Dual Single-Pole, Normally Open OptoMOS Relay Parameter Ratings Units Blocking Voltage 2 V P Load Current 17 ma rms / ma DC On-Resistance (max 1 Features Current Limiting Device 37V rms Input/Output Isolation Low Drive Power Requirements (TTL/CMOS Compatible No Moving Parts High Reliability Arc-Free With No Snubbing Circuits FCC Compatible VDE Compatible No EMI/RFI Generation Small 8-Pin Package Machine Insertable, Wave Solderable Surface Mount Tape & Reel Versions Available Applications Telecounications Telecom Switching Tip/Ring Circuits Modem Switching (Laptop, Notebook, Pocket Size Hook Switch Dial Pulsing Ground Start Ringing Injection Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas Medical Equipment-Patient/Equipment Isolation Security Aerospace Industrial Controls Description is a dual single-pole, normally open (1-Form-A current-limited Solid State Relay. The combination of super efficient MOSFET switches and photovoltaic die provides 37V rms of input to output isolation. The optically coupled outputs, which use the patented OptoMOS architecture, are controlled by a highly efficient GaAIAs infrared LED. Dual single-pole OptoMOS relays provide a more compact design solution than two discrete single-pole relays in a variety of applications, and save board space by incorporating both switches in a single 8-pin package. Approvals UL Recognized Component: File E7627 CSA Certified Component: Certificate 117739 EN/IEC 69-1 Certified Component: TUV Certificate B 9 7 4941 4 Ordering Information Part # S STR LAA127PL LAA127PLTR Pin Configuration 1 + Control - Switch #1 2 Control - Switch #1 3 + Control - Switch #2 4 Control - Switch #2 Description 8-Pin DIP (/Tube 8-Pin Surface Mount (/Tube 8-Pin Surface Mount (1,/Reel 8-Pin Flatpack (/Tube 8-Pin Flatpack (1,/Reel 8 Load - Switch #1 7 Load - Switch #1 6 Load - Switch #2 Load - Switch #2 Switching Characteristics of Normally Open (Form A Devices Form-A Pb e3 9% I 1% LOAD t on t off DS--R4 www.ixysic.com 1
Absolute Maximum Ratings @ 2ºC Parameter Ratings Units Blocking Voltage 2 V P Reverse Input Voltage V Input Control Current ma Peak (1ms 1 A Input Power Dissipation 1 1 mw Total Power Dissipation 2 8 mw Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Isolation Voltage, Input to Output 37 V rms Operational Temperature -4 to +8 C Storage Temperature -4 to +12 C 1 Derate linearly 1.33 mw / C 2 Derate linearly 6.67 mw / C Electrical Characteristics @ 2ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous 1 - I L - - 17 ma rms / ma DC Peak t=1ms I LPK - - - - On-Resistance 2 I L =17mA R ON - 13 1 Off-State Leakage Current V L =2V P I LEAK - - 1 A Switching Speeds Turn-On t =ma, V L =1V on - - Turn-Off t off - - ms Output Capacitance V L =V, f=1mhz C OUT - 11 - pf Load Current Limiting - I CL 19 23 28 ma Input Characteristics Input Control Current to Activate I L =17mA - - ma Input Control Current to Deactivate - -.4.7 - ma Input Voltage Drop =ma V F.9 1.2 1.4 V Reverse Input Current V R =V I R - - 1 A Coon Characteristics Input to Output Capacitance - C I/O - 3 - pf 1 If both poles operate, the load current must be derated so as not to exceed the package power dissipation value. 2 Measurement taken within one (1 second of on-time. R4 2 www.ixysic.com
PERFORMANCE DATA @2ºC (Unless Otherwise Noted* 3 Typical LED Forward Voltage Drop (N=, =ma 2 Typical Turn-On Time (N=, =ma, I L =17mA DC 2 Typical Turn-Off Time (N=, =ma, I L =17mA DC Device Count (N 3 2 2 1 1 Device Count (N 2 1 1 Device Count (N 2 1 1 1.17 1.19 1.21 1.23 1.2 LED Forward Voltage Drop (V.33..77.99 1.21 1.43 Turn-On Time (ms..8.11.14.17.2 Turn-Off Time (ms 2 Typical for Switch Operation (N=, I L =17mA DC 2 Typical for Switch Dropout (N=, I L =17mA DC 3 Typical On-Resistance Distribution (N=, =ma, I L =17mA DC Device Count (N 2 1 1 Device Count (N 2 1 1 Device Count (N 3 2 2 1 1.4.63.81.99 1.17 1.3 1.3 LED Current (ma.4.63.81.99 1.17 1.3 1.3 LED Current (ma 11.2 11.7 12.2 12.7 13.2 13.7 On-Resistance ( Device Count (N 3 3 2 2 1 1 Typical Blocking Voltage Distribution (N= 262. 267. 272. 277. 282. 287. Blocking Voltage (V P LED Forward Voltage Drop (V 1.8 1.6 1.4 1.2 1. Typical LED Forward Voltage Drop =ma =3mA =2mA =1mA =ma.8-4 -2 2 4 6 8 1 12 Temperature (ºC Turn-On Time (ms.7.6..4.3.2.1 Typical Turn-On Time vs. LED Forward Current =17mA DC 1 1 2 2 3 3 4 4 LED Forward Current (ma Turn-Off Time (ms.14.12.1.8.6.4.2 Typical Turn-Off Time vs. LED Forward Current =17mA DC 1 1 2 2 3 3 4 4 LED Forward Current (ma *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R4 www.ixysic.com 3
PERFORMANCE DATA @2ºC (Unless Otherwise Noted* Turn-On Time (ms 3. 2. 2. 1. 1.. -4 Typical Turn-On Time =17mA DC =ma =1mA =2mA -2 2 4 6 8 1 Temperature (ºC Turn-Off Time (ms.18.16.14.12.1.8.6.4.2-4 Typical Turn-Off Time ( =ma, I L =17mA DC -2 2 4 6 8 1 Temperature (ºC On-Resistance ( Typical On-Resistance ( =ma, I L =17mA DC 6 4 3 2 1-4 -2 2 4 6 8 1 Temperature (ºC 2. Typical for Switch Operation ( =17mA DC 2. Typical for Switch Dropout =17mA DC 2 Typical Load Current vs. Load Voltage ( =ma LED Current (ma 2. 1. 1.. LED Current (ma 2. 1. 1.. Load Current (ma 1 1 - -1-1 -4-2 2 4 6 8 1 Temperature (ºC -4-2 2 4 6 8 1 Temperature (ºC -2-2. -2. -1. -1. -.. 1. 1. 2. 2. Load Voltage (V Load Current (ma 3 2 2 1 1 Maximum Load Current =2mA =1mA =ma -4-2 2 4 6 8 1 12 Temperature (ºC Blocking Voltage (V P 29 28 28 27 27 26 26 2-4 Typical Blocking Voltage -2 2 4 6 8 1 Temperature (ºC Leakage ( A.14.12.1.8.6.4.2-4 Typical Leakage Measured across Pins &6 or 7&8-2 2 4 6 8 1 Temperature (ºC 1.2 1. Energy Rating Curve Typical Current Limiting ( =ma 3 2 Load Current (A.8.6.4.2 Current (ma 2 1 1 1 s 1 s 1ms 1ms 1ms 1s 1s 1s Time -4-2 2 4 6 8 1 Temperature (ºC *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R4 4 www.ixysic.com
Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-2, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-33. Device Moisture Sensitivity Level (MSL Rating / S / LAA127PL MSL 1 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-62. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-2 must be observed. Device / S LAA127PL Maximum Temperature x Time 2ºC for 3 seconds 26ºC for 3 seconds Board Wash IXYS Integrated Circuits Division recoends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb e3 R4 www.ixysic.com
MECHANICAL DIMENSIONS 2.4 ±.127 (.1 ±. 6.3 ±.127 (.2 ±. Pin 1.47 ±.76 (.18 ±.3 4.64 TYP (.16 9.62 ±.381 (.38 ±.1 3.32 ±.1 (.13 ±.2 7.62 ±.24 (.3 ±.1 9.144 ±.8 (.36 ±.2 7.239 TYP. (.28.24 ±.127 (.1 ±. 8-.8 DIA. (8-.31 DIA. 6.3 ±.127 (.2 ±. 7.62 ±.127 (.3 ±. PCB Hole Pattern 2.4 ±.127 (.1 ±. 7.62 ±.127 (.3 ±..813 ±.12 (.32 ±.4 (inches S 2.4 ±.127 (.1 ±. 9.62 ±.381 (.38 ±.1 3.32 ±.1 (.13 ±.2.63 ±.127 (.2 ±. PCB Land Pattern 2.4 (.1 6.3 ±.127 (.2 ±. Pin 1 9.2 ±.24 (.37 ±.1.47 ±.76 (.18 ±.3 7.62 ±.24 (.3 ±.1.24 ±.127 (.1 ±. 1.6 (.649.6 (.2 8.9 (.33 4.44 ±.127 (.17 ±..813 ±.12 (.32 ±.4 (inches LAA127PL 2.4 ±.127 (.1 ±. 6.3 ±.127 (.2 ±. Pin 1 9.398 ±.127 (.37 ±. 9.62 ±.381 (.38 ±.1 2.19 ±.2 (.8 ±.1 MIN /.12 MAX ( MIN /.4 MAX 7.62 ±.24 (.3 ±.1.23 ±.13 (.8 ±. 2.286 MAX. (.9 MAX..63 ±.127 (.2 ±. 1. (.61 PCB Land Pattern.6 (.2 2.4 (.1 8.7 (.342.47 ±.76 (.18 ±.3.864 ±.12 (.34 ±.4 (inches R4 6 www.ixysic.com
STR Tape & Reel MECHANICAL DIMENSIONS 33.2 DIA. (13. DIA. Top Cover Tape Thickness.12 MAX. (.4 MAX. Bo=1.3 (.46 W=16. (.63 Embossed Carrier Embossment K =4.9 (.193 K 1 =4.2 (.16 Ao=1.3 (.46 P=12. (.472 User Direction of Feed (inches NOTES: 1. carry tolerances of EIA Standard 481-2 2. Tape complies with all Notes for constant dimensions listed on page of EIA-481-2 LAA127PLTR Tape & Reel 33.2 DIA. (13. DIA. 2. (.79 4. (.17 Top Cover Tape Thickness.12 MAX. (.4 MAX. 7. (.29 Bo = 1.3 (.46 W = 16. (.63 Embossed Carrier K = 2.7 (.16 K 1 = 2. (.79 P = 12. (.472 User Direction of Feed Ao = 1.3 (.46 (inches Embossment NOTES: 1. All dimensions carry tolerances of EIA Standard 481-2 2. The tape complies with all Notes for constant dimensions listed on page of EIA-481-2 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS--R4 Copyright 212, IXYS Integrated Circuits Division OptoMOS is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/19/212