AVAILABLE OPTIONS PACKAGE SMALL OUTLINE (D) The D package is available taped and reeled. Add the suffix R to the device type (i.e., LT1030CDR).

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LT1030C QUADRUPLE LOW-POWER LINE DRIVER Low Supply Voltage... ±5 V to ±15 V Supply Current...500 µa Typical Zero Supply Current When Shut Down Outputs Can Be Driven ±30 V Output Open When Off (3-State) 10-mA Output Drive Outputs of Several Devices Can Be Connected in Parallel Meets or Exceeds the Requirements of ANSI EIA/TIA-232-F Specifications Designed to Be Interchangeable With Linear Technology LT1030 V CC IN1 OUT1 ON/OFF IN2 OUT2 GND SLLS048F APRIL 1989 REVISED APRIL 1998 D OR N PACKAGE (TOP VIEW) 1 2 3 4 5 6 7 14 13 12 11 10 9 8 NC No internal connection V CC+ STROBE IN4 OUT4 NC IN3 OUT3 description The LT1030C is an EIA/TIA-232-F line driver that operates over a ±5-V to ±15-V supply-voltage range on low supply current. The device can be shut down to zero supply current. Current limiting fully protects the outputs from externally applied voltages of ±30 V. Since the output swings to within 200 mv of the positive supply and to within 1 V of the negative supply, supply-voltage requirements are minimized. A major advantage of the LT1030C is the high-impedance output state when the device is off or powered down. This feature allows several different drivers on the same bus. The device can be used as an EIA/TIA-232-F driver, micropower interface, or level translator, among others. The LT1030C is characterized for operation from 0 C to 70 C. AVAILABLE OPTIONS PACKAGE SMALL OUTLINE (D) LT1030CD PLASTIC DIP (N) LT1030CN The D package is available taped and reeled. Add the suffix R to the device type (i.e., LT1030CDR). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright 1998, Texas Instruments Incorporated POST OFFICE BOX 655303 DALLAS, TEXAS 75265 1

LT1030C QUADRUPLE LOW-POWER LINE DRIVER SLLS048F APRIL 1989 REVISED APRIL 1998 logic symbol STROBE ON/OFF 13 4 G1 EN IN1 IN2 IN3 IN4 2 5 9 12 1 3 6 8 11 OUT1 OUT2 OUT3 OUT4 This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. logic diagram ON/OFF 4 STROBE IN1 13 2 3 OUT1 IN2 5 6 OUT2 IN3 9 8 OUT3 IN4 12 11 OUT4 TERMINAL NAME NO. GND 7 Ground terminal IN1 IN2 IN3 IN4 2 5 9 12 ON/OFF 4 OUT1 OUT2 OUT3 OUT4 3 6 8 11 Terminal Functions DESCRIPTION Logic inputs. INx operate properly on TTL or CMOS levels. Output valid from VI = VCC + 2 V to 15 V. Connect to 5 V when not used. ON/OFF shuts down the entire circuit. It cannot be left open. For normally on operation, connect between 5 V and 10 V. If VIL is at or near 0.8 V, significant settling time may be required. Line driver outputs STROBE 13 STROBE forces all outputs low. Drive with 3 V. Strobe terminal input impedance is approximately 2 kω to GND. Leave STROBE open when not used. VCC+ 14 Positive supply VCC 1 Negative supply 2 POST OFFICE BOX 655303 DALLAS, TEXAS 75265

