JUNCTION FIELD EFFECT TRANSISTOR 2SK660

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Transcription:

DATA SHEET JUNCTION FIELD EFFECT TRANSISTOR 2SK660 N-CHANNEL SILICON JUNCTION FIELD EFFECT TRANSISTOR FOR IMPEDANCE CONVERTER OF ECM DESCRIPTION The 2SK660 is suitable for converter of ECM. FEATURES Compact package High forward transfer admittance yfs = 1200 µs TYP. (VDS = 5 V, ID = 0 µa) Low capacitance Ciss = 4.5 pf (VDS = 5 V, VGS = 0 V, f = 1 MHz) Includes diode and high resistance at G - S ORDERING INFORMATION PART NUMBER 2SK660 PACKAGE SST ABSOLUTE MAXIMUM RATINGS (TA = 25 C) Drain to Source Voltage Note VDSX 20 V Gate to Drain Voltage VGDO 20 V Drain Current ID 10 ma Gate Current IG 10 ma Total Power Dissipation PT 100 mw Junction Temperature Tj 125 C Storage Temperature Tstg 55 to +125 C EQUIVALENT CIRCUIT Drain Gate Source Note VGS = V Remark Please take care of ESD (Electro Static Discharge) when you handle the device in this document. The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. D10753EJ2V0DS00 (2nd edition) Date Published January 2002 NS CP(K) Printed in Japan 2002

ELECTRICAL CHARACTERISTICS (TA = 25 C) CHARACTERISTICS SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT Zero Gate Voltage Drain Cut-off Current IDSS VDS = 5.0 V, VGS = 0 V 60 500 µa Gate Cut-off Voltage VGS(off) VDS = 5.0 V, ID = µa V Forward Transfer Admittance yfs1 VDS = 5.0 V, ID = 30 µa, f = khz 150 µs Forward Transfer Admittance yfs2 VDS = 5.0 V, VGS = 0 V, f = khz 150 1200 µs Input Capacitance Ciss VDS = 5.0 V 4.5 6.0 pf Output Capacitance Coss VGS = 0 V 1.5 3.0 pf Reverse Transfer Capacitance Crss f = MHz 1.2 3.0 pf Noise Voltage NV See Test Circuit 3.0 µv NOISE VOLTAGE TEST CIRCUIT +4.5 V R = 1 kω JIS A NV (r.m.s) C = 10 pf 2 Data Sheet D10753EJ2V0DS

TYPICAL CHARACTERISTICS (TA = 25 C) 120 TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE 500 DRAIN CURRENT vs. DRAIN TO SOURCE VOLTAGE PT - Total Power Dissipation - mw 100 80 60 40 20 ID - Drain Current - µ A 400 300 200 100 0.15 V 0.10 V 0.05 V VGS = 0 V 0.05 V 0.10 V 0.15 V 0.25 V 0.20 V 0.30 V 0 0 30 60 90 120 150 180 TA - Ambient Temperature - C 0 0 2 4 6 8 VDS - Drain to Source Voltage - V 10 GATE TO SOURCE CURRENT vs. GATE TO SOURCE VOLTAGE 40 30 VDS = 5 V DRAIN CURRENT vs. GATE TO SOURCE VOLTAGE IG - Gate Current - µ A 0.8 0.6 0.4 0.2 10 20 30 20 10 0 0.2 0.4 0.6 0.8 ID - Drain Current - ma 0.8 0.6 0.4 0.2 40 0.4 0.2 0 0.2 0.4 VGS - Gate to Source Voltage - V VGS - Gate to Source Voltage - V yfs - Forward Transfer Admittance - ms 3.0 2.5 2.0 1.5 0.5 FORWARD TRANSFER ADMITTANCE vs. GATE TO SOURCE VOLTAGE VGS - Gate to Source Voltage - V VDS = 5 V 0 0.4 0.3 0.2 0.1 0 0.1 0.2 0.3 0.4 CiSS, COSS - Capacitance - pf 10 8 5 3 2 INPUT AND FEEDBACK CAPACITANCE vs. DRAIN TO SOURCE VOLTAGE CISS COSS VDS = 0 V f = khz 1 1 2 5 10 20 50 100 VDS - Drain to Source Voltage - V Data Sheet D10753EJ2V0DS 3

VGS (off) - Gate to Source Cut-off Voltage - V yfs - Forward Transfer Admittance - ms FORWARD TRANSFER ADMITTANCE AND GATE TO SOURCE CUT-OFF VOLTAGE vs. ZERO- GATE VOLTAGE DRAIN CURRENT CO-RELATION 10.0 5.0 2.0 0.5 0.2 0.1 0.05 0.02 0.01 10 yfs VGS (off) VDS = 5 V 20 50 100 200 500 1000 Zero-Gate Voltage Drain Current - µ A 4 Data Sheet D10753EJ2V0DS

PACKAGE DRAWING (Unit: mm) 4.0±0.2 2.0±0.2 3.0±0.2 0.50 TYP. 0.45 TYP. 0.42 TYP. 1.27 TYP. 1.35 TYP. 12.5 MIN. TYP. 0.6 TYP. D G S 1.27 TYP. Data Sheet D10753EJ2V0DS 5

[MEMO] 6 Data Sheet D10753EJ2V0DS

[MEMO] Data Sheet D10753EJ2V0DS 7

The information in this document is current as of January, 2002. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document. NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC semiconductor products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC or others. Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of customer's equipment shall be done under the full responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information. While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC semiconductor products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment, and anti-failure features. NEC semiconductor products are classified into the following three quality grades: "Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of a semiconductor product depend on its quality grade, as indicated below. Customers must check the quality grade of each semiconductor product before using it in a particular application. "Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems and medical equipment for life support, etc. The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness to support a given application. (Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4