SMD Photovoltaic Solar Cell Protection Rectifier

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Transcription:

SMD Photovoltaic Solar Cell Protection Rectifier esmp Series 2 Anode Cathode Anode 2 FEATURES Very low profile - typical height of. mm Ideal for automated placement Glass passivated pellet chip junction Low forward voltage drop High forward surge capability Low thermal resistance Meets MSL level, per J-STD-020, LF maximum peak of 260 C Material categorization: for definitions of compliance please see www.vishay.com/doc?9992 PRIMARY CHARACTERISTICS I F(AV) 5.0 A V RRM 0 V I FSM A I R 0 μa V F at I F = 5.0 A 0.90 V T J max. 50 C Package Diode variations Single die TYPICAL APPLICATIONS For use in solar cell panel blocking diode for protection, using DC forward current without reverse bias. MECHANICAL DATA Case: Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free, RoHS-compliant, and commercial grade Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B02 E3 suffix meets JESD 20 class A whisker test MAXIMUM RATINGS ( unless otherwise noted) PARAMETER SYMBOL UNIT Device marking code 5PMS Max. repetitive peak reverse voltage V RRM 0 V Max. DC forward current (fig. ) () Mounted on 30 mm x 30 mm Al PCB (2) Free air, mounted on recommended copper pad area (3) Meets the requirements of IEC 625 Ed. 2 bypass diode thermal test T M = 30 C 5.0 () I F A.8 (2) Peak forward surge current 0 ms single half sine-wave superimposed on rated load I FSM A Operating junction and storage temperature range T OP, T STG -55 to +50 C Junction temperature in DC forward current without reverse bias, t h (3) T J 200 C Revision: 9-Feb-6 Document Number: 8949

DC Forward Current (A) Average Power Loss (W) www.vishay.com ELECTRICAL CHARACTERISTICS ( unless otherwise noted) PARAMETER TEST CONDITIONS SYMBOL TYP. MAX. UNIT I F = 2.5 A 0.94 - I F = 5.0 A Instantaneous forward voltage V () 0.99.5 F V I F = 2.5 A 0.82 - T A = 25 C I F = 5.0 A 0.90.00 Reverse current Rated V R I (2) - 0 R μa T A = 25 C 55 Max. reverse recovery time I F = 0.5 A, I R =.0 A, I rr = 0.25 A t rr 2.5 - μs Typical junction capacitance 4.0 V, MHz C J 30 - pf () Pulse test: 300 μs pulse width, % duty cycle (2) Pulse test: Pulse width 40 ms THERMAL CHARACTERISTICS ( unless otherwise noted) PARAMETER SYMBOL UNIT Typical thermal resistance R JA () 90 R JM (2) 3 () Free air, mounted on recommended copper pad area. Thermal resistance R JA - junction to ambient (2) Mounted on 30 mm x 30 mm Al PCB. Thermal resistance R JM - junction to mount C/W ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACAGE CODE BASE QUANTITY DELIVERY MODE -M3/86A 0.0 86A 500 7" diameter plastic tape and reel -M3/87A 0.0 87A 6500 3" diameter plastic tape and reel RATINGS AND CHARACTERISTICS CURVES ( unless otherwise noted) 6.0 5.0 T M = 30 C () 6.0 5.0 D = 0.5 D = 0.8 D = 0.2 D = 0.3 4.0 4.0 D = 0. D =.0 3.0 3.0 2.0 2.0 T.0 (2).0 D = t p /T t p 0 0 25 50 75 25 50 Ambient Temperature ( C) Fig. - Forward Current Derating Curve () Mounted on 30 mm x 30 mm Al PCB T M measured at the terminal (R JM = 3.0 C/W) (2) Free air, mounted on recommended copper pad area (R JA = 90 C/W) 0 0 2 3 4 5 6 Average Forward Current (A) Fig. 2 - Forward Power Loss Characteristics Revision: 9-Feb-6 2 Document Number: 8949

Instantaneous Reverse Current (μa) Instantaneous Forward Current (A) Junction Capacitance (pf) www.vishay.com 0 T A = 25 C T A = 50 C T J = 25 C f =.0 MHz V sig = 50 mv p-p 0. 0.0 0.4 0.5 0.6 0.7 0.8 0.9.0..2.3.4.5 Instantaneous Forward Voltage (V) Fig. 3 - Typical Instantaneous Forward Characteristics 0 0. 0 Reverse Voltage (V) Fig. 5 - Typical Junction Capacitance 0 0 T A = 50 C T A = 25 C 0. 0.0 0 20 30 40 50 60 70 80 90 Percent of Rated Peak Reverse Voltage (%) Fig. 4 - Typical Reverse Leakage Characteristics Revision: 9-Feb-6 3 Document Number: 8949

PACAGE OUTLINE DIMENSIONS in inches (millimeters) 0.87 (4.75) 0.75 (4.45) 0.06 (0.40) 0.006 (0.5) 0.262 (6.65) 0.250 (6.35) 0.242 (6.5) 0.238 (6.05) 2 0.7 (4.35) 0.67 (4.25) 0.047 (.20) 0.039 (.00) 0.46 (3.70) 0.34 (3.40) 0.087 (2.20) 0.075 (.90) Mounting Pad Layout 0.89 (4.80) 0.89 (4.80) 0.73 (4.40) 0.55 (3.94) NOM. 0.268 (6.80) 0.86 (4.72) 0.030 (0.75) NOM. 0.049 (.24) 0.037 (0.94) 0.050 (.27) 0.084 (2.3) NOM. 0.053 (.35) 0.04 (.05) Conform to JEDEC TO-277A 0.04 (.04) 0.055 (.40) Revision: 9-Feb-6 4 Document Number: 8949

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