MKP112 Series Sidac High oltage Bidirectional Triggers Bidirectional devices designed for direct interface with the ac power line. Upon reaching the breakover voltage in each direction, the device switches from a blocking state to a low voltage onstate. Conduction will continue like a Triac until the main terminal current drops below the holding current. The plastic axial lead package provides high pulse current capability at low cost. Glass passivation insures reliable operation. Features High Pressure Sodium apor Lighting Strobes and Flashers Ignitors High oltage Regulators Pulse Generators Used to Trigger Gates of SCR s and Triacs Indicates UL Registered File #E2157 These are PbFree Devices* SIDACS ( ).9 AMPERES RMS 12 24 OLTS MT1 MT2 MAXIMUM RATINGS (T J = 25 C unless otherwise noted) Rating Symbol alue Unit Peak Repetitive OffState oltage (Sine Wave, 5 to 6 Hz, T J = 4 to 125 C) MKP112, MKP113, MKP116 MKP124 On-State Current RMS (T L = 8 C, Lead Length = 3/8, All Conduction Angles) Peak Nonrepetitive Surge Current (6 Hz One Cycle Sine Wave, T J = 125 C) DRM, RRM 9 18 I T(RMS).9 A I TSM 4. A Operating Junction Temperature Range T J 4 to +125 C Storage Temperature Range T stg 4 to +15 C THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Thermal Resistance, JunctiontoLead Lead Length = 3/8 Lead Solder Temperature (Lead Length 1/16 from Case, 1 s Max) R JL 4 C/W T L 26 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. AXIAL LEAD CASE 59 STYLE 2 MARKING DIAGRAM A MKP 1xx YYWW A = Assembly Location MKP1xx = Device Number x= 12, 13, 16 or 24 YY = Year WW = Work Week =PbFree Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. Semiconductor Components Industries, LLC, 212 August, 212 Rev. 12 1 Publication Order Number: MKP112/D
MKP112 Series ELECTRICAL CHARACTERISTICS (T C = 25 C unless otherwise noted; Electricals apply in both directions) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS Repetitive Peak OffState Current T J = 25 C I DRM 5. A (5 to 6 Hz Sine Wave) DRM = 9, MKP112, MKP113 and MKP116 DRM = 18, MKP124 ON CHARACTERISTICS Breakover oltage I BO = 35 A MKP112 35 A MKP113 2 A MKP116 35 A MKP124 BO 11 12 15 22 13 14 17 25 Peak OnState oltage (I TM = 1 A Peak, Pulse Width 3 s, Duty Cycle 2%) Dynamic Holding Current (Sine Wave, 5 to 6 Hz, R L = 1 Ohm) Switching Resistance (Sine Wave, 5 to 6 Hz) TM 1.3 1.5 I H 1 ma R S.1 k DYNAMIC CHARACTERISTICS Critical RateofRise of OnState Current, Critical Damped Waveform Circuit (I PK = 13 Amps, Pulse Width = 1 sec) di/dt 12 A/ s ORDERING INFORMATION Device Package* Shipping MKP112RLG MKP113RLG MKP116G MKP116RLG MKP124G DO41, Axial Lead 5 / Tape & Reel 5 / Tape & Reel 1 Units / Bulk 5 / Tape & Reel 1 Units / Bulk MKP124RLG 5 / Tape & Reel *This package is inherently PbFree. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD811/D. 2
I I MKP112 Series oltage Current Characteristic of SIDAC (Bidirectional Device) + Current Symbol I DRM DRM BO I BO I H TM I TM Parameter Off State Leakage Current Off State Repetitive Blocking oltage Breakover oltage Breakover Current Holding Current On State oltage Peak on State Current I TM I H TM Slope = RS I S I S DRM I (BO) + oltage DRM (BO) R S ( (BO) S ) (I S I (BO) ), MAXIMUM ALLOWABLE LEAD TEMPERATURE ( C) 14 13 12 11 1 9 8 7 6 5 4.2.4.6.8 T L 3 / 8 3 / 8 T J = 125 C Sine Wave Conduction Angle = 18 C 1.2 1.4 1.6 1.8 2. T(RMS), ON-STATE CURRENT (AMPS).8.6.4.2 2 4 6 T J = 125 C Sine Wave Conduction Angle = 18 C Assembled in PCB Lead Length = 3 / 8 8 1 12 14 T L I T(RMS), ON-STATE CURRENT (AMPS) T A, MAXIMUM AMBIENT TEMPERATURE ( C) Figure 1. Maximum Lead Temperature Figure 2. Maximum Ambient Temperature, INSTANTANEOUS ON-STATE CURRENT (AMPS) T 1 7. 5. 3. 2..7.5.3.2.1 T J = 25 C 125 C 2. 3. 4. 5. P RMS, POWER DISSIPATION (WATTS) 1.25.75.5.25 T J = 25 C Conduction Angle = 18 C.2.4.6.8 T, INSTANTANEOUS ON-STATE OLTAGE (OLTS) I T(RMS), ON-STATE CURRENT (AMPS) Figure 3. Typical OnState oltage Figure 4. Typical Power Dissipation 3
I MKP112 Series THERMAL CHARACTERISTICS r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED).7.5.3.2.1.7.5.3.2.1.1.2.5 2. Z JL (t) = R JL r(t) T JL = P pk R JL [r(t)] where: t p TIME T JL = the increase in junction temperature above the lead temperature r(t) = normalized value of transient thermal resistance at time, t from this figure. For example, r(t p ) = normalized value of transient resistance at time t p. 5. 1 2 5 1 2 5 k 2. k 5. k 1 k t, TIME (ms) The temperature of the lead should be measured using a thermocouple placed on the lead as close as possible to the tie point. The thermal mass connected to the tie point is normally large enough so that it will not significantly respond to heat surges generated in the diode as a result of pulsed operation once steady-state conditions are achieved. Using the measured value of T L, the junction temperature may be determined by: T J = T L + T JL Figure 5. Thermal Response, BREAKOER OLTAGE (NORMALIZED).9, HOLDING CURRENT (NORMALIZED) 1.4 1.2.8.6 BO H.8-6 -4-2 2 4 6 8 1 12 14.4-6 -4-2 2 4 6 8 1 12 14 T J, JUNCTION TEMPERATURE ( C) T J, JUNCTION TEMPERATURE ( C) Figure 6. Typical Breakover oltage Figure 7. Typical Holding Current 1 I PK, PEAK CURRENT (AMPS) 1 I PK tw 1%.1 1 1 t w, PULSE WIDTH (ms) Figure 8. Pulse Rating Curve 4
MKP112 Series PACKAGE DIMENSIONS AXIAL LEAD CASE 591 ISSUE U B K F D NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. ALL RULES AND NOTES ASSOCIATED WITH JEDEC DO41 OUTLINE SHALL APPLY 4. POLARITY DENOTED BY CATHODE BAND. 5. LEAD DIAMETER NOT CONTROLLED WITHIN F DIMENSION. POLARITY INDICATOR OPTIONAL AS NEEDED (SEE STYLES) F A K INCHES MILLIMETERS DIM MIN MAX MIN MAX A.161.25 4.1 5.2 B.79.16 2. 2.7 D.28.34.71.86 F.5 1.27 K 25.4 STYLE 2: NO POLARITY ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patentmarking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 8217 USA Phone: 336752175 or 8344386 Toll Free USA/Canada Fax: 336752176 or 83443867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 82829855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 79 291 Japan Customer Focus Center Phone: 813581715 5 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MKP112/D