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N-channel 1050 V, 0.110 Ω typ., 46 A MDmesh DK5 Power MOSFET in an ISOTOP package Figure 1: Internal schematic diagram Features Order code VDS Datasheet - production data RDS(on) max. ID PTOT STE60N105DK5 1050 V 0.120 Ω 46 A 680 W Fast-recovery body diode Best RDS(on) x area Low gate charge, input capacitance and resistance 100% avalanche tested Extremely high dv/dt ruggedness Applications Switching applications Description Table 1: Device summary This very high voltage N-channel Power MOSFET is part of the MDmesh DK5 fast recovery diode series. The MDmesh DK5 combines very low recovery charge (Qrr) and recovery time (trr) with an excellent improvement in RDS(on) * area and one of the most effective switching behaviors, ideal for half bridge and full bridge converters. Order code Marking Packages Packaging STE60N105DK5 60N105DK5 ISOTOP Tube December 2016 DocID024137 Rev 2 1/13 This is information on a product in full production. www.st.com

Contents STE60N105DK5 Contents 1 Electrical ratings... 3 2 Electrical characteristics... 4 2.1 Electrical characteristics (curves)... 6 3 Test circuits... 8 4 Package information... 9 4.1 ISOTOP package information... 10 5 Revision history... 12 2/13 DocID024137 Rev 2

Electrical ratings 1 Electrical ratings Table 2: Absolute maximum ratings Symbol Parameter Value Unit VGS Gate-source voltage ±30 V Drain current (continuous) at TC = 25 C 46 A ID Drain current (continuous) at TC = 100 C 30 A IDM (1) Drain current (pulsed) 184 A PTOT Total dissipation at TC = 25 C 680 W dv/dt (2) Peak diode recovery voltage slope 50 V/ns dv/dt (3) MOSFET dv/dt ruggedness 50 V/ns VISO Insulation withstand voltage (AC-RMS) 2.5 kv Tj Tstg Operating junction temperature range Storage temperature range -55 to 150 C Notes: (1) Pulse width limited by safe operating area (2) ISD 23 A, di/dt 400 A/μs; VDS peak V(BR)DSS, VDD = 525 V (3) VDS 840 V Table 3: Thermal data Symbol Parameter Value Unit Rthj-case Thermal resistance junction-case 0.184 Rthj-amb Thermal resistance junction-ambient 30 C/W Table 4: Avalanche characteristics Symbol Parameter Value Unit IAS Single pulse avalanche energy (pulse width limited by TJMAX) 16 A EAS Single pulse avalanche energy (starting TJ = 25 C, ID = IAS, VDD = 50 V) 1550 mj DocID024137 Rev 2 3/13

Electrical characteristics STE60N105DK5 2 Electrical characteristics (TCASE = 25 C unless otherwise specified) Table 5: On /off states Symbol Parameter Test conditions Min. Typ. Max. Unit V(BR)DSS IDSS Drain-source breakdown ID = 1 ma, VGS = 0 V 1050 V voltage VDS = 1050 V, VGS = 0 V 1 µa Zero gate voltage drain current VDS = 1050 V, VGS = 0 V, TC = 125 C (1) 50 µa IGSS Gate-body leakage current VGS = ±20 V, VDS = 0 V ±10 µa VGS(th) Gate threshold voltage VDS = VGS, ID = 100 µa 3 4 5 V RDS(on) Static drain-source on- VGS = 10 V, ID = 23 A 0.110 0.120 Ω resistance Notes: (1) Defined by design, not subject to production test Table 6: Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit Ciss Input capacitance - 6675 - pf VDS = 100 V, f = 1 MHz, Coss Output capacitance - 370 - pf VGS = 0 V Crss Reverse transfer capacitance - 10 - pf Co(tr) (1) Co(er) (2) Equivalent capacitance time related Equivalent capacitance energy related VGS = 0 V, VDS = 0 to 840 V - 630 - pf - 219 - RG Intrinsic gate resistance f = 1 MHz open drain - 3 - Ω Qg Total gate charge VDD = 840 V, ID = 46 A, - 204 - nc Qgs Gate-source charge VGS = 10 V (see Figure 15: "Test circuit - 36 - nc Qgd Gate-drain charge for gate charge behavior") - 133 - nc Notes: (1) Time related is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDSS. (2) Energy related is defined as a constant equivalent capacitance giving the same stored energy as Coss when VDS increases from 0 to 80% VDSS. 4/13 DocID024137 Rev 2

