AEC-Q100 Qualified 600mA High Voltage Adjustable Current Regulator with Enable Control

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AEC-Q100 Qualified 600mA High Voltage Adjustable Current Regulator with Control Description The is a high voltage, low dropout current regulator of output current up to 600mA in maximum. Users can adjust the output current from 100mA to 600mA through an external resistor, RSET, which gives users flexibility in controlling the light intensity of the LEDs. Further, the LED brightness is adjustable via the pin with a Pulse Width Modulation signal. The thermal protection function protects the IC from over temperature damage. Also, the exposed thermal pad enhances the package power dissipation. Typical Application FEATURES Automotive AEC-Q100 Qualified 600mA maximum output current Output current adjustable via external resistor 3µs fast response output stage enable control Output sustaining voltage up to 75V Wide supply voltage range: 5V to 50V TO-252-5L package Green package APPLICATIONS Map lights Accent lights Projector lights 5V~50V C BP R SET C O Figure 1. Typical Application 1/11

Absolute Maximum Ratings Stresses beyond the limits listed below may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Supply voltage, V DD... 55V Output sustaining voltage, V... 75V Output sink current, I... 700mA Output enable voltage, V... 10V Storage temperature range... -40 C to 150 C Lead temperature (soldering, 10 seconds)... 260 C Operating Conditions Supply voltage, V DD...5V to 50V Output enable voltage, V... 6V Output sink current, I...100mA to 600mA Operating junction temperature, T J... -40 C to125 C Maximum operating junction temperature, T J... 150 C AEC-Q100... Class 1 2/11

Electrical Characteristics Specifications are for Operating Junction Temperature of T J = 25 C only; limits applying over the full Operating Junction Temperature range are denoted by a. Typical values represent the most likely parametric norm at T J = 25 C, and are provided for reference purposes only. Unless otherwise noted, values are at V DD = 24V. Symbol Parameter Conditions Min Typ Max Units V = 0.5V, R SET = 3kΩ 185 200 216 175 230 Output current V = 0.5V, R SET = 1.71kΩ 342 360 381 325 398 ma V = 1.0V, R SET = 1kΩ 620 SET current range 200 1400 µa Minimum output current I SET = 200µA, V = 0.5V 100 ma Maximum output current I SET = 1200µA, V = 1V 600 ma Output dropout voltage I SET = 700µA (1) 0.35 V Load regulation V = 0.5V to 3V 3 ma/v Line regulation Thermal shutdown junction temperature V = 0.5V, I = 350mA, V DD = 5V to 50V 0.08 0.15 %/V Hysteresis = 20 C (2) 160 C Thermal shutdown hysteresis 20 C Low input voltage 0 0.8 V High input voltage Must be lower than V DD 2 Min {V DD, 6} V Low input current V = -20 20 µa High input current V = 5V -5.0 5.0 µa Output enable delay time Output disable delay time from Low to High, V = 0.5V, I = 350mA, 50% (2) 3 µs from High to Low, V = 0.5V, I = 350mA, 50% (2) 3 µs Supply current consumption 5 ma NOTES: 1. Output dropout voltage: 90% x I (V=500mV) 2. Guarantee by design, not by production test. 3/11

Pin Configuration 5 4 3 2 1 TO-252-5L, Top View Pin Functions Pin Number Pin Name Description 1 Power supply pin. 2 Output current setting pin. Connect a resistor RSET between the and for setting the LED driving current. I (ma) = 630-10 R SET(kΩ) This pin must be connected to ground with a 1kΩ or higher value resistor. 3 Ground pin. 4 Output stage enable control pin. High enables the pin. It can be left floating for normally on. 5 Constant current output pin. Sink current is decided by the current on RSET connected to pin. Thermal Tab () Heat dissipation pad. Connect to the ground plane and pins in the PCB layout. Must be soldered to electrical ground on the PCB. NOTE: The thermal tab is suggested connect to on PCB. And thermal conductivity will be improved, if a copper foil on PCB is soldered with thermal pad. 4/11

