Quad 7 ns Single Supply Comparator AD8564

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Quad 7 ns Single Supply Comparator AD8564 FEATURES 5 V single-supply operation 7 ns propagation delay Low power Separate input and output sections TTL/CMOS logic-compatible outputs Wide output swing TSSOP, SOIC, and PDIP packages APPLICATIONS High speed timing Line receivers Data communications High speed V-to-F converters Battery operated instrumentation High speed sampling systems Window comparators PCMCIA cards Upgrade for MAX9 designs PIN CONFIGURATIONS IN A +IN A GND OUT A OUT B V ANA +IN B IN B IN A +IN A GND OUT A OUT B V ANA +IN B IN B 6 AD8564 8 9 Figure. 6-Lead TSSOP (RU-6) IN D +IN D V +ANA OUT D OUT C V +DIG +IN C IN C IN D +IN D V +ANA OUT D OUT C V +DIG +IN C IN C AD8564 Figure 2. 6-Lead Narrow Body SOIC (R-6) 3-3-3 IN A 6 IN D +IN A GND 2 3 + + 5 4 +IN D V +ANA OUT A OUT B 4 5 AD8564 3 2 OUT D OUT C GENERAL DESCRIPTION The AD8564 is a quad 7 ns comparator with separate input and output supplies, thus enabling the input stage to be operated from ±5 V dual supplies or a 5 V single supply while maintaining a CMOS-/TTL-compatible output. Fast 7 ns propagation delay makes the AD8564 a good choice for timing circuits and line receivers. Independent analog and digital supplies provide excellent protection from supply pin interaction. The AD8564 is pin compatible with the MAX9 and has lower supply currents. V ANA +IN B IN B 6 7 8 + + V +DIG +IN C 9 IN C Figure 3. 6-Lead PDIP (N-6) All four comparators have similar propagation delays. The propagation delay for rising and falling signals is similar, and tracks over temperature and voltage. These characteristics make the AD8564 a good choice for high speed timing and data communications circuits. For a similar single comparator with latch function, refer to the AD856 data sheet. The AD8564 is specified over the industrial temperature range ( 4 C to +25 C). The quad AD8564 is available in the 6-lead TSSOP, 6-lead narrow body SOIC, and 6-lead plastic DIP packages. 3-2 Rev. B Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 96, Norwood, MA 262-96, U.S.A. Tel: 78.329.47 www.analog.com Fax: 78.46.33 999 27 Analog Devices, Inc. All rights reserved.

TABLE OF CONTENTS Features... Applications... Pin Configurations... General Description... Revision History... 2 Specifications... 3 Electrical Specifications... 3 Absolute Maximum Ratings... 5 Thermal Resistance... 5 ESD Caution...5 Typical Performance Characteristics...6 Applications Information...9 Optimizing High Speed Performance...9 Output Loading Considerations...9 Input Stage and Bias Currents...9 Using Hysteresis... Outline Dimensions... Ordering Guide... 2 REVISION HISTORY 8/7 Rev. A to Rev. B Updated Format...Universal Changes to Applications... Changes to General Description... Changes to Specifications... 3 Changes to the Absolute Maximum Ratings Section... 5 Changes to the Applications Information Section... 9 Deleted Spice Model Section... Updated Outline Dimensions... 2 Changes to Ordering Guide... 3 6/99 Rev. to Rev. A Rev. B Page 2 of 2