Electrical characteristics Table 7: Switching times Symbol Parameter Test conditions Min. Typ. Max. Unit td(on) Turn-on delay time VDD = 525 V, ID = 23 A, - 40.6 - ns tr Rise time RG = 4.7 Ω, VGS = 10 V - 64.5 - ns (see Figure 14: "Test circuit for td(off) Turn-off delay time resistive load switching times" - 262 - ns tf Fall time and Figure 19: "Switching time waveform") - 49.5 - ns Table 8: Source drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit ISD Source-drain current - 46 A ISDM Source-drain current - 184 A (pulsed) VSD (1) Forward on voltage ISD = 46 A, VGS = 0 V - 1.5 V trr Reverse recovery time ISD = 46 A, VDD = 60 V, - 273 ns Qrr Reverse recovery charge di/dt = 100 A/µs (see Figure 16: "Test circuit for - 3 µc IRRM Reverse recovery current inductive load switching and diode recovery times") - 23 A trr Reverse recovery time ISD = 46 A, VDD = 60 V, - 477 ns Qrr Reverse recovery charge di/dt = 100 A/µs, Tj = 150 C (see Figure 16: "Test circuit for - 10 µc IRRM Reverse recovery current inductive load switching and diode recovery times") - 42 A Notes: (1) Pulsed: pulse duration = 300 µs, duty cycle 1.5% DocID024137 Rev 2 5/13

Electrical characteristics 2.1 Electrical characteristics (curves) Figure 2: Forward bias safe operating area Figure 3: Thermal impedance STE60N105DK5 Figure 4: Output characteristics Figure 5: Transfer characteristics Figure 6: Gate charge vs gate-source voltage Figure 7: Static drain-source on-resistance 6/13 DocID024137 Rev 2

Figure 8: Capacitance variations Electrical characteristics Figure 9: Normalized gate threshold voltage vs temperature Figure 10: Normalized on-resistance vs temperature Figure 12: Source-drain diode forward characteristics Figure 11: Normalized V(BR)DSS vs temperature Figure 13: Maximum avalanche energy vs starting TJ DocID024137 Rev 2 7/13

Test circuits STE60N105DK5 3 Test circuits Figure 14: Test circuit for resistive load switching times Figure 16: Test circuit for inductive load switching and diode recovery times Figure 18: Unclamped inductive waveform Figure 15: Test circuit for gate charge behavior Figure 17: Unclamped inductive load test circuit Figure 19: Switching time waveform 8/13 DocID024137 Rev 2

Package information 4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. DocID024137 Rev 2 9/13

Package information 4.1 ISOTOP package information Figure 20: ISOTOP outline STE60N105DK5 10/13 DocID024137 Rev 2

Package information Table 9: ISOTOP mechanical data mm Dim. Min. Typ. Max. A 11.80 12.20 A1 8.90 9.10 B 7.80 8.20 C 0.75 0.85 C2 1.95 2.05 D 37.80 38.20 D1 31.50 31.70 E 25.15 25.50 E1 23.85 24.15 E2 24.80 G 14.90 15.10 G1 12.60 12.80 G2 3.50 4.30 F 4.10 4.30 F1 4.60 5 ØP 4 4.30 P1 4 4.40 S 30.10 30.30 DocID024137 Rev 2 11/13

Revision history STE60N105DK5 5 Revision history Table 10: Document revision history Date Revision Changes 24-Jan-2013 1 First release 16-Dec-2016 2 Datasheet status promoted from preliminary to production data. Updated title, features, description and internal schematic diagram on cover page. Updated Section 1: "Electrical ratings". Updated Section 2: "Electrical characteristics". Added Section 2.1: "Electrical characteristics (curves)". Minor text changes 12/13 DocID024137 Rev 2

IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 2016 STMicroelectronics All rights reserved DocID024137 Rev 2 13/13