Typical Performance Characteristics Unless otherwise noted, T A = 25 C. 215 210 600 500 I = 500mA I (ma) 205 200 195 190-50 -25 0 25 50 75 100 125 150 Junction Temperature (ºC) Figure 2: I @ 200mA vs. Junction Temperature, R SET = 3kΩ Output Current (ma) 400 300 200 100 0 I = 150mA VDROP = 0.5V, TA = 25 C 0 20 40 60 Supply Voltage (V) Figure 3: Output Current vs. Supply Voltage 500.0 Output Current (ma) 400.0 300.0 200.0 I = 340mA I = 150mA 100.0 0.0 = 24V, TA = 25 C 0.00 1.00 2.00 3.00 Dropout Voltage (V) Figure 4: Output Current vs. Dropout Voltage Figure 5: V Sink Current. Pin Slow Ramp 0-6V, I SET = 3KΩ, V DROP = 0.5V Figure 6: V Sink Current. Pin 6V Square Wave, I SET = 3KΩ, V DROP = 0.5V 5/11

Functional Block Diagram Regulator Band-gap Reference V REF + Current Mirror and Control Circuit Figure 7. Functional Block Diagram Applications Information The is a high voltage, low dropout current regulator for output current up to 600mA in maximum. The pin is used for enabling/disabling the output stage of the chip. The current can be linearly adjusted through a variable resister connected to the pin, or by a PWM control signal via the pin. Although the absolute maximum rating of the pin is 75V, the dropout voltage between the pin and the pin should not be too large when the current is sinking because the thermal dissipation capability of the package is limited. Here are some of the typical application examples: DC Voltage Input As shown in Figure 8, any DC voltage between 5V and 50V can be adopted as power source V DD for typical application of as long as the voltage between the pin and the pin (V DD voltage minus the total forward voltage drop of the LED string) is larger than the dropout voltage needed for that expecting current. If 50V ~ 75V voltage is adopted as the power source to the positive end of the LED string, one Zener shunt regulator can be used to provide appropriate voltage to the pin, as shown in Figure 9. <50V DC >50V DC R Z C IN C IN D Z R SET1 R SET1 R SET2 880Ω R SET2 880Ω Figure 8. DC Voltage Input Application (<50V DC ) Figure 9. DC Voltage Input Application (>50V DC ) 6/11

Applications Information (Continued) If a ceramic capacitor is selected as the input capacitor, C IN, without any electrolytic capacitor connected in parallel, sometimes there may be high voltage spike on the input voltage line when V IN is switching on or off in the testing stage or the mass production stage. The peak of the voltage spike may be higher than 50V (supply voltage range of the pin) even when the normal V IN level is much less than 50V. An RC filter, R IN and C IN2, is recommended at the pin in order to prevent the voltage spike from damaging the pin, as shown in the following circuit diagram. V IN R IN C IN1 C IN2 R SET CO Figure 10. DC Voltage Input Application with Ceramic Input Capacitor Output Capacitance Figure 10 shows the application schematic where an output capacitor, C O, is added to the circuit. LED AC impedances can vary widely and in some applications a 10uF capacitor is required between the pin and ground to avoid oscillation in the current control circuit. It is recommended that an output capacitor be included in all designs as a De-Populate and if testing finds oscillation in the drive current, the capacitor may then be populated. If the pin is used to turn off the LEDs, the pin voltage will rise to the V IN voltage, so the voltage rating of the capacitor must take this into consideration. When derating ceramic capacitors based on the DC bias, use the voltage on the pin when the LEDs are on. This voltage is usually <1V which results in little derating. LED Backlight Solution can coordinate with any type of DC-to-DC converter through a feedback path to realized LED backlight module. The number of LEDs in the string is variable even with certain fixed power source since the output voltage of the DC-to-DC converter can be modulated according to the feedback signal. 12VDC or 24V DC DC / DC Converter Output FB Db Rb RSET1 RSET2 880Ω Figure 11. LED Backlight Solution 7/11