LT1030C QUADRUPLE LOW-POWER LINE DRIVER SLLS048F APRIL 1989 REVISED APRIL 1998 absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, V CC+ (see Note 1)............................................... 0 V to 15 V Supply voltage range, V CC.......................................................... 0 V to 15 V Input voltage range, logic inputs, V I.................................................. V CC to 25 V Input voltage range at ON/OFF, V I..................................................... 0 V to 12 V Output voltage range, V O (any output).................................. V CC+ 30 V to V CC + 30 V Duration of output short circuit to ±30 V at (or below) 25 C (see Note 2)....................... Unlimited Package thermal impedance, θ JA (see Note 3): D package.................................. 127 C/W N package................................... 78 C/W Storage temperature range, T stg................................................... 65 C to 150 C Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds............................... 260 C Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltage values, except differential voltages, are with respect to GND. 2. The output may be shorted to either supply. Temperature and/or supply voltages must be limited to ensure that the maximum dissipation rating is not exceeded. 3. The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace length of zero. recommended operating conditions MIN MAX UNIT Supply voltage, VCC+ 5 15 V Supply voltage, VCC 5 15 V High-level input voltage, VIH (see Note 4) 2 15 V Low-level input voltage, VIL (see Note 4) 0.8 V Operating free-air temperature, TA 0 70 C NOTE 4: These VIH and VIL specifications apply only for inputs IN1 IN4. For operating levels for ON/OFF, see Figure 2. electrical characteristics over operating free-air temperature range, V CC± = ±5 V to ±15 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VOM+ Maximum positive peak output voltage swing IO = 2 ma, TA = 25 C VCC+ 0.3 VCC+ 0.1 V VOM Maximum negative peak output voltage swing IO = 2 ma, TA = 25 C VCC +0.9 VCC +1.4 V IIH High-level input current VI 2 V, TA = 25 C 2 20 µa IIL Low-level input current VI 0.8 V, TA = 25 C 10 20 µa II Input current, ON/OFF VI = 0 0.1 10 VI = 5 V 30 65 IO Output current TA = 25 C 5 12 ma IOZ Off-state output current VO = ±15 V, TA = 25 C, ON/OFF at 0.4 V µa ±2 ±100 µa ICC Supply current (all outputs low) VI at 2.4 V, IO = 0 500 1000 µa ICC(off) Off-state supply current All typical values are at, TA = 25 C. ON/OFF at 0.4 V 10 ON/OFF at 0.1 V 10 150 µa POST OFFICE BOX 655303 DALLAS, TEXAS 75265 3

LT1030C QUADRUPLE LOW-POWER LINE DRIVER SLLS048F APRIL 1989 REVISED APRIL 1998 operating characteristics, V CC± = ±5 V to ±15 V, T A = 25 C PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SR Driver slew rate RL = 3 kω, CL = 51 pf 4 15 30 V/µs All typical values are at, TA = 25 C. TYPICAL CHARACTERISTICS VOM Maximum Peak Output Voltage V VCC+ VCC+ 0.2 VCC+ 0.4 VCC +1.4 VCC +1.2 VCC +1 VCC +0.8 VCC +0.6 VCC +0.4 MAXIMUM PEAK OUTPUT VOLTAGE OUTPUT CURRENT Figure 1 Output High Output Low VCC +0.2 TA = 25 C VCC 0 ±1 ±2 ±3 ±4 ±5 IO Output Current ma ON/OFF Terminal Voltage V 1.8 1.6 1.4 1.2 1 0.8 0.6 0.4 0.2 ON/OFF TERMINAL VOLTAGE FREE-AIR TEMPERATURE Max Off Voltage IO < 20 µa GND 0 10 20 30 40 50 60 70 TA Free-Air Temperature C Figure 2 RL = 3 kω Min On Voltage Max Off Voltage IO < 200 µa 4 POST OFFICE BOX 655303 DALLAS, TEXAS 75265

