Top View. Symbol Max n-channel Max p-channel Units Drain-Source Voltage Symbol

Similar documents
Top View. Max n-channel Max p-channel Units Drain-Source Voltage V. Symbol V DS