SPECIFICATIONS ELECTRICAL SPECIFICATIONS V+ANA = V+DIG = 5. V, V ANA = V, TA = 25 C, unless otherwise noted. Table. Parameter Symbol Conditions Min Typ Max Unit INPUT CHARACTERISTICS Offset Voltage VOS 2.3 7 mv 4 C TA +25 C 8 mv Offset Voltage Drift ΔVOS/ΔT 4 μv/ C Input Bias Current IB VCM = V ±4 μa 4 C TA +25 C ±9 μa Input Offset Current IOS VCM = V ±3 μa Input Common-Mode Voltage Range VCM 2.75 V Common-Mode Rejection Ratio CMRR V VCM 3. V 65 85 db Large Signal Voltage Gain AVO RL = kω 3 V/V Input Capacitance CIN 3. pf DIGITAL OUTPUTS Logic Voltage VOH IOH = 3.2 ma, ΔVIN > 25 mv 2.4 3.5 V Logic Voltage VOL IOL = 3.2 ma, VIN > 25 mv.3.4 V DYNAMIC PERFORMANCE 2 Propagation Delay tp 2 mv step with mv overdrive 6.75 9.8 ns 4 C TA +25 C 3 ns mv step with 5 mv overdrive 8 ns Differential Propagation Delay (Rising Propagation Delay vs. ΔtP mv step with 2 mv overdrive.5 2. ns Falling Propagation Delay) Rise Time 2% to 8% 3.8 ns Fall Time 2% to 8%.5 ns POWER SUPPLY Power Supply Rejection Ratio PSRR 4.5 V V+ANA and V+DIG 5.5 V 8 db Analog Supply Current I+ANA.5 4. ma 4 C TA +85 C 5.6 ma 4 C TA +25 C 7 ma Digital Supply Current IDIG VO = V, RL = 6. 7. ma 4 C TA +25 C 8. ma Analog Supply Current I ANA 7. +4. ma 4 C TA +85 C 5.6 ma 4 C TA +25 C 7 ma Full electrical specifications to 55 C, but these package types are guaranteed for operation from 4 C to +25 C only. Package reliability below 4 C is not guaranteed. 2 Guaranteed by design. Rev. B Page 3 of 2

V+ANA = V+DIG = 5. V, V ANA = 5 V, TA = 25 C, unless otherwise noted. Table 2. Parameter Symbol Conditions Min Typ Max Unit INPUT CHARACTERISTICS Offset Voltage VOS 2.3 7 mv 4 C TA +25 C mv Offset Voltage Drift ΔVOS/ΔT 4 μv/ C Input Bias Current IB VCM = V ±4 μa 4 C TA +25 C ±9 μa Input Offset Current IOS VCM = V ±3 μa Input Common-Mode Voltage Range VCM 4.9 +3.5 V Common-Mode Rejection Ratio CMRR V VCM 3. V 65 85 db Large Signal Voltage Gain AVO RL = kω 3 V/V Input Capacitance CIN 3. pf DIGITAL OUTPUTS Logic Voltage VOH IOH = 3.2 ma, ΔVIN > +25 mv 2.6 3.6 V Logic Voltage VOL IOL = 3.2 ma, ΔVIN > 25 mv.2.3 V DYNAMIC PERFORMANCE 2 Propagation Delay tp 2 mv step with mv overdrive 6.75 9.8 ns 4 C TA +85 C 8 3 ns mv step with 5 mv overdrive 8 ns Differential Propagation Delay (Rising Propagation Delay ΔtP mv step with 2 mv overdrive.5 2. ns vs. Falling Propagation Delay) Rise Time 2% to 8% 3 ns Fall Time 2% to 8% 3 ns POWER SUPPLY Power Supply Rejection Ratio PSRR 4.5 V V+ANA and V+DIG 5.5 V 5 7 db Analog Supply Current I+ANA.8 4. ma 4 C TA +85 C 5.6 ma 4 C TA +25 C 7 ma Digital Supply Current IDIG VO = V, RL = 3.6 4.4 ma 4 C TA +25 C 5.6 ma Analog Supply Current I ANA 8.2 +4. ma 4 C TA +85 C 5.6 ma 4 C TA +25 C 7 ma Full electrical specifications to 55 C, but these package types are guaranteed for operation from 4 C to +25 C only. Package reliability below 4 C is not guaranteed. 2 Guaranteed by design. Rev. B Page 4 of 2

ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating Total Analog Supply Voltage 4 V Digital Supply Voltage 7 V Analog Positive Supply to Digital Positive Supply 6 mv Input Voltage ±7 V Differential Input Voltage ±8 V Output Short-Circuit Duration to GND Indefinite Storage Temperature Range 65 C to +5 C Operating Temperature Range 55 C to +25 C Junction Temperature Range 65 C to +5 C Lead Temperature Range (Soldering, sec) 3 C The analog input voltage is equal to ±7 V or the analog supply voltage, whichever is less. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE θja is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages (SOIC and TSSOP). θja is specified for device in socket for PDIP. Table 4. Thermal Resistance Package Type θja θjc Unit 6-Lead PDIP (N) 9 47 C/W 6-Lead Narrow Body SOIC (R) 3 37 C/W 6-Lead TSSOP (RU) 8 37 C/W ESD CAUTION Rev. B Page 5 of 2

TYPICAL PERFORMANCE CHARACTERISTICS V+ANA = V+DIG = 5 V, V ANA = V, TA = 25 C, unless otherwise noted.. 5 INPUT OFFSET VOLTAGE (mv).8.6.4.2 NUMBER OF AMPLIFIERS 4 3 2 75 5 25 25 5 75 25 5 TEMPERATURE ( C) Figure 4. Input Offset Voltage vs. Temperature 3-4 5 4 3 2 2 3 4 INPUT OFFSET VOLTAGE (mv) Figure 7. Input Offset Voltage Distribution 5 3-7 STEPSIZE = mv OVERDRIVE = 5mV 8 INPUT BIAS CURRENT (µa) 2 3 4 PROPAGATION DELAY (ns) 6 4 2 t PDHL t PDLH 5 75 5 25 25 5 75 25 5 TEMPERATURE ( C) Figure 5. Input Bias Current vs. Temperature 3-5 5 25 25 5 75 25 TEMPERATURE ( C) Figure 8. Propagation Delay, tpdhl/tpdlh vs. Temperature 3-8 V +ANA = V +DIG = +5V V ANA = 5V 5. INPUT BIAS CURRENT (µa) 2 3 4 OUTPUT HIGH VOLTAGE (mv) 4.4 3.8 3.2 2.6 T A = +85 C T A = 4 C T A = +25 C 5 7.5 5. 2.5 2.5 5. INPUT COMMON-MODE VOLTAGE (V) Figure 6. Input Bias Current vs. Input Common-Mode Voltage 3-6 2. 3 6 9 2 SOURCE CURRENT (ma) Figure 9. Output High Voltage, VOH vs. Source Current 5 3-9 Rev. B Page 6 of 2

.5 3. OUTPUT LOW VOLTAGE (V).4.3.2. T A = +25 C T A = 4 C T A = +85 C I +DIG SUPPLY CURRENT (ma) 2.5 2..5..5 T A = +25 C T A = +85 C T A = 4 C 3 6 9 2 5 5 SINK CURRENT (ma) Figure. Output Low Voltage, VOL vs. Sink Current 3-2 4 6 8 2 V +DIG SUPPLY VOLTAGE (V) Figure 3. I+DIG Supply Current/Comparator vs. V+DIG Supply Voltage 5 3-3 I +ANA SUPPLY CURRENT (ma) 4 3 2 T A = +85 C T A = +25 C T A = 4 C I +ANA SUPPLY CURRENT (ma) 4 3 2 V +ANA = ±5V V +ANA = +5V 2 4 6 8 2 V +ANA SUPPLY VOLTAGE (V) Figure. I+ANA Supply Current/Comparator vs. V+ANA Supply Voltage 3-75 5 25 25 5 75 25 5 TEMPERATURE ( C) Figure 4. I+ANA Supply Current/Comparator vs. Temperature 3-4 I ANA SUPPLY CURRENT (ma) 2 3 4 T A = 4 C T A = +25 C T A = +85 C I ANA SUPPLY CURRENT (ma) 2 3 4 V +ANA = +5V V +ANA = ±5V 5 2 4 6 8 2 V ANA SUPPLY VOLTAGE (V) Figure 2. I ANA Supply Current/Comparator vs. V ANA Supply Voltage 3-2 5 75 5 25 25 5 75 25 5 TEMPERATURE ( C) Figure 5. I ANA Supply Current/Comparator vs. Temperature 3-5 Rev. B Page 7 of 2

