Single-Pole, Normally Open OptoMOS Relay Parameter Ratings Units Blocking Voltage 6 V P Load Current A rms / A DC Off-State Leakage Current na On-Resistance (max. Features Very Low Off-State Leakage Current: na Low On-Resistance:. High Current Handling Capability: A 37V rms Input/Output Isolation Low Drive Power Requirements (TTL/CMOS Compatible High Reliability Arc-Free With No Snubbing Circuits No EMI/RFI Generation Small 6-Pin Package Machine Insertable, Wave Solderable Surface Mount Tape & Reel Version Available Applications Telecommunications Telecom Switching Tip/Ring Circuits Modem Switching (Laptop, Notebook, Pocket Size Hook Switch Dial Pulsing Ground Start Ringing Injection Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas Medical Equipment Patient/Equipment Isolation Security Aerospace Industrial Controls Description is a normally open (-Form-A solid state relay that uses optically coupled MOSFET technology to provide 37V rms of input to output isolation, and that features very low off-state leakage current. Its optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. The can be used to replace mechanical relays, and offers the superior reliability associated with semiconductor devices. Because it has no moving parts, it offers faster, bounce-free switching in a more compact surface mount or thru-hole package. Approvals UL Recognized Component: File E7627 CSA Certified Component: Certificate 7739 EN/IEC 69- Certified Component: TUV Certificate B 9 7 494 4 Ordering Information Part # S STR Pin Configuration Description 6-Pin DIP (/Tube 6-Pin Surface Mount (/Tube 6-Pin Surface Mount (,/Reel AC/DC Configuration + Control 6 Load 2 Control Do Not Use 3 Do Not Use 4 Load DC Only Configuration + Control 6 2 Control 3 Do Not Use 4 + Load Load Switching Characteristics of Normally Open Devices Form-A Pb e3 9% I % LOAD t on t off DS--R3 www.ixysic.com
Absolute Maximum Ratings @ 2ºC Parameter Ratings Units Blocking Voltage 6 V P Reverse Input Voltage V Input Control Current ma Peak (ms A Input Power Dissipation mw Total Power Dissipation 2 8 mw Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Isolation Voltage, Input to Output 37 V rms Operational Temperature -4 to +8 C Storage Temperature -4 to +2 C Derate linearly.33 mw / ºC 2 Derate linearly 6.67 mw / ºC Electrical Characteristics @ 2ºC (Unless Otherwise Noted Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current AC/DC Confi guration, Continuous - - - A I rms / A DC DC Confi guration, Continuous - L - -.8 A DC Peak t=ms I LPK - - ± A P On-Resistance AC/DC Confi guration I L =A -.3. R DC Confi guration I ON L =.8A -.. Off-State Leakage Current V L =6V P, T=8ºC I LEAK - - na Switching Speeds Turn-On t = ma, V L = V on - - 2. ms Turn-Off t off - -.3 ms Output Capacitance V L =V, f=mhz C OUT - 22 - pf Input Characteristics Input Control Current to Activate I L = A - - ma Input Control Current to Deactivate -.4.7 - ma Input Voltage Drop = ma V F.9.2.4 V Reverse Input Current V R = V I R - - µa Common Characteristics Capacitance, Input to Output - C I/O - 3 - pf Measurement taken within second of on-time. R3 2 www.ixysic.com
