ITR-D3T-SD /1490/1555nm Integrated Triplexer Transceiver. Triplexer Block Diagram. Features

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1310/1490/1555nm Integrated Triplexer Transceiver Features Single fiber, integrated triplexer transceiver Compliant to FSAN G.984.2 specifications Voice/Data/Video FTTx ONT/ONU applications 1310nm Tx, 1490nm Rx, 1555nm video Rx 1244Mbps Tx / 2488Mbps Rx asymmetric data rate Burst mode upstream transmission 19dBmV minimum RF output power (with mixed GPON channel plan) 870MHz Video Bandwidth -40 to 85ºC Case Operation Feedback Video ACG Operation 20km reach 28dB power budget - Digital Transmitter: A DFB laser diode is employed for upstream transmission at OC-24 (1244Mbps). The optical transmitter includes a back facet photodetector to monitor laser power for APC control. - Digital Receiver: An APD with TIA is employed for downstream data reception at OC-48 (2488Mbps). A post amplifier is also included for CML output compatibility. - Analog Receiver: 870MHz forward path video (CATV) receiver with multiple gain stages, automatic gain control (AGC), and status indicators. TIA Lim. Amp. Rx Section Rx Data 1490nm APD Receiver 1310nm Upstream 1490nm Downstream 1555nm Downstream WDM 1310nm Laser LDD Tx Section Tx Data Optical Triplexer Module 1550nm PIN Receiver AGC MOCA RF Tilt / Surge Protection RF Out A D C Microcontroller RF Detector Video Section Triplexer Block Diagram

Absolute Maximum Ratings Usage of this transceiver shall adhere to the following absolute maximum ratings. Stresses beyond those in Table 1 may cause permanent damage to the unit. These are stress ratings only, and functional operation of the unit at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect unit reliability. Table 1 - Absolute Maximum Ratings Parameter Minimum Maximum Unit/Conditions Ambient Storage Temperature -40 85 ºC Operating Case Temperature -40 85 ºC Operating Case Humidity Range 10% 90% non-condensing ESD Sensitivity (Human Body Model) - 1000 V Lead Soldering Temperature - 260ºC 10 sec Vdd_+12V - 15 V Vcc_Rx -0.4 +4.2 V Vcc_Tx -0.4 Vcc_Rx + 1 V Vcc_µC -0.4 +4.2 V Module Characteristics Table 2 - Module Characteristics Parameter Minimum Typical Maximum Unit/Conditions 1555nm external to 1490 nm Rx Isolation 32 - - db 1490nm external to 1555nm Rx Isolation 32 - - db 1310nm external to 1555nm Video Isolation 40 - - db 1310nm external to 1490nm data Isolation 30 - - db 1310nm Tx to 1490nm Rx Optical Crosstalk - - -47 db 1310nm Tx to 1555nm Rx Optical Crosstalk - - -47 db Back Reflection @ 1310nm - - -6 db Back Reflection @ 1555nm - - -32 db Back Reflection @ 1490nm - - -20 db Total 3.3V Supply Current - - 350 ma Total 12V Supply Current - - 225 ma PSRR (Power Supply Rejection) - - 100 mvp-p

Functional Characteristics The following tables list the performance specifications for the various functional blocks of the integrated optical transceiver module. Table 3 Digital Transmitter Specifications Parameter Minimum Typical Maximum Unit Notes Operating Voltage 3.14 3.30 3.46 V Vcc referenced to GND_Tx Data Rate - 1244.16 - Mbps Average Optical Output Power, P o 0.5-5 dbm Output Power at Transmit Off - - -40 dbm Extinction Ratio 10 - - db PRBS 2 23-1, NRZ, 50% duty cycle Transmitter Output Eye G.984.2 Figure 3 Optical Rise and Fall Time - 250 - ps 20% to 80% Side Mode Suppression Ration (SMSR) 30 - - db Differential Input Voltage, V in 300-1800 mvp-p BEN+/- and TXD+/-. DC-coupled Input Impedance, differential - 100 - Ω BEN+/-, TXD+/- Common-Mode Input Voltage GND_Tx + 1.4 - Vcc - (V in /2) - 0.1 V DC coupled Tx Burst Enable Time - - 12.86 ns 16 bits data @ 1244Mbps Tx Burst Disable Time - - 12.86 ns 16 bits data @ 1244Mbps Jitter Generation - - 0.2 UI 4 khz to 10 MHz Refer to Figure 1 which schematically describes the high speed data inputs/outputs of the optical transceiver module. For CML Tx Data Tx Data & Burst Enable 100π Differential Transmission Line 100π TX LDD/Post amp. 0.1πF Rx Data RX 100π Differential Transmission Line 0.1πF Figure 1 - Schematic representation of the module high speed inputs/outputs

