CPC7Y Single-Pole, Normally Closed V, 3.A DC, 4-Pin Power SIP Relay Parameter Rating Units Blocking Voltage V P Load Current 3. A DC On-Resistance (max).9 Features 3.A DC Load Current V Blocking Voltage 9m Maximum On-Resistance ma Input Control Current to Activate V rms Input/Output Isolation Power SIP Package High Reliability Arc-Free With No Snubbing Circuits No EMI/RFI Generation Flammability Rating UL 94 V- Applications Transportation Railroad Controls Security Battery Backup Systems Industrial Controls Robotics Instrumentation Description The CPC7Y is a V, 3.A DC,.9 DC-switching, normally closed (-Form-B) Solid State Relay. To minimize printed circuit board space, this device is provided in IXYS IC Division's Power Single In-line package (PowerSIP). Employing optically coupled MOSFET technology, the CPC7Y provides V rms of input to output isolation. The relay output is constructed with an efficient MOSFET switch that utilizes IXYS Integrated Circuits Division's patented OptoMOS architecture. A highly efficient infrared LED at the input controls the optically coupled output. The combination of low on-resistance and high load current capability makes this relay suitable for a variety of high performance switching applications. Approvals UL 8 Certified Component: File E9938 CSA Certified Component: Certificate 77 Ordering Information Part # CPC7Y Description 4-Pin (8-Pin Body) Power SIP Package ( per tube) Pin Configuration Switching Characteristics of Normally Closed Devices Form-B I LOAD % 9% t off t on DS-CPC7-R www.ixysic.com
CPC7Y Absolute Maximum Ratings @ T A =ºC (Unless Otherwise Noted) Parameter Ratings Units Blocking Voltage V P Reverse Input Voltage V Input control Current ma Peak (ms) A Input Power Dissipation mw Total Power Dissipation 7 mw Isolation Voltage, Input to Output V rms ESD Rating (Human Body Model) 4 kv Operational Temperature -4 to +8 C Storage Temperature -4 to + C Derate linearly 3.33 mw / ºC Derate Output Power linearly.8 mw / ºC Electrical Characteristics @ T A =ºC (Unless Otherwise Noted) Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at + C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current, Continuous Free air I L - - 3. A DC Peak Load Current t=ms I LPK - - 3. A On-Resistance I L =A R ON -.9.9 Off-State Leakage Current =ma, V L =V DC I LEAK - - µa Switching Speeds Turn-On Output Switch =ma, V L =V t on -. Turn-Off Output Switch (See Switching Waveform) t off -.84 ms Output Capacitance =ma, V L =V DC, f=mhz C OUT - - nf Input Characteristics Input Control Current to Activate 3 I L =A -.8 ma Input Control Current to Deactivate I L =A..8 - ma Input Voltage Drop =ma V F.9.. V Reverse Input Current V R =V I R - - µa Input/Output Characteristics Capacitance, Input-to-Output V IO =V, f=mhz C IO - - pf Derate linearly. ma/ºc. Measurement taken within second of on-time. 3 For high-temperature operation (T A > ºC) a minimum LED drive current of ma is recommended. Thermal Characteristics Parameter Symbol Rating Units Thermal Impedance (Junction to Ambient) JA 8 C/W Switching Waveform Form-B I LOAD % 9% t off t on www.ixysic.com R
CPC7Y PERFORMANCE DATA* Typical LED Forward Voltage Drop (N=, =ma) Typical for Switch Operation (N=) Typical for Switch Dropout (N=).8...4..8.3 LED Forward Voltage (V)..3.34.38.4.4..4 LED Forward Current (ma).7.3.3.39.43.47. LED Forward Current (ma) 3 Typical On-Resistance Distribution (N=, I L =A) 3 Typical Turn-Off Time (N=, =ma) 3 Typical Turn-On Time (N=, =ma) 3.48...4..8.. On-Resistance ( ).. 3. 3.4 3.8 Turn-Off Time (ms)...4..8.7.7 Turn-On Time (ms) Typical Blocking Voltage Distribution (N=, =ma) 7 77 78 79 8 8 Blocking Voltage (V P ) Forward Voltage (V).4.4.3.3... Typical LED Forward Voltage Drop =ma =ma =ma. -4-4 8 LED Current (ma)...4.4.3.3 Typical for Switch Operation. -4-4 8 LED Current (ma)...4.4.3.3 Typical for Switch Dropout. -4-4 8 *The Performance data shown in the graphs above is typical of device operation. Unless otherwise noted, data is presented at ºC. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. R www.ixysic.com 3
CPC7Y Load Current (A) 3. 3... Typical Load Current vs. Load Voltage ( =ma)..... Load Voltage (V) Turn-On Time ( s) PERFORMANCE DATA* 8 7 4 3 Typical Turn-On Time vs. LED Forward Current 3 4 Forward Current (ma) Turn-Off Time (ms) 8 4 Typical Turn-Off Time vs. LED Forward Current ( =ma) 3 4 Forward Current (ma) On-Resistance ( )..8..4.. Typical On-Resistance vs. Load Current 4 8 Load Current (ma) Turn-On Time (ms)..8..4. Typical Turn-On Time (I L =ma). -4-4 8 Turn-Off Time (ms) Typical Turn-Off Time (I L =ma) 9 =ma 8 7 =ma 4 3 I F =ma -4-4 8 On-Resistance (m ) 7 4 3 Typical On-Resistance ( =ma) -4-4 8 Load Current (A) Maximum Load Current ( =ma) 4. 3. 3....... -4-4 8 Blocking Voltage (V P ) 9 8 7 Typical Blocking Voltage ( =ma) -4-4 8 Leakage Current A A na na na pa pa Leakage Current ( =ma, V L =V) pa -4-4 8 Capacitance (nf) 4 3 Output Capacitance vs. Load Voltage ( =ma) Load Voltage (V) *The Performance data shown in the graphs above is typical of device operation. Unless otherwise noted, data is presented at ºC. For guaranteed parameters not indicated in the written specifi cations, please contact our application department. 4 www.ixysic.com R
CPC7Y Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-33. Device Moisture Sensitivity Level (MSL) Classification CPC7Y MSL ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-. Soldering Profile Provided in the table below is the Classification Temperature (T C ) of this product and the maximum dwell time the body temperature of this device may be (T C - )ºC or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD- must be observed. Board Wash Device Classification Temperature (T c ) Dwell Time (t p ) Max Reflow Cycles CPC7Y 4ºC 3 seconds IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R www.ixysic.com
CPC7Y MECHANICAL DIMENSIONS Pin.8±.38 (.83±.).778 (.7).±.7 (.4±.).7±.7.±.7 (.3±.3) (.4±.).±. (.±.4).4±.7.8±.7 (.±.) (.±.).±.7 (.4±.) 3.3±. (.3±.) 7º TYP 4 Places 4.7±.7 (.8±.).38±.3 (.±.).778 (.7).7 (.9) Pin PCB Hole Pattern. DIA. x4 (.4 DIA. x4).8 (.). (.4).4 (.) 7º TYP 4 Places Note: Pin-to-pin tolerances are non-cumulative. Dimensions mm (inches) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC7-R Copyright 7, IXYS Integrated Circuits Division OptoMOS is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. //7