LT1030C QUADRUPLE LOW-POWER LINE DRIVER TYPICAL CHARACTERISTICS SLLS048F APRIL 1989 REVISED APRIL 1998 VOM Maximum Peak Output Voltage V VCC+ VCC+ 0.2 VCC+ 0.4 VCC +1.4 VCC +1.2 VCC +1 VCC +0.8 VCC +0.6 MAXIMUM PEAK OUTPUT VOLTAGE FREE-AIR TEMPERATURE IO = 1 ma IO = 5 ma IO = 5 ma IO = 1 ma 0 10 20 30 40 50 60 70 TA Free-Air Temperature C Figure 3 ON/OFF Terminal Current µ A 140 120 100 80 60 40 20 0 ON/OFF TERMINAL CURRENT ON/OFF TERMINAL VOLTAGE TA = 25 C 20 0 2.5 5 7.5 10 12.5 15 ON/OFF Terminal Voltage V Figure 4 TYPICAL CHARACTERISTICS IO Output Current ma 30 27.5 25 22.5 20 17.5 Sourcing OUTPUT CURRENT FREE-AIR TEMPERATURE Sinking I OZ ICC Off-State Output Current µ A 1 0.1 OFF-STATE OUTPUT CURRENT FREE-AIR TEMPERATURE VO = 25 V 15 0 10 20 30 40 50 60 70 TA Free-Air Temperature C Figure 5 0.01 25 30 35 40 45 50 55 60 65 70 TA Free-Air Temperature C Figure 6 POST OFFICE BOX 655303 DALLAS, TEXAS 75265 5

LT1030C QUADRUPLE LOW-POWER LINE DRIVER SLLS048F APRIL 1989 REVISED APRIL 1998 TYPICAL CHARACTERISTICS ICC(off) ICCoff Off-State Supply Current µ A 0.1 0.07 0.05 0.03 ÁÁÁ ÁÁÁ OFF-STATE SUPPLY CURRENT FREE-AIR TEMPERATURE ON/OFF at 0.4 V ICC Supply Current ma 5 4.5 4 3.5 3 2.5 2 1.5 1 0.5 TA = 25 C SUPPLY CURRENT TOTAL SUPPLY VOLTAGE All Outputs High All Outputs Low 0.01 45 50 55 60 65 70 TA Free-Air Temperature C 0 10 12.5 15 17.5 20 22.5 25 27.5 VCC+ VCC Total Supply Voltage V 30 Figure 7 Figure 8 TYPICAL CHARACTERISTICS ICC I Supply Current m ma A 4 3.5 3 2.5 2 1.5 1 SUPPLY CURRENT FREE-AIR TEMPERATURE All Outputs High SR Slew Rate V/us µ s 17 16 15 14 SLEW RATE FREE-AIR TEMPERATURE RL = 3 kω CL = 51 pf Falling Rising 0.5 All Outputs Low 0 0 10 20 30 40 50 TA Free-Air Temperature C Figure 9 60 70 13 0 10 20 30 40 50 60 70 TA Free-Air Temperature C Figure 10 6 POST OFFICE BOX 655303 DALLAS, TEXAS 75265

LT1030C QUADRUPLE LOW-POWER LINE DRIVER APPLICATION INFORMATION SLLS048F APRIL 1989 REVISED APRIL 1998 forward biasing the substrate As with other bipolar integrated circuits, forward biasing the substrate diode can cause problems. The LT1030C draws high current from V CC+ to GND when V CC is open circuited or pulled above ground. Connecting a diode from V CC to GND (if possible) prevents the high-current state. Any low-cost diode can be used (see Figure 11). LT1030C 1 14 1N4001 7 8 Figure 11. Connecting a Diode From V CC to GND POST OFFICE BOX 655303 DALLAS, TEXAS 75265 7

PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan LT1030CD ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) LT1030CDG4 ACTIVE SOIC D 14 50 Green (RoHS & no Sb/Br) LT1030CDR ACTIVE SOIC D 14 2500 Green (RoHS & no Sb/Br) LT1030CN ACTIVE PDIP N 14 25 Green (RoHS & no Sb/Br) (2) Lead/Ball Finish (6) MSL Peak Temp (3) Op Temp ( C) Device Marking (4/5) CU NIPDAU Level-2-260C-1 YEAR 0 to 70 LT1030C CU NIPDAU Level-2-260C-1 YEAR 0 to 70 LT1030C CU NIPDAU Level-2-260C-1 YEAR 0 to 70 LT1030C CU NIPDAU N / A for Pkg Type 0 to 70 LT1030CN Samples (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and Addendum-Page 1

PACKAGE OPTION ADDENDUM www.ti.com 24-Aug-2018 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2

PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant LT1030CDR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1 Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LT1030CDR SOIC D 14 2500 367.0 367.0 38.0 Pack Materials-Page 2

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