B (bottom) Package type descriptive code. VFBGA176 Package style descriptive code

Similar documents
SOT Package summary

SOT1688-1(SC) 1 Package summary

B (bottom) Package type descriptive code Package type industry code. VFBGA Package style descriptive code

HVQFN (thermal enhanced very thin quad flatpack; no leads) P (plastic) MO-220 S (surface mount) Issue date Manufacturer package code

D (double) Package type descriptive code XSON16. P (plastic) JEDEC package outline code. MO-252 Mounting method type

D (double) Package type descriptive code. TSOP6 Package type industry code. TSOP6 Package style descriptive code

D (double) Package type descriptive code SO8. SO (small outline) Package body material type. P (plastic) IEC package outline code

D (double) Package type descriptive code TSSOP8. TSSOP (thin shrink small outline package) Package style suffix code

D (double) Package type descriptive code. SC-73 Package type industry code. SC-73 Package style descriptive code

B (bottom) Package type descriptive code. VFBGA144 Package type industry code. VFBGA144 Package style descriptive code

DFN2020MD-6 HUSON (thermal enhanced ultra thin small outline; no leads) P (plastic) S (surface mount) Issue date Manufacturer package code

D (double) Package type descriptive code TSSOP8. TSSOP (thin shrink small outline package) Package body material type

D (double) Package type descriptive code VSSOP8. P (plastic) JEDEC package outline code. MO-187 Mounting method type

D (double) Package type descriptive code HSOP44. HSOP (heatsink small outline package) Package body material type. P (plastic) Mounting method type

D (double) Package type descriptive code. SMA; PMOS Package type industry code. SMA; PMOS Package style descriptive code

SOT023_fr SOT023_fw REL Major version date Minor version date Security status

D (double) Package type descriptive code. SOD2 Package type industry code. DSN Package style descriptive code

plastic ball grid array package; 426 balls B (bottom) Package type descriptive code BGA426 Package type industry code

D (double) Package type descriptive code. HSOP36 Package type industry code. HSOP36 Package style descriptive code

SOD323_fr SOD323_fw REL Major version date Minor version date Security status

Q (quad) Package type descriptive code LQFP32. LQFP (low profile quad flat package) Package body material type. P (plastic) IEC package outline code

S (surface mount) Issue date

HVQFN32 HVQFN (thermal enhanced very thin quad flatpack; no leads) P (plastic) MO-220 S (surface mount) Issue date

D (double) Package type descriptive code TSSOP14. TSSOP (thin shrink small outline package) Package style suffix code

Q (quad) Package type descriptive code. SQFP240 Package type industry code. SQFP240 Package style descriptive code

Q (quad) Package type descriptive code LQFP64. LQFP (low profile quad flat package) Package style suffix code

S (surface mount) Issue date

plastic leaded chip carrier; 44 leads Q (quad) Package type descriptive code PLCC44 PLCC (plastic leaded chip carrier) Package style suffix code

Q (quad) Package type descriptive code HUQFN32. QFP (quad flat package) Package style suffix code. NA (not applicable) Package body material type

ES_LPC1114. Errata sheet LPC1114. Document information

HTQFP64 HTQFP (thermal enhanced thin quad flat package) NA (not applicable) P (plastic) MS-026 S (surface mount) Issue date

TED-Kit 2, Release Notes

TN ADC design guidelines. Document information

AN Maximum RF Input Power BGU6101. Document information. Keywords Abstract

R_ Driving LPC1500 with EPSON Crystals. Rev October Document information. Keywords Abstract

BB Product profile. 2. Pinning information. 3. Ordering information. FM variable capacitance double diode. 1.1 General description

Symbol Parameter Conditions Min Typ Max Unit V F forward voltage I F =10mA V P ZSM. non-repetitive peak reverse power dissipation

Symbol Parameter Conditions Min Typ Max Unit V F forward voltage I F =10mA

High-speed switching in e.g. surface-mounted circuits

Single Schottky barrier diode

BAT54W series. 1. Product profile. 2. Pinning information. Schottky barrier diodes. 1.1 General description. 1.2 Features and benefits

VHF variable capacitance diode

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

Four planar PIN diode array in SOT363 small SMD plastic package.

Two elements in series configuration in a small SMD plastic package Low diode capacitance Low diode forward resistance AEC-Q101 qualified

AN Energy Harvesting with the NTAG I²C and NTAG I²C plus. Application note COMPANY PUBLIC. Rev February Document information

PMEG4010ER. 1. Product profile. 1 A low V F MEGA Schottky barrier rectifier. 1.1 General description. 1.2 Features and benefits. 1.

RB520CS30L. 1. Product profile. 100 ma low V F MEGA Schottky barrier rectifier. 1.1 General description. 1.2 Features and benefits. 1.

Planar PIN diode in a SOD523 ultra small plastic SMD package.

High-speed switching diode in dual series configuration, encapsulated in a small SOT23 (TO-236AB) Surface-Mounted Device (SMD) plastic package.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

BC857xMB series. 45 V, 100 ma PNP general-purpose transistors

50 ma LED driver in SOT457

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

AN NHS3xxx Temperature sensor calibration. Document information

DATA SHEET. BAP50-05 General purpose PIN diode DISCRETE SEMICONDUCTORS. Product specification Supersedes data of 1999 Feb May 10.