Applications Information (Continued) AC Voltage Input can work with any kind of well-known or well-developed switch-mode power supply system. Simply cut off the internal feedback path of the power supply system and then feed the signal from back to the power supply system instead. 85V AC ~ 265V AC Power Supply FB V DD R b D b R SET1 R SET2 880Ω Figure 12. AC Voltage Application Thermal Consideration The maximum power dissipation for a single-output regulator is: P D(MAX) = (V IN(MAX) V F(NOM) ) x I (NOM) + V IN(MAX) x I Q = V (MAX) x I (NOM) + V IN(MAX) x I Q Where, V F(NOM) = the nominal LED total forward voltage I (NOM) = the nominal output current = the nominal LED current I Q = the quiescent current of the regulator V IN(MAX) = the maximum input voltage V (MAX) = the maximum voltage drop between pin and pin Then, θ JA = (150 C T A )/P D 8/11

Applications Information (Continued) Thermal Calculation The has an internal power and thermal limiting circuitry designed to protect the device under overload conditions. However, maximum junction temperature ratings should not be exceeded under continuous normal load conditions. The thermal protection circuit of the prevents the device from damage due to excessive power dissipation. When the device junction temperature rises to approximately 150 C, the regulator will be turned off. When the power consumption is over about 1000mW (TO-252 package, at T A = 70 C), an additional heat sink is required to control the junction temperature below 125 C. The junction temperature is: T J = P D (θ JT +θ CS +θ SA ) + T A P D : dissipated power θ JT : thermal resistance from the junction to the mounting tab of the package For TO-252 package, θ JT = 7.0 C/W θ CS : thermal resistance through the interface between the IC and the surface on which it is mounted (typically, θ CS < 1.0 C /W) θ SA : thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink) If a PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size of copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with several through-hole vias. PCB θ SA ( C /W) 59 45 38 33 27 24 21 PCB heat sink size (mm2) 500 1000 1500 2000 3000 4000 5000 Recommended figure of PCB area used as a heat sink Heat-pad of TO-252 5 4 3 2 1 Through hole vias Figure 13. Recommended PCB for Heat Sink 9/11

Package Description TOP VIEW BOTTOM VIEW TERMINAL DETAILS SIDE VIEW 1. All dimensioins are in Millimeters 2. Dimensions and tolerance per Jedec TO 252 Drawing No. : POD-00000100 Revision: A 10/11

Ordering Information (1) Part Number Operating Temperature Range Lead-Free Package Packaging Method XR46004ETCTR-Q -40 C T J 125 C Yes (2) TO-252-5L Tape and reel NOTE: 1. Refer to www.exar.com/ for most up-to-date Ordering Information. 2. Visit www.exar.com for additional information on Environmental Rating. Revision History Revision Date Description 1A Oct 2017 Initial release. Corporate Headquarters: 5966 La Place Court Suite 100 Carlsbad, CA 92008 Tel.:+1 (760) 692-0711 Fax: +1 (760) 444-8598 www.maxlinear.com High Performance Analog: 1060 Rincon Circle San Jose, CA 95131 Tel.: +1 (669) 265-6100 Fax: +1 (669) 265-6101 Email: LEDtechsupport@exar.com www.exar.com The content of this document is furnished for informational use only, is subject to change without notice, and should not be construed as a commitment by MaxLinear, Inc.. MaxLinear, Inc. assumes no responsibility or liability for any errors or inaccuracies that may appear in the informational content contained in this guide. Complying with all applicable copyright laws is the responsibility of the user. Without limiting the rights under copyright, no part of this document may be reproduced into, stored in, or introduced into a retrieval system, or transmitted in any form or by any means (electronic, mechanical, photocopying, recording, or otherwise), or for any purpose, without the express written permission of MaxLinear, Inc. Maxlinear, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless MaxLinear, Inc. receives, in writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the user assumes all such risks; (c) potential liability of MaxLinear, Inc. is adequately protected under the circumstances. MaxLinear, Inc. may have patents, patent applications, trademarks, copyrights, or other intellectual property rights covering subject matter in this document. Except as expressly provided in any written license agreement from MaxLinear, Inc., the furnishing of this document does not give you any license to these patents, trademarks, copyrights, or other intellectual property. Company and product names may be registered trademarks or trademarks of the respective owners with which they are associated. 2015-2017 MaxLinear, Inc. All rights reserved _DS_100317 11/11