Table 4 Digital Receiver Specifications Parameter Minimum Typical Maximum Unit Notes Operating Voltage 3.14 3.30 3.46 V Vcc referenced to GND_RX Data Rate - 2488.32 - Mbps Operational Wavelength Range 1480-1500 nm Received Optical Power -28 - -8 dbm PRBS 2 23-1, 50% duty cycle Bit Error Rate (BER) - 10-10 CID 72 bits Data Output Rise and Fall Time - 160 - ps 20% to 80% Signal Detect Assertion Level - -28 dbm Transition during increasing light Signal Detect De-Assertion Level a -38 - - dbm Transition during decreasing light Signal Detect Hysteresis 0.5 - - db Differential Output Voltage 600-900 mv CML output, ac coupled (0.1μF) LVTTL with internal pull up resistor. Signal Detect Output HIGH Voltage 2.4 - - V Asserts HIGH when input data amplitude is above threshold. Signal Detect Output LOW Voltage - - 0.4 V LVTTL. De-asserts LOW when input data amplitude is below threshold. RSSI Range b -28 - -8 dbm RSSI Accuracy -3 - +3 db a Rx outputs are squelched upon Signal Detect de-assert b Externally calibrated.

Table 5 Video Receiver Specifications Parameter Minimum Typical Maximum Unit Notes 12V Operating Voltage Range 11.7-13.2 V Frequency Range 54-870 MHz Receiver Wavelength (Bandwidth) 1550 1555 1560 nm Responsivity 0.8 - - A/W Analog Channels 40 - - OMI = 4.3%/channel Digital Channels 63 - - OMI = 2.15%/channel Channel Bandwidth - 4 - MHz Channel Spacing - 6 - MHz Video PD Monitor Accuracy - - 5 % AGC Time Constant 0.5 - - s Received Average Optical Power -8-2 dbm RF Channel Output Power 55 MHz a 19-23 dbmv RF Channel Output Power 450 MHz a 19.5-23.5 dbmv RF Channel Output Power 870 MHz a,b 15-22 dbmv S22 Output Return Loss 14 20 - db 75Ω Distortions CSO CTB - - -65-62 -55-55 dbc For digital channels, CSO max an CTB max will be 7 db higher Carrier to Noise Ratio (CNR) 46 - - db a) Valid with CW carriers with Register 32 = 00 b) 6 db lower because these are digital channel frequencies

Table 6 Suggested Start-up Sequence Step Action 1 Power up the host system, with the RESET pin pulled to ground via a <= 4.7kΩ resistor. 2 Drive the RESET pin LOW. 3 Set the BEN control lines to disable the transmitter (BEN lines must be driven with differential logic). 4 Ensure power to the unit is on. 5 Drive the RESET pin HIGH to release the unit to become operational. 6 Wait approximately 250ms until the INTERRUPT pin goes LOW. 7 Read bytes A2.70/71/74/75 to clear the interrupt condition. Verify that byte A2.75 bit 7 was set. Use multi-byte read of bytes 70/71 and bytes 74/75. 8 Wait 50ms. Verify that the INTERRUPT pin has changed to HIGH. 9 The unit is now ready for normal operation. Figure 2 - Recommended transceiver module start-up sequence

Pin Definitions Refer to Table 7 for a description of the function of each I/O pin. Table 7 - Module Pin Definitions Pin Number Label Definition 1 GND_A Common ground 2 GND_Rx Digital Rx ground 3 Vcc_Rx Digital Rx Vcc 4 SD Signal Detect output. LVTTL with internal 3.3kΩ pull-up. Asserts HIGH when input optical signal level is above threshold. 5 RXD+ RX data output, CML. 50Ω terminated to Vcc and AC coupled to module output (0.1μF) 6 RXD- RX data bar output, CML. 50Ω terminated to Vcc and AC coupled to module output (0.1μF) 7 BEN+ Burst Enable input, internally DC coupled. 8 BEN- Burst Enable bar input, internally DC coupled. 9 GND_Tx Digital Tx ground 10 TXD+ Tx data input, CML. Internally DC coupled. 100Ω differential termination. 11 GND_Tx Digital Tx ground 12 TXD- Tx data bar input, CML. Internally DC coupled. 100Ω differential termination. 13 Vcc_Tx Digital Tx Vcc 14 SDA I 2 C Data input/output. LVTTL 15 SCL I 2 C Clock input. LVTTL 16 INT Interrupt output. LVTTL with internal 100kΩ pull-up. Active LOW. 17 Vdd_+12V Video Rx 12V Vdd 18 Vcc_3.3V Microcontroller Vcc 19 Reset Reset input. LVTTL. Internal pull up. Active low. 20 GND_A Common ground 21 RF_GND RF ground 22 RF_SIGNAL RF signal 23 RF_GND RF ground

