TGA FL 2.5 to 6GHz 40W GaN Power Amplifier

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2.5 to 6GHz 4W GaN Power Amplifier Applications Communications Electronic Warfare Test Instrumentation EMC Amplifier Product Features Frequency Range: 2.5 to 6 GHz P SAT : 46.5 dbm @ PIN = 26dBm, CW PAE: 36% Small Signal Gain: 29 db Bias: V D = 3 V, I DQ = 1.55 A, V G = 2.5 V Typical Dimensions: 11.4 x 17.3 x 3. mm. Functional Block Diagram 1 2 3 1 9 4 5 6 7 General Description TriQuint s TGA2576-2-FL is a wideband power amplifier fabricated on TriQuint s proven.25um GaN on SiC production technology. Operating from 2.5 to 6 GHz, the TGA2576-2-FL achieves 4W of saturated output power, greater than 36% power-added efficiency and 29dB small signal gain. For ideal thermal management and handling, the TGA2576-2-FL is offered in a CuW-based flanged packaged and can operate in both CW and pulsed modes. Pin Configuration Pin No. Symbol 1, 5 V G 2, 4, 7, 9 N/C 3 RF IN 6, 1 V D RF OUT Fully matched to 5Ω and with integrated DC blocking caps on both I/O ports, the TGA2576-2-FL is ideally suited to support a variety of commercial and defense related applications. Lead-free and RoHS compliant Evaluation Boards are available up on request. Ordering Information Part ECCN Description TGA2576-2-FL 3A1.b.2.a 2.5 to 6GHz 4W GaN PA Preliminary Datasheet: Rev - 1-21-14-1 of 11 - Disclaimer: Subject to change without notice 214 TriQuint www.triquint.com

2.5 to 6GHz 4W GaN Power Amplifier Absolute Maximum Ratings Parameter Drain Voltage (V D ) Gate Voltage (V G ) Drain Current (I D ) Gate Current (I G ) Power Dissipation (P DISS ) RF Input Power, CW, 5 Ω, T = 25 C Value 4 V 5 to V 5 ma 1 to 35 ma 93 W 2 dbm Channel tremperature (T CH ) 275 C Mounting Temperature (3 Seconds) 26 C Storage Temperature 4 to 15 C Operation of this device outside the parameter ranges given above may cause permanent damage. These are stress ratings only, and functional operation of the device at these conditions is not implied. Recommended Operating Conditions Parameter Drain Voltage (V D ) Drain Current (I DQ ) Drain Current Under RF Drive (I D_DRIVE ) Gate Voltage (V G ) Value 3 V 155 ma 43 ma -2.5 V Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all operating conditions. Electrical Specifications Test conditions unless otherwise noted: 25 C, V D = 3 V, I DQ = 155 ma, V G = 2.5 V Typical, CW Parameter Min Typical Max Units Operational Frequency Range 2.5 6 GHz Small Signal Gain 29 db Output Power at Saturation (Pin = 26 dbm) 46.5 dbm Power-Added Efficiency (Pin = 26 dbm) 36 (Mid-band) % Gain Temperature Coefficient -.2 db/ C Power Temperature Coefficient -.2 dbm/ C Preliminary Datasheet: Rev - 1-21-14-2 of 11 - Disclaimer: Subject to change without notice 214 TriQuint www.triquint.com

2.5 to 6GHz 4W GaN Power Amplifier Thermal and Reliability Information Parameter Test Conditions Value Units Thermal Resistance (θ JC ) (1) T BASE = 5 C 2.4 ºC/W Channel Temperature Under RF Drive (T CH ) V D = 3 V, I D_Drive = 36 ma, = 2 C Median Lifetime Under RF Drive (T M ) 46 dbm, P DISS = 6 W 1.69 x 1^6 Hours Notes: 1. Measured from junction to center of package backside. Median Lifetime Test Conditions: V D = 4V; Failure Criteria is 1% reduction in I D_MAX Preliminary Datasheet: Rev - 1-21-14-3 of 11 - Disclaimer: Subject to change without notice 214 TriQuint www.triquint.com