PERFORMANCE DATA @2ºC (Unless Otherwise Noted* 3 Typical LED Forward Voltage Drop (N=, =ma 2 Typical Turn-On Time (N=, =ma, I L 2 Typical Turn-Off Time (N=, =ma, I L Device Count (N 3 2 2 Device Count (N 2 Device Count (N 2.7.9.2.23.2 LED Forward Voltage (V..7.9..3. Turn-On Time (ms.3..7.9..3 Turn-Off Time (ms 2 Typical for Switch Operation (N=, I L 2 Typical for Switch Dropout (N=, I L 3 Typical On-Resistance Distribution (N=, =ma, I L Device Count (N 2 Device Count (N 2 Device Count (N 3 2 2.2.7 2.2 2.7 3.2 3.7 LED Current (ma.2.7 2.2 2.7 3.2 3.7 LED Current (ma.2.22.23.24.2.26 On-Resistance ( 3 3 Typical Blocking Voltage Distribution (N= Device Count (N 2 2 72 74 76 78 8 82 Blocking Voltage (V P LED Forward Voltage Drop (V.8.6.4.2. Typical LED Forward Voltage Drop =ma =3mA =2mA =ma.8-4 -2 2 4 6 8 2 Temperature (ºC Turn-On Time (ms 2..8.6.4.2..8.6.4.2 Typical Turn-On Time vs.led Forward Current 2 2 3 3 4 4 Forward Current (ma Turn-Off Time (ms Typical Turn-Off Time vs. LED Forward Current.9.8.7.6..4.3.2. 2 2 3 3 4 4 LED Forward Current (ma *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R3 www.ixysic.com 3
PERFORMANCE DATA @2ºC (Unless Otherwise Noted* Turn-On Time (ms.4.2..8.6.4.2-4 Typical Turn-On Time I = ma I = 2mA -2 2 4 6 8 Temperature (ºC F F Turn-Off Time (ms.4.2..8.6.4.2-4 Typical Turn-Off Time ( =ma, I L -2 2 4 6 8 Temperature (ºC On-Resistance ( Typical On-Resistance ( =ma, I L.4.4.3.3.2.2... -4-2 2 4 6 8 Temperature (ºC LED Current (ma. 4. 4. 3. 3. 2. 2.... -4 Typical for Switch Operation -2 2 4 6 8 Temperature (ºC LED Current (ma. 4. 4. 3. 3. 2. 2.... -4 Typical for Switch Dropout -2 2 4 6 8 Temperature (ºC Typical Load Current vs. Load Voltage ( =ma 8 6 4 2-2 -4-6 -8 - -.3 -.2 -...2.3 Load Voltage (V Load Current (ma Load Current (ma 8 6 4 2 Maximum Load Current 8 =2mA 6 =ma =ma 4-4 -2 2 4 6 8 2 Temperature (ºC Blocking Voltage (V P 8 8 79 78 77 76 7 74 73-4 Typical Blocking Voltage -2 2 4 6 8 Temperature (ºC Leakage ( A.7.6..4.3.2. -4 Typical Leakage Measured across Pins 4&6 (V L =6V -2 2 4 6 8 Temperature (ºC Load Current (A 8 7 6 4 3 2 Energy Rating Curve s s ms ms ms s s s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R3 4 www.ixysic.com
Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-2, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-33. Device Moisture Sensitivity Level (MSL Rating / S MSL ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-62. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-2 must be observed. Device / S Maximum Temperature x Time 2ºC for 3 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb e3 R3 www.ixysic.com
MECHANICAL DIMENSIONS 8.382 ±.38 (.33 ±. 2.4 ±.27 (. ±. Pin.6 ±.24 (.6 ±. 6.3 ±.27 (.2 ±. 7.62 ±.24 (.3 ±. 7.239 TYP (.28 TYP 9.44 ±.8 (.36 ±.2.24 ±.27 (. ±. 6 -.8 DIA. (6 -.3 DIA. 6.3 ±.27 (.2 ±. PCB Hole Pattern 2.4 ±.27 (. ±..8 ±.27 (.2 ±. 7.62 ±.27 (.3 ±. 3.32 ±. (.3 ±.2.47 ±.76 (.8 ±.3 4.64 TYP (.6 TYP Dimensions mm (inches S 8.382 ±.38 (.33 ±. 2.4 ±.27 (. ±..63 ±.27 (.2 ±. PCB Land Pattern 2.4 (. 9.24 ±.8 (.37 ±.2 Pin 3.32 ±. (.3 ±.2.47 ±.76 (.8 ±.3.6 ±.24 (.6 ±. 6.3 ±.27 (.2 ±. 7.62 ±.24 (.3 ±..24 ±.27 (. ±..6 (.649.6 (.2 8.9 (.33 4.44 ±.24 (.7 ±..6 ±.24 (.6 ±. Dimensions mm (inches R3 6 www.ixysic.com
STR Tape & Reel 33.2 Dia (3. Dia Top Cover Tape Thickness.2 Max (.4 Max W=6. (.63 B =. (.398 Embossed Carrier Embossment K = 4.9 (.9 K = 3.8 (. P = 2. (.472 User Direction of Feed A =. (.398 Dimensions mm (inches NOTES:. All dimensions carry tolerances of EIA Standard 48-2 2. The tape complies with all Notes for constant dimensions listed on page of EIA-48-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS--R3 Copyright 22, IXYS Integrated Circuits Division OptoMOS is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 2/22/22