Logic High Common Mode Transient Immunity I F=0mA;V CM=10Vp-p; R L=4.1KΩ; T A=25C I F=0mA;V CM=10Vp-p; R L=1.9KΩ; T A=25C CM H 6N135 6N136 1 10 - KV/μs KV/μs Logic Low Common Mode Transient Immunity I F=0mA;V CM=10Vp-p; R L=4.1KΩ; T A=25C I F=0mA;V CM=10Vp-p; R L=1.9KΩ; T A=25C CM L 6N135 6N136 1 10 - KV/μs KV/μs * T A=0~70, Vcc=5V, unless otherwise specified. * All Typical at T A =25 o C 7/15 Part No. :
6. ISOLATION CHARACTERISTIC Parameter Symbol Min. Typ. Max. Unit Test Condition Input-Output Insulation Leakage Current I I-O 1.0 μa 45% RH, t = 5s, V I-O = 3kV DC, T A =25 o C Withstand Insulation Test Voltage V ISO 5000 V RMS RH 50%, t = 1min, T A = 25 o C Input-Output Resistance R I-O 10 12 Ω V I-O = 500V DC *All Typical at T A =25 o C Notes 1. A 0.1µF or bigger bypass capacitor for V CC is needed as shown in Fig.1 2. Current Transfer Ratio is defined as the ratio of output collector current Io, to the forward LED input current IF, times 100. 3. The 1.9KΩ load represents 1TTL unit load of 1.6mA and the 5.6KΩ pull-up resistor. 4. The 4.1KΩ load represents 1LSTTL unit load of 0.36mA and the 6.1KΩ pull-up resistor. 8/15 Part No. :
7. SWITCHING TIME TEST CIRCUIT Figure 1: Test Circuit for t PHL and t PLH Figure 2: Single Channel Test Circuit for Common Mode Transient Immunity 9/15 Part No. :
8. CHARACTERISTIC CURVES Figure 3: DC and pulsed transfer characteristics Figure 6: Current transfer ratio vs. input current Figure 4: Input current vs. forward voltage Figure 7: Current transfer ratio vs. temperature Figure 5: Logic high output current vs. temperature Figure 8: Small-signal current transfer ratio vs. quiescent current 10/15 Part No. :
Figure 9: Propagation delay time vs. temperature Figure 10: Propagation delay time vs. load resistance 11/15 Part No. :
Temperature ( C) Photocoupler 9. TEMPERATURE PROFILE OF SOLDERING 9.1 IR Reflow soldering (JEDEC-STD-020C compliant) One time soldering reflow is recommended within the condition of temperature and time profile shown below. Do not solder more than three times. Profile item Conditions Preheat - Temperature Min (T Smin) - Temperature Max (T Smax) - Time (min to max) (ts) 150 C 200 C 90±30 sec Soldering zone - Temperature (T L) - Time (t L) Peak Temperature (T P) Ramp-up rate Ramp-down rate 217 C 60 ~ 100 sec 260 C 3 C / sec max. 3~6 C / sec Ramp-up TL 217 C Tsmax 200 C 20 sec TP 260 C Ramp-down Tsmin 150 C 60-100 sec tl (Soldering) 25 C 60 ~ 120 sec ts (Preheat) Time (sec) 12/15 Part No. :
9.2 Wave soldering (JEDEC22A111 compliant) One time soldering is recommended within the condition of temperature. Temperature: 260+0/-5 C Time: 10 sec. Preheat temperature:25 to 140 C Preheat time: 30 to 80 sec. 9.3 Hand soldering by soldering iron Allow single lead soldering in every single process. One time soldering is recommended. Temperature: 380+0/-5 C Time: 3 sec max. 13/15 Part No. :
10. RECOMMENDED FOOT PRINT PATTERNS (MOUNT PAD) Note : Dimensions in millimeters. 14/15 Part No. :
11. NAMING RULE Photocoupler 6N13X (1)-(2) -L DEVICE PART NUMBER Classified by Electrical Characteristics Please refer to the table on Page: P6 (1) No suffix = Dual-in-Line package M = Wide lead spacing package S = Surface mounting package (2) TAPING TYPE (TA, TA1) Please refer to orientation of taping on Page: P4 (3) Liteon P/N Example : 6N135S-TA1-L, 6N136S-TA1-L 6N13X (1)(2)-V -L DEVICE PART NUMBER Classified by Electrical Characteristics Please refer to the table on Page: P6 (1) No suffix = Dual-in-Line package M = Wide lead spacing package S = Surface mounting package (2) TAPING TYPE (TA, TA1) Please refer to orientation of taping on Page: P4 (3) VDE Option (4) Liteon P/N Example : 6N135STA1-V-L, 6N136STA1-V-L 12. NOTES LiteOn is continually improving the quality, reliability, function or design and LiteOn reserves the right to make changes without further notices. The products shown in this publication are designed for the general use in electronic applications such as office automation equipment, communications devices, audio/visual equipment, electrical application and instrumentation. For equipment/devices where high reliability or safety is required, such as space applications, nuclear power control equipment, medical equipment, etc, please contact our sales representatives. When requiring a device for any specific application, please contact our sales in advice. If there are any questions about the contents of this publication, please contact us at your convenience. The contents described herein are subject to change without prior notice. Immerge unit s body in solder paste is not recommended. 15/15 Part No. :