April 2014 BAV99 200 ma 70 V High Conductance Ultra-Fast Switching Diode Features High Conductance: I F = 200 ma Fast Switching Speed: t rr < 6 ns Maximum Small Plastic SOT-2 Package Series-Pair Configuration Applications High-Speed Switching Applications 1 SOT-2 2 A7 1 2 Description The BAV99 is a 50 mw high-speed switching diode array with series-pair diode configuration. It achieves high-current conductivity, up to 200 ma, in a very small 7mm 2 footprint. These features make the BAV99 optimal for area-constrained applications that need a little extra power capability. For common cathode and common anode high-speed switching diodes, explore Fairchild's BAV70 and BAW56. Looking for more options in the SOT-2 package? Check Fairchild's MMBD family. Connection Diagram 1 2 Ordering Information Part Number Marking Package Packing Method BAV99 A7 SOT-2 L Tape and Reel, Reel 7 inch BAV99_D87Z A7 SOT-2 L Tape and Reel, Reel 1 inch BAV99 Rev. 1.1.0 1
Absolute Maximum Ratings (1) Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Values are at T A = 25 C unless otherwise noted. Symbol Parameter Value Unit V RRM Maximum Repetitive Reverse Voltage 70 V I F(AV) Average Rectified Forward Current 200 ma I FSM Non-Repetitive Peak Pulse Width = 1.0 Second 1.0 Forward Surge Current Pulse Width = Microseconds 8.0 A T STG Storage Temperature Range -55 to +150 C T J Operating Junction Temperature Range -55 to +150 C Note: 1. These ratings are based on a maximum junction temperature of 150 C. These are steady-state limits. Fairchild Semiconductor should be consulted on applications involving pulsed or low-duty cycle operations. Thermal Characteristics (2) Values are at T A = 25 C unless otherwise noted. Symbol Parameter Value Unit P D Power Dissipation 50 mw R θja Thermal Resistance, Junction to Ambient 57 C/W Note: 2. PCB size: FR-4, 76 mm x 114 mm x 1.57 mm (.0 inch x 4.5 inch x 0.062 inch) with minimum land pattern size. Electrical Characteristics Values are at T A = 25 C unless otherwise noted. Symbol Parameter Conditions Min. Max. Unit V R Breakdown Voltage, per Diode I R = 100 μa 70 V V F Forward Voltage, per Diode I F = 1 ma 715 I F = 10 ma 855 I F = 50 ma 1.00 I F = 150 ma 1.25 V R = 70 V 2.5 I R Reverse Leakage, per Diode V R = 25 V, T A = 150 C 0.0 μa V R = 70 V, T A = 150 C 50.0 C T Total Capacitance, per Diode V R = 0 V, f = 1.0 MHz 1.5 pf t rr Reverse-Recovery Time, per Diode I F = I R = 10 ma, I RR = 1 ma, R L = 100 Ω mv V 6.0 ns BAV99 Rev. 1.1.0 2
Typical Performance Characteristics Reverse Voltage, V R [V] 150 140 10 120 110 1 2 5 10 20 0 50 100 Reverse Current, I R [ua] Figure 1. Reverse Voltage vs. Reverse Current Forward Voltage, V F [mv] 450 400 50 250 1 2 5 10 20 0 50 100 Forward Current, I F [ua] Figure. Forward Voltage vs. Forward Current V F - 1 to 100 μa Reverse Current, I R [na] Forward Voltage, V F [mv] 250 200 150 100 50 0 10 20 0 50 70 100 Reverse Voltage, V R [V] Figure 2. Reverse Current vs. Reverse Voltage 700 650 600 550 500 450 0.1 0.2 0. 0.5 1 2 5 10 Forward Current, I F [ma] Figure 4. Forward Voltage vs. Forward Current V F - 0.1 to 10 ma 1.4 1. Forward Voltage, V F [V] 1.2 1.0 0.8 Total Capacitance [pf] 1.2 1.1 0.6 10 20 0 50 100 200 500 Forward Current, I F [ma] Figure 5. Forward Voltage vs. Forward Current V F - 10 to 800 ma 1.0 0 2 4 6 8 10 12 14 Reverse Voltage [V] Figure 6. Total Capacitance vs. Reverse Voltage BAV99 Rev. 1.1.0