2. I +DIG SUPPLY CURRENT (ma).5..5 75 5 25 25 5 75 25 5 TEMPERATURE ( C) Figure 6. I+DIG Supply Current/Comparator vs. Temperature 3-6 Rev. B Page 8 of 2

APPLICATIONS INFORMATION OPTIMIZING HIGH SPEED PERFORMANCE As with any high speed comparator or amplifier, proper design and layout techniques should be used to ensure optimal performance from the AD8564. The performance limits of high speed circuitry can easily be a result of stray capacitance, improper ground impedance, or other layout issues. Minimizing resistance from the source to the input is an important consideration in maximizing the high speed operation of the AD8564. Source resistance, in combination with equivalent input capacitance, may cause a lagged response at the input, thus delaying the output. The input capacitance of the AD8564, in combination with stray capacitance from an input pin to ground, may result in several picofarads of equivalent capacitance. A combination of 3 kω source resistance and 5 pf of input capacitance yields a time constant of 5 ns, which is slower than the 5 ns capability of the AD8564. Source impedances should be less than kω for the best performance. It is also important to provide bypass capacitors for the power supply in a high speed application. A μf electrolytic bypass capacitor should be placed within.5 inches of each power supply pin to ground. These capacitors reduce any potential voltage ripples from the power supply. In addition, a nf ceramic capacitor should be placed as close as possible to the power supply pins to ground. These capacitors act as a charge reservoir for the device during high frequency switching. A ground plane is recommended for proper high speed performance. This can be created by using a continuous conductive plane over the surface of the circuit board, only allowing breaks in the plane for necessary current paths. The ground plane provides a low inductance ground, eliminating any potential differences at different ground points throughout the circuit board caused from ground bounce. A proper ground plane also minimizes the effects of stray capacitance on the circuit board. OUTPUT LOADING CONSIDERATIONS The AD8564 output can deliver up to 4 ma of output current without any significant increase in propagation delay. The output of the device should not be connected to more than 2 TTL input logic gates or drive a load resistance less than Ω. To ensure the best performance from the AD8564, it is important to minimize capacitive loading of the output of the device. Capacitive loads greater than 5 pf cause ringing on the output waveform and reduce the operating bandwidth of the comparator. Propagation delay also increases with capacitive loads above pf. INPUT STAGE AND BIAS CURRENTS The AD8564 uses a PNP differential input stage that enables the input common-mode range to extend all the way from the negative supply rail to within 2.2 V of the positive supply rail. The input common-mode voltage can be found as the average of the voltage at the two inputs of the device. To ensure the fastest response time, care should be taken to not allow the input common-mode voltage to exceed this voltage. The input bias current for the AD8564 is 4 μa. As with any PNP differential input stage, this bias current goes to on an input that is high and doubles on an input that is low. Care should be taken in choosing resistor values to be connected to the inputs because large resistors could cause significant voltage drops due to the input bias current. The input capacitance for the AD8564 is typically 3 pf. This can be measured by inserting a large source resistance to the input and measuring the change in propagation delay. Rev. B Page 9 of 2

USING HYSTERESIS Hysteresis can easily be added to a comparator through the addition of positive feedback. Adding hysteresis to a comparator offers an advantage in noisy environments where it is not desirable for the output to toggle between states when the input signal is near the switching threshold. Figure 7 shows a method for configuring the AD8564 with hysteresis. V REF SIGNAL R COMPARATOR Figure 7. Configuring the AD8564 with Hysteresis The input signal is connected directly to the inverting input of the comparator. The output is fed back to the noninverting input through R2 and R. The ratio of R to R + R2 and the output swing establishes the width of the hysteresis window, with VREF setting the center of the window or the average switching voltage. The output switches high when the input R2 C F 3-7 voltage is greater than VHI and does not switch low again until the input voltage is less than VLO, as given in Equation 2. V HI R ( V VREF ) VREF = + () R + R2 R V LO = VREF (2) R + R2 where V+ is the positive supply voltage. The CF capacitor may also be added to introduce a pole into the feedback network. This has the effect of increasing the amount of hysteresis at high frequencies. This can be useful when comparing a relatively slow signal in a high frequency noise environment. At frequencies greater than fp =, the hysteresis 2 πcfr2 window approaches VHI = V+ V and VLO = V. At frequencies less than fp, the threshold voltages remain as it is in Equation. Rev. B Page of 2