Package Diagram 23.5 ± 1.5 [597 ± 38] Bottom View Notes 1. Dimensions in inches [mm] 2. Minimum fiber bend radius = 1.18 [30.00] Bottom View

Ordering Information Table 8 - Ordering Information ITx - xyz - xy z - x - x x Application Type x PON Standard y Tx Rate z Rx Rate xy Customer z Platform Revision Supplemental R Integrated Triplexer, Residential Application B BPON, Class B, SC/APC pigtail 1 155Mbps T 2x Tx rate SD Standard 1 μc based; SMB RF connector Numeric value C Commercial temp. range (0-70C) C Integrated Triplexer, Curb Application C BPON, Class B, SC receptacle 2 622Mbps F 4x xy Customer specific 2 μc based; 3-pin RF connector D Integrated Triplexer, Digital Only G GPON, 25dB budget, SC/APC pigtail 3 1244Mbps E 8x 3 μc based; SMB; BPON gain V Integrated Triplexer, Video Only H GPON, 28dB Budget, SC/APC Pigtail (FP Laser) 4 2488Mbps S 16x 5 μc based; SMB; HIGH gain D GPON, 28dB Budget, SC/APC Pigtail (DFB Laser) 5 4800Mbps 6 μc based; 3RF; HIGH gain 7 μc based; SMB; Next gen. 8 μc based; 3RF; Next gen. Table 12 - Device Handling/ESD Protection The devices are static sensitive and may easily be damaged if care is not taken during handling. The following handling practices are recommended. 1 Devices should be handled on benches with conductive and grounding surfaces. 2 All personnel, test equipment and tools shall be grounded. 3 Do not handle the devices by their leads. 4 Store devices in protective foam or carriers. 5 Avoid the use of non-conductive plastics, rubber, or silk in the area where the devices are handled 6 All modules shall be packaged in materials that are anti-static to protect against adverse electrical environments. Avoid applications of any voltage higher than maximum rated voltages to this part. For proper operation, any VIN or VOUT should be 7 constrained to the range GND (VIN or VOUT) VCC. Unused inputs must always be tied to an appropriate logic voltage (e.g. either GND or VCC). Unused outputs must be left open.

Warnings Handling Precautions: This device is susceptible to damage as a result of electrostatic discharge (ESD). A static free environment is highly recommended. Follow guidelines according to proper ESD procedures. Laser Safety: Radiation emitted by laser devices can be dangerous to human eyes. Avoid eye exposure to direct or indirect radiation. Legal Notice IMPORTANT NOTICE! All information contained in this document is subject to change without notice, at Source Photonics sole and absolute discretion. Source Photonics warrants performance of its products to current specifications only in accordance with the company s standard one-year warranty; however, specifications designated as preliminary are given to describe components only, and Source Photonics expressly disclaims any and all warranties for said products, including express, implied, and statutory warranties, warranties of merchantability, fitness for a particular purpose, and non-infringement of proprietary rights. Please refer to the company s Terms and Conditions of Sale for further warranty information. Source Photonics assumes no liability for applications assistance, customer product design, software performance, or infringement of patents, services, or intellectual property described herein. No license, either express or implied, is granted under any patent right, copyright, or intellectual property right, and Source Photonics makes no representations or warranties that the product(s) described herein are free from patent, copyright, or intellectual property rights. Products described in this document are NOT intended for use in implantation or other life support applications where malfunction may result in injury or death to persons. Source Photonics customers using or selling products for use in such applications do so at their own risk and agree to fully defend and indemnify Source Photonics for any damages resulting from such use or sale. Copyright Source Photonics, Inc. 2007~2008 All Rights Reserved. All information contained in this document is subject to change without notice. The products described in this document are NOT intended for use in implantation or other life support applications where malfunction may result in injury or death to persons. The information contained in this document does not affect or change Source Photonics product specifications or warranties. Nothing in this document shall operate as an express or implied license or indemnity under the intellectual property rights of Source Photonics or third parties. All information contained in this document was obtained in specific environments, and is presented as an illustration. The results obtained in other operating environments may vary. THE INFORMATION CONTAINED IN THIS DOCUMENT IS PROVIDED ON AN AS IS BASIS. In no event will Source Photonics be liable for damages arising directly from any use of the information contained in this document. Contact SOURCE PHOTONICS 20550 NORDHOFF ST. CHATSWORTH, CA 91311 sales@sourcephotonics.com Tel: 818-773-9044 Fax: 818-576-9486 Or visit our website: http://www.sourcephotonics.com