Doc No. 4-EA-14995 For rectification Features Average Forward Current IF(AV) 0.5 A rectification is possible Low Forward Voltage High power capability due to Chip Size Package RoHS compliant (EU RoHS / MSL:Level 1 compliant) 2 0.6 Unit: mm Marking Symbol: A3 Packaging Embossed type (hermo-compression sealing) : 20 000 pcs / reel (standard) Absolute Maximum Ratings Parameter Reverse Voltage *1 Symbol VR Min - Maximum Peak Reverse Voltage *1 VRM - 30 V Average Forward Current *2,3 IF(AV) - 0.5 A 1. Cathode Average Forward Current *2,4 IF(AV) - 0.5 A 2. Anode Non-repetitive Peak Surge Forward Current *1,5 IFSM - 5 A Operating Junction emperature *6 j - 150 C Panasonic DCSP0603010-N1 Ambient emperature a -40 +150 C JEIA Storage emperature stg -55 +150 C Code Note) *1: a = j = 25 *2: Squre wave : σ = 0.5 *3: a 82, when device mounted on a FR4 PCB (25.4mm 25.4mm, 1mm thick), copper wiring (108.0mm 2 area, 36μm thick). *4: sp 138 *5: Squre wave : p = 5 ms *6: Power derating is necessary so that j < 150. IF p p ime Electrical Characteristics a = 25 C ± 3 C Parameter Symbol Conditions Min yp Max Unit Forward Voltage VF IF = 0.5 A - 9 V Reverse Current IR VR = 30 V - 50 225 μa erminal Capacitance Ct VR = 10 V, f = 1 MHz - 10 - pf Reverse Recovery ime *1 trr IF = IR = 100 ma, Irr = 10 ma - 3.2 - ns Note) 1. Measuring methods are based on JAPANESE INDUSRIAL SANDARD JIS C 7031 measuring methods for diodes. 2. his product is sensitive to electric shock (static electricity, etc.). Due attention must be paid on the charge of a human body and the leakage of current from the operating equipment. 3. *1: Measurement circuit, input pulse, output pulse for Reverse recovery time (Measurement circuit) (Input pulse) (Output pulse) DU Max 30 tr tp 10% Unit V t 1 0.1 IF 0.0425 trr 0.215 2 1 0.115 0.115 0.215 t VR 90% IR Irr = IR 10 Bias Insertion Unit (N-50BU) tp = 2 μs IF = 100 ma Pulse Generator (PG-10N), RS = 50 Ω tr = 5 ns IR = 100 ma Wave Form Analyzer (SAS-8130), Ri = 50 Ω σ = 0.05 Irr = 10 ma 1 of 8
Doc No. 4-EA-14995 Electrical Characteristics echnical Data (Reference) IF - VF / ypical Data Ct - VR / ypical Data 1.0E+00 50 1.0E-01 40 Forward Current : IF [A] 1.0E-02 1.0E-03 1.0E-04 erminal Capacitance : Ct [pf] 30 20 10 1.0E-05 0 0.1 0.2 0.5 0.6 0 0 10 20 30 Forward Voltage : VF [V] Reverse Voltage : VR [V] 1.0E-01 1.0E-02 1.0E-03 IR - VR / ypical Data a = a = a = a = a = 150 125 85 25-40 Reverse Current : IR [A] 1.0E-04 1.0E-05 1.0E-06 1.0E-07 1.0E-08 1.0E-09 0 10 20 30 Reverse Voltage : VR [V] 2 of 8
Doc No. 4-EA-14995 Electrical Characteristics echnical Data (Reference) Average Forward Power Dissipation : PF(AV) [W] 0 5 0 0.25 0.20 0.15 0.10 0.05 0.00 PF(AV) - IF(AV) / ypical Data j = 25 C IF p ime p σ= 1.0 σ= 0.8 σ= 0.5 σ= 0 0.1 0.2 0.5 0.6 0.7 0.8 PR(AV) - VR / ypical Data 0.0020 Average Reverse Power Dissipation : PR(AV) [W] 0.0015 0.0010 0.0005 j = 25 C VR p σ= 1.0 σ= 0.7 σ= 0.5 σ= 0.2 ime p 0.0000 0 5 10 15 20 25 30 35 Reverse Voltage : VR [V] 3 of 8
Doc No. 4-EA-14995 Electrical Characteristics echnical Data (Reference) Average Forward Power Dissipation : PF(AV) [W] 0 5 0 0.25 0.20 0.15 0.10 0.05 0.00 j = 150 C PF(AV) - IF(AV) / ypical Data 0 0.1 0.2 0.5 0.6 0.7 0.8 IF p σ= 1.0 σ= 0.8 σ= 0.5 σ= ime p PR(AV) - VR / ypical Data 0.70 Average Reverse Power Dissipation : PR(AV) [W] 0.60 0.50 0 0 0.20 0.10 j = 125 C VR p σ= 1.0 σ= 0.7 σ= 0.5 σ= 0.2 ime p 0.00 0 5 10 15 20 25 30 35 Reverse Voltage : VR [V] 4 of 8