Planar PIN diode in a SOD523 ultra small SMD plastic package.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

Planar PIN diode in a SOD882D leadless ultra small plastic SMD package.

DISCRETE SEMICONDUCTORS DATA SHEET. k, halfpage M3D102. BAP64-04W Silicon PIN diode Jan 29. Product specification Supersedes data of 2000 Jun 06

BAP Product profile. 2. Pinning information. 3. Ordering information. Silicon PIN diode. 1.1 General description. 1.2 Features and benefits

PEMD48; PUMD48. NPN/PNP resistor-equipped transistors; R1 = 47 kω, R2 = 47 kω and R1 = 2.2 kω, R2 = 47 kω

SJA1105P/Q/R/S. 1 Features and benefits. 1.1 General features. 1.2 Ethernet switching and AVB features. 1.3 Interface features

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

DISCRETE SEMICONDUCTORS DATA SHEET. BAP65-03 Silicon PIN diode. Product specification Supersedes data of 2001 May Feb 11

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

PESD5V0F1BSF. 1. Product profile. 2. Pinning information. Extremely low capacitance bidirectional ESD protection diode. 1.1 General description

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

KMA22x; KMA32x handling information

BAV102; BAV103. Single general-purpose switching diodes

DISCRETE SEMICONDUCTORS DATA SHEET. BFS17W NPN 1 GHz wideband transistor. Product specification Supersedes data of November 1992.

Symbol Parameter Conditions Min Typ Max Unit V F forward voltage I F =10mA

BCP55; BCX55; BC55PA

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

65 V, 100 ma NPN general-purpose transistors

UM OM29263ADK Quick start guide antenna kit COMPANY PUBLIC. Document information

High-speed switching diodes. Type number Package Configuration Package NXP JEITA JEDEC

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

PEMB18; PUMB18. PNP/PNP resistor-equipped transistors; R1 = 4.7 k, R2 = 10 k

DISCRETE SEMICONDUCTORS DATA SHEET. BFT93 PNP 5 GHz wideband transistor

PEMH11; PUMH11. NPN/NPN resistor-equipped transistors; R1 = 10 k, R2 = 10 k

PDTC143Z series. NPN resistor-equipped transistors; R1 = 4.7 k, R2 = 47 k

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

TN LPC1800, LPC4300, MxMEMMAP, memory map. Document information

DISCRETE SEMICONDUCTORS DATA SHEET. book, halfpage MBD128. BGA2022 MMIC mixer Dec 04. Product specification Supersedes data of 2000 Jun 06

PNP general-purpose double transistor. PNP general-purpose double transistor in a small SOT143B Surface-Mounted Device (SMD) plastic package.

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

DATA SHEET. BGY1085A 1000 MHz, 18.5 db gain push-pull amplifier DISCRETE SEMICONDUCTORS. Product specification Supersedes data of 1997 Apr 15

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

Digital applications Cost-saving alternative to BC847/BC857 series in digital applications Control of IC inputs Switching loads

DISCRETE SEMICONDUCTORS DATA SHEET. BFT46 N-channel silicon FET

75 MHz, 30 db gain reverse amplifier

NX1117C; NX1117CE series

BAV70SRA. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data

UM Slim proximity touch sensor demo board OM Document information

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

PTVS22VU1UPA. 1. General description. 2. Features and benefits. 3. Applications. 4. Quick reference data. 300 W Transient Voltage Suppressor

INTEGRATED CIRCUITS DATA SHEET. TDA2611A 5 W audio power amplifier

In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.

Transcription:

VFBGA176, plastic, very thin fine-pitch ball grid array; 176 balls; 0.5 mm pitch; 9 mm x 9 mm x 0.86 mm 30 July 2018 Package information 1 Package summary Terminal position code B (bottom) Package type descriptive code VFBGA176 Package style descriptive code VFBGA (very thin fine-pitch ball grid array) Package material type P (plastic) Mounting method type S (surface mount) Issue date 13-07-2018 Manufacturer package code 98ASA00942D Table 1. Package summary Parameter Min Nom Max Unit package length - 9 - mm package width - 9 - mm package height - 0.86 - mm nominal pitch - 0.5 - mm actual quantity of termination - 176 -

2 Package outline Figure 1. Package outline VFBGA176 () All information provided in this document is subject to legal disclaimers. NXP B.V. 2018. All rights reserved. 2 / 8

Figure 2. Package outline note VFBGA176 () All information provided in this document is subject to legal disclaimers. NXP B.V. 2018. All rights reserved. 3 / 8

3 Soldering Figure 3. Reflow soldering footprint part1 for VFBGA176 () All information provided in this document is subject to legal disclaimers. NXP B.V. 2018. All rights reserved. 4 / 8

Figure 4. Reflow soldering footprint part2 for VFBGA176 () All information provided in this document is subject to legal disclaimers. NXP B.V. 2018. All rights reserved. 5 / 8

Figure 5. Reflow soldering footprint part3 for VFBGA176 () All information provided in this document is subject to legal disclaimers. NXP B.V. 2018. All rights reserved. 6 / 8

4 Legal information Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. All information provided in this document is subject to legal disclaimers. NXP B.V. 2018. All rights reserved. 7 / 8

Contents 1 Package summary...1 2 Package outline...2 3 Soldering...4 4 Legal information...7 NXP B.V. 2018. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 30 July 2018

2024 © hobbydocbox.com Privacy Policy | Terms of Service | Feedback