DATA SHEET NE68133 / 2SC3583 MICROWAVE LOW NOISE AMPLIFIER NPN SILICON EPITAXIAL TRANSISTOR CHARACTERISTIC SYMBOL MIN. TYP. MAX. UNIT TEST CONDITIONS

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Transcription:

Document No. P6EJVDS (th edition) Date Published March 997 N DATA SHEET SILICON TRANSISTOR NE68 / SC8 MICROWAVE LOW NOISE AMPLIFIER NPN SILICON EPITAXIAL TRANSISTOR DESCRIPTION The NE68 / SC8 is an NPN epitaxial silicon transistor designed for use in low-noise and small signal amplifiers from VHF band to UHF band. Low-noise figure, high gain, and high current capability achieve a very wide dynamic range and excellent linearity. This is achieved by direct nitride passivated base surface process (DNP process) which is a proprietary new fabrication technique. FEATURES NF. db TYP. @f =. GHz Ga db TYP. @f =. GHz ABSOLUTE MAXIMUM RATINGS (TA = C) Collector to Base Voltage VCBO V Collector to Emitter Voltage VCEO V Emitter to Base Voltage VEBO. V Collector Current IC 6 ma Total Power Dissipation PT mw Junction Temperature Tj C Storage Temperature Tstg 6 to + C ELECTRICAL CHARACTERISTICS (TA = C) CHARACTERISTIC SYMBOL MIN. TYP. MAX. UNIT TEST S Collector Cutoff Current ICBO. A VCB = V, IE = Emitter Cutoff Current IEBO. A VEB = V, IE = DC Current Gain hfe *, IC = ma Gain Bandwidth Product ft 9 GHz, IC = ma Feed-Back Capacitance Cre **..9 pf VCB = V, IE =, f =. MHz Insertion Power Gain Se db, IC = ma, f =. GHz Maximum Available Gain MAG db, IC = ma, f =. GHz Noise Figure NF.. db, IE = 7 ma, f =. GHz * Pulse Measurement PW s, Duty Cycle % ** The emitter terminal and the case shall be connected to the gurad terminal of the three-terminal capacitance bridge. hfe Classification Class R/Q * R/R * R/S * Marking R R R hfe to 8 to 6 to * Old Specification / New Specification.9±.. to. PACKAGE DIMENSIONS (Units: mm)..9.9. +.. PIN CONNECTIONS. Emitter. Base. Collector.8±.. to.. +.. Marking.6 +..6.6 +.. JEITA Part No.

NE68 / SC8 TYPICAL CHARACTERISTICS (TA = C) PT-Total Power Dissipation-W hfe-dc Current Gain ft-gain Bandwidth Product-MHz. TOTAL POWER DISSIPATION vs. AMBIENT TEMPERATURE TA-Ambient Temperature- C DC CURRENT GAIN vs. Free air GAIN BANDWIDTH PRODUUT vs. 7 7 Se -Insertion Gain-dB Cre-Feed-back Capacitance-pF MAG-Maximum Available Gain-dB Se -Insertion Gain -db. 7 VCB-Collector to Base Voltage-V.7... FEED-BACK CAPACITANCE vs. COLLECTOR TO BASE VOLTAGE INSERTION GAIN vs. f =. GHz. 7 6 f =. MHz INSERTION GAIN, MAXIMUM AVAILABLE GAIN vs. FREQUENCY IC = ma Se MAG 8.....7.... f-frequency-ghz

NE68 / SC8 S-PARAMETER NF-Noise Figure-dB VCE = 8. V, IC =. ma, ZO = 7 6 NOISE FIGURE vs. f =. GHz. 7 f (MHz) S S S S S S S S 6 8 6 8.78.9....76.76.79.86.. 7. 9... 8.9 6.8 7.9 6...7 8.97 6.6.6....7..8 8.7.. 9. 8.6 7.8 69. 6. 8.9..6.6.79.9....6.88. 66. 6.6 6.6 6. 6. 6.8 6. 9.8 9. 8.9.8.67.8.9..7.8.7.6.86.6 6.6 9. 8.6....8 7.. VCE = 8. V, IC = ma, ZO = f (MHz) S S S S S S S S 6 8 6 8.66.9..77.6.6.7.8.6. 66.8 88.9.. 6. 79. 68. 7. 7.6. 9.77. 7.9.6.6.7.6.9.87.79 6.9 98.8 9. 8. 77.6 7.6 66. 6.9 8.....7.9.7..6.78.. 6.6 7.6 7.6 7. 7. 7. 7. 69.6 66. 6..87.8..9..9.69.7....8... 6. 9.9...

..7. NE68 / SC8 S-PARAMETER Se, Se-FREQUENCY 8 Se-FREQUENCY. GHz..9...8.9..7 WAVELENGTHS TOWARD GENERATOR.8...7..6.6 IN DEGREES ANGLE OF REFLECTION COEFFCIENT WAVELENGTHS TOWARD LOAD 9 6........ IC = ma..6....6..7... ZO ) ( +JX.7.8.. POSITIVE REACTANCE COMPONENT... NEGATIVE REACTANCE COMPONENT ZO ) ( JX..8...9.6.6....9..7..7...8..9..9..8 REACTANCE COMPONENT R..8 9 9..7. GHz 8 8 6 Se 9 MHz Step 6 6. GHz..6.8.7.9.8.9 (.9 ZO ) Se.......6.6.6..8 8..6 8.8.8...6. IC = ma........6...8.. GHz.6.8..... 7. 7.6.6.6..6..8..8 6 6...7...7....8.8.... IC = ma. GHz.9.9.... Se. GHz. 6.....9...8.9. Se-FREQUENCY Se..7.6..8.....7..6 9 IC = ma 6. GHz..8..6. 9. GHz 6

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