Doc No. 4-EA-14995 hermal Characteristics Parameter Symbol Conditions Min yp Max hermal Resistance, Junction to Solder Point R th(j-sp) a = 25, in free air - 35 - Unit C/W hermal Resistance, Junction to Ambient *1 R th(j-a) a = 25, in free air - 610 - C/W hermal Resistance, Junction to Ambient *2 R th(j-a) a = 25, in free air - 202 - C/W Note) *1: Device mounted on a FR4 PCB (25.4mm 25.4mm, 1mm thick), copper wiring (27.6mm 2 area, 36μm thick). *2: Device mounted on a FR4 PCB (25.4mm 25.4mm, 1mm thick), copper wiring (108.0mm 2 area, 36μm thick). Copper wiring (27.6mm 2 ) Copper wiring (108.0mm 2 ) 25.4mm 25.4mm FR4 PCB 25.4mm FR4 PCB 25.4mm hermal Characteristics echnical Data (Reference) 1000 Rth - *1 / ypical Data hermal Resistance : Rth [/W] 100 10 0.001 0.01 0.1 1 10 100 1000 Applying ime : [s] Note) *1: Single pulse measurement Device mounted on a FR4 PCB (25.4mm 25.4mm, 1mm thick), copper wiring (27.6mm 2 area, 36μm thick). Power Device mounted on a FR4 PCB (25.4mm 25.4mm, 1mm thick), copper wiring (108.0mm 2 area, 36μm thick). ime Applying ime : 5 of 8
Doc No. 4-EA-14995 hermal Characteristics echnical Data (Reference) Effective ransient hermal Resistance [/W] 1000 100 Effective ransient hermal Resistance - p *1 / ypical Data (6) 10 0.0001 0.001 0.01 0.1 1 10 100 1000 p [s] Power p σ = 0.5 σ = 0.2 σ = 0.1 σ = 0.05 σ = 0.02 (6) σ = 0 ime p Effective ransient hermal Resistance - p *2 / ypical Data Effective ransient hermal Resistance [/W] Note) 100 (6) σ = 0.5 σ = 0.2 σ = 0.1 10 σ = 0.05 σ = 0.02 0.0001 0.001 0.01 0.1 1 10 100 1000 (6) σ = 0 p [s] *1: Device mounted on a FR4 PCB (25.4mm 25.4mm, 1mm thick), copper wiring (27.6mm 2 area, 36μm thick). *2: Device mounted on a FR4 PCB (25.4mm 25.4mm, 1mm thick), copper wiring (108.0mm 2 area, 36μm thick). Power p ime p 6 of 8
Doc No. 4-EA-14995 Power Derating echnical Data (Reference) IF(AV) - a *1 / ypical Data IF(AV) - a *2 / ypical Data 0.8 0.8 0.7 j =150 C 0.7 j =150 C 0.6 0.5 0.2 0.1 0.6 0.5 0.2 0.1 0.0 0.0 0 25 50 75 100 125 150 0 25 50 75 100 125 150 Ambient emperature : a [] Ambient emperature : a [] 0.8 0.7 0.6 0.5 0.2 0.1 IF(AV) - sp / ypical Data j =150 C σ = 1.0 σ = 0.8 σ = 0.5 σ = Note) *1: Device mounted on a FR4 PCB (25.4mm 25.4mm, 1mm thick), copper wiring (27.6mm 2 area, 36μm thick). *2: Device mounted on a FR4 PCB (25.4mm 25.4mm, 1mm thick), copper wiring (108.0mm 2 area, 36μm thick). IF p ime p 0.0 0 25 50 75 100 125 150 Solder Point emperature : sp [] 7 of 8
Doc No. 4-EA-14995 DCSP0603010-N1 0±0.03 2 Unit: mm 0.10±0.02 0.60±0.03 1 0.215±0.030 2 0.115±0.030 0.0425±0.0300 0.115±0.030 Land Pattern (Reference) 1 0.215±0.030 Unit: mm 0.215 0.215 8 of 8
Request for your special attention and precautions in using the technical information and semiconductors described in this book If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. he technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. herefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information de-scribed in this book. he products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Please consult with our sales staff in advance for information on the following applications, moreover please exchange documents separately on terms of use etc.: Special applications (such as for in-vehicle equipment, airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, medical equipment and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. Unless exchanging documents on terms of use etc. in advance, it is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application. he products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most upto-date in advance to make sure that the latest specifications satisfy your requirements. When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. We do not guarantee quality for disassembled products or the product re-mounted after removing from the mounting board. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) When reselling products described in this book to other companies without our permission and receiving any claim of request from the resale destination, please understand that customers will bear the burden. (8) his book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of our company. No.010618