Typical Performance Characteristics (Continued) Reverse Recovery Time [ns] Power Dissipation, P D [mw] 4.0.5.0 2.5 2.0 1.5 1.0 10 20 0 40 50 60 500 400 200 100 Reverse Current [ma] Figure 7. Reverse-Recovery Time vs. Reverse Current SOT-2 Pkg 0 0 25 50 75 100 125 150 175 200 Average Temperature, [ o C] Figure 9. Power Derating Curve Current [ma] 400 200 100 IF(AV) - AVERAGE RECTIFIED CURRENT - ma 0 0 50 100 150 Ambient Temperature, T A [ o C] Figure 8. Average Rectified Current (I F(AV) ) vs. Ambient Temperature (T A ) BAV99 Rev. 1.1.0 4
Physical Dimensions (0.29) C 1.20 MAX (0.9) GAGE PLANE 0.2 0.08 0.20 MIN 2.92±0.20 1 2 0.95 1.90 (0.55) SOT-2 1.0 +0.20-0.15 0.60 0.7 0.20 A B 0.25 SEATING PLANE SEE DETAIL A 0.10 0.00 1.40 0.10 C 0.95 1.90 LAND PATTERN RECOMMENDATION 2.40±0.0 NOTES: UNLESS OTHERWISE SPECIFIED 2.20 1.00 A) REFERENCE JEDEC REGISTRATION TO-26, VARIATION AB, ISSUE H. B) ALL DIMENSIONS ARE IN MILLIMETERS. C) DIMENSIONS ARE INCLUSIVE OF BURRS, MOLD FLASH AND TIE BAR EXTRUSIONS. D) DIMENSIONING AND TOLERANCING PER ASME Y14.5M - 1994. E) DRAWING FILE NAME: MA0DREV10 SCALE: 2X Figure 10. -LEAD, SOT2, JEDEC TO-26, LOW PROFILE Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/dwg/ma/ma0d.pdf. For current tape and reel specifications, visit Fairchild Semiconductor s online packaging area: http://www.fairchildsemi.com/packing_dwg/pkg-ma0d.pdf. BAV99 Rev. 1.1.0 5
TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. AccuPower AX-CAP * BitSiC Build it Now CorePLUS CorePOWER CROSSVOLT CTL Current Transfer Logic DEUXPEED Dual Cool EcoSPARK EfficientMax ESBC Fairchild Fairchild Semiconductor FACT Quiet Series FACT FAST FastvCore FETBench FPS F-PFS FRFET Global Power Resource SM GreenBridge Green FPS Green FPS e-series Gmax GTO IntelliMAX ISOPLANAR Making Small Speakers Sound Louder and Better MegaBuck MICROCOUPLER MicroFET MicroPak MicroPak2 MillerDrive MotionMax mwsaver OptoHiT OPTOLOGIC OPTOPLANAR PowerTrench PowerXS Programmable Active Droop QFET QS Quiet Series RapidConfigure * Trademarks of System General Corporation, used under license by Fairchild Semiconductor. Saving our world, 1mW/W/kW at a time SignalWise SmartMax SMART START Solutions for Your Success SPM STEALTH SuperFET SuperSOT - SuperSOT -6 SuperSOT -8 SupreMOS SyncFET Sync-Lock * TinyBoost TinyBuck TinyCalc TinyLogic TINYOPTO TinyPower TinyPWM TinyWire TranSiC TriFault Detect TRUECURRENT * SerDes UHC Ultra FRFET UniFET VCX VisualMax VoltagePlus XS DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative / In Design Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I68 Fairchild Semiconductor Corporation www.fairchildsemi.com