(dbm) PAE (%) S11 (db) S22 (db) S21 (db) TGA2576-2-FL 2.5 to 6GHz 4W GaN Power Amplifier Typical Performance Conditions unless otherwise specified: VD = 3V, IDQ = 1.55A, VG = -2.5V Typical, CW 35 Gain vs. Frequency vs. Temperature 3 25 2 15 1 5-4C +25C +5C 2 3 4 5 6 7 Input Return Loss vs. Freq. vs. Temp. Output Return Loss vs. Freq. vs. Temp. -5-5 -1-1 -15-2 -15-2 -4C +25C +5C -25-3 -4C +25C +5C 2 3 4 5 6 7-25 -3 2 3 4 5 6 7 5 Power vs. Frequency vs. Temperature P IN = 26dBm 63 54 PAE vs. Frequency vs. Temperature P IN = 26dBm 46 45 44 42 4-4C +25C 3 +5C 36 2.5 3 3.5 4 4.5 5 5.5 6 36 27 1-4C 9 +25C +5C 2.5 3 3.5 4 4.5 5 5.5 6 Preliminary Datasheet: Rev - 1-21-14-4 of 11 - Disclaimer: Subject to change without notice 214 TriQuint www.triquint.com

(dbm), Gain (db) PAE (%) (dbm) Drain Current (ma) (dbm), Gain (db) PAE (%) (dbm) Drain Current (ma) (dbm), Gain (db) PAE (%) (dbm) Drain Current (ma) TGA2576-2-FL 2.5 to 6GHz 4W GaN Power Amplifier Typical Performance (con t.) Conditions unless otherwise specified: VD = 3V, IDQ = 1.55A, VG = -2.5V Typical, CW, Gain, PAE vs. P IN Freq.= 2.5GHz 63 54 Power, I D vs. P IN Freq = 2.5GHz 5 43 4 45 4 36 36 29 27 22 1 15 Gain 9 PAE 4 12 2 2 I D 1 4 12 2 2, Gain, PAE vs. P IN Freq.= 4.GHz Power, I D vs. P IN Freq.= 4.GHz 5 43 4 4 4 36 29 22 15 Gain PAE 4 12 2 2 I D 1 4 12 2 2, Gain, PAE vs. P IN Freq.= 6.GHz Power, I D vs. P IN Freq.= 6.GHz 5 43 4 4 4 36 29 22 15 Gain PAE 4 12 2 2 I D 1 4 12 2 2 Preliminary Datasheet: Rev - 1-21-14-5 of 11 - Disclaimer: Subject to change without notice 214 TriQuint www.triquint.com

Drain Current (ma) (dbm) TGA2576-2-FL 2.5 to 6GHz 4W GaN Power Amplifier Typical Performance (con t.) Conditions unless otherwise specified: VD = 3V, IDQ = 1.55A, VG = -2.5V Typical, CW 5 Drain Current vs. Frequency vs. Temp. Power vs. Frequency vs.p IN 43 45 36 42 29 39 22 15-4C +25C +5C P IN = 26dBm 1 2.5 3 3.5 4 4.5 5 5.5 6 36 33 3 27 2.5GHz 4.GHz 6.GHz 4 12 2 2 Preliminary Datasheet: Rev - 1-21-14-6 of 11 - Disclaimer: Subject to change without notice 214 TriQuint www.triquint.com

2.5 to 6GHz 4W GaN Power Amplifier Application Circuit Notes: 1. V G must be biased from both sides (Pins 1 and 5). 2. V D must be biased from both sides (Pins 6 and 1). 3. Remove caps for pulsed drain operation. Bias-up Procedure 1. Set I D to 4.5A, IG to 2mA 2. V G set to 5.V. 3. V D set to +3V. 4. Adjust V G until I DQ ~ 155 ma ( V G ~ -2.5V Typical) 5. Turn on RF supply. Bias-down Procedure 1. Turn off RF signal. 2. Reduce V G to 5.V. Ensure I DQ ~ ma. 3. Set V D to V. 4. Set V G to V. Preliminary Datasheet: Rev - 1-21-14-7 of 11 - Disclaimer: Subject to change without notice 214 TriQuint www.triquint.com

2.5 to 6GHz 4W GaN Power Amplifier Pin Description Pin Symbol Description 1, 5 VG Gate voltage. (1) 2, 4, 7, 9 N/C No internal connection; may be grounded or left open on PCB. 3 RF IN Input; matched to 5 Ω; DC blocked 6, 1 V D Bottom side Drain voltage. (2) RF OUT Output; matched to 5 Ω.; DC blocked. (Package Base) RF and DC ground. Notes: 1. Bias network is required; must be biased from both sides (Pins 1 and 5); see Application Circuit on page 7 as an example. 2. Bias network is required; must be biased from both sides (Pins 6 and 1); see Application Circuit on page 7 as an example. Preliminary Datasheet: Rev - 1-21-14 - of 11 - Disclaimer: Subject to change without notice 214 TriQuint www.triquint.com

2.5 to 6GHz 4W GaN Power Amplifier Evaluation Board Layout Bill of Material Reference Des. Value Description Manuf. Part Number C1 C4.1 μf Cap, 63, 5 V, 1%, X7R Various C5 C 1 μf Cap, 126, 5 V, 1%, X7R Various Preliminary Datasheet: Rev - 1-21-14-9 of 11 - Disclaimer: Subject to change without notice 214 TriQuint www.triquint.com

2.5 to 6GHz 4W GaN Power Amplifier Mechanical Information Package Information and Dimensions Marking: Part number TGA2576-2-FL Year/week/lot code - YYWW ZZZ Batch ID MXXX Notes: 1. Unless specified otherwise, dimensions are in millimeters (mm). 2. Unless specified otherwise, tolerances are ±.127 3. Materials: Package base: Copper Tungsten (CuW) composite Package lid: LCD (liquid crystal polymer) Package leads: Kovar, MIL I 2311C Class 1 Plating finish: Gold (Au) 1.27um minimum over Nickel (Ni) 2.54 to.9um Assembly Notes 1. - screws are recommended for mounting the TGA2576-2-FL to the board. 2. To improve the thermal and RF performance, we recommend the following: a) Apply thermal compound or 4 mils indium shim between the package and the board. b) Attach a heat sink to the bottom of the board and apply thermal compound or 4 mils indium shim between the heat sink and the board. 3. Apply solder to each pin of the TGA2576-2-FL. Preliminary Datasheet: Rev - 1-21-14-1 of 11 - Disclaimer: Subject to change without notice 214 TriQuint www.triquint.com

2.5 to 6GHz 4W GaN Power Amplifier Product Compliance Information ESD Sensitivity Ratings Caution! ESD-Sensitive Device ESD Rating: Class 1B Value: 5V and <1V Test: Human Body Model (HBM) Standard: JEDEC Standard JESD22-A114 Solderability This product also has the following attributes: Lead Free Halogen Free (Chlorine, Bromine) Antimony Free TBBP-A (C 15 H 12 Br 4 2 ) Free PFOS Free SVHC Free MSL Rating Level 3 at +26 C convection reflow The part is rated Moisture Sensitivity Level 3 at 26 C per JEDEC standard IPC/JEDEC J-STD-2. ECCN US Department of Commerce: 3A1.b.2.a Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations, and information about TriQuint: Web: www.triquint.com Tel: +1.972.994.465 Email: info-sales@triquint.com Fax: +1.972.994.54 For technical questions and application information: Email: info-products@triquint.com Important Notice The information contained herein is believed to be reliable. TriQuint makes no warranties regarding the information contained herein. TriQuint assumes no responsibility or liability whatsoever for any of the information contained herein. TriQuint assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for TriQuint products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. TriQuint products are not warranted or authorized for use as critical components in medical, life-saving, or lifesustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Preliminary Datasheet: Rev - 1-21-14-11 of 11 - Disclaimer: Subject to change without notice 214 TriQuint www.triquint.com