OUTLINE DIMENSIONS.8 (2.32).79 (2.7).78 (9.8).2 (5.33) MAX.5 (3.8).3 (3.3).5 (2.92).22 (.56).8 (.46).4 (.36) 6. (2.54) BSC.7 (.78).6 (.52).45 (.4) 9 8.28 (7.).25 (6.35).24 (6.).5 (.38) MIN SEATING PLANE.5 (.3) MIN.6 (.52) MAX.5 (.38) GAUGE PLANE.325 (8.26).3 (7.87).3 (7.62).43 (.92) MAX.95 (4.95).3 (3.3).5 (2.92).4 (.36). (.25).8 (.2) COMPLIANT TO JEDEC STANDARDS MS--AB CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS. Figure 8. 6-Lead Plastic Dual In-Line Package [PDIP] (N-6) Dimensions shown in inches and (millimeters) 736-B. (.3937) 9.8 (.3858) 4. (.575) 3.8 (.496) 6 9 8 6.2 (.244) 5.8 (.2283).25 (.98). (.39) COPLANARITY..27 (.5) BSC.5 (.2).3 (.22).75 (.689).35 (.53) SEATING PLANE 8.25 (.98).7 (.67).5 (.97).25 (.98).27 (.5).4 (.57) 45 COMPLIANT TO JEDEC STANDARDS MS-2-AC CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS (IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN. Figure 9. 6-Lead Standard Small Outline Package [SOIC_N] Narrow Body (R-6) Dimensions shown in millimeters and (inches) 666-A Rev. B Page of 2

5. 5. 4.9 6 9 4.5 4.4 4.3 6.4 BSC 8.5.5 PIN.65 BSC.3.9 COPLANARITY..2 MAX.2.9.75 SEATING PLANE 8.6.45 COMPLIANT TO JEDEC STANDARDS MO-53-AB Figure 2. 6-Lead Thin Shrink Small Outline Package [TSSOP] (RU-6) Dimensions shown in millimeters ORDERING GUIDE Model Temperature Range Package Description Package Option AD8564AN 4 C to +25 C 6-Lead Plastic Dual In-Line Package [PDIP] N-6 AD8564ANZ 4 C to +25 C 6-Lead Plastic Dual In-Line Package [PDIP] N-6 AD8564AR 4 C to +25 C 6-Lead Standard Small Outline Package [SOIC_N] R-6 AD8564AR-REEL 4 C to +25 C 6-Lead Standard Small Outline Package [SOIC_N] R-6 AD8564AR-REEL7 4 C to +25 C 6-Lead Standard Small Outline Package [SOIC_N] R-6 AD8564ARZ 4 C to +25 C 6-Lead Standard Small Outline Package [SOIC_N] R-6 AD8564ARZ-REEL 4 C to +25 C 6-Lead Standard Small Outline Package [SOIC_N] R-6 AD8564ARZ-REEL7 4 C to +25 C 6-Lead Standard Small Outline Package [SOIC_N] R-6 AD8564ARU-REEL 4 C to +25 C 6-Lead Thin Shrink Small Outline Package [TSSOP] RU-6 AD8564ARUZ-REEL 4 C to +25 C 6-Lead Thin Shrink Small Outline Package [TSSOP] RU-6 Z = RoHS Compliant Part. 999 27 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. C3--8/7(B) Rev. B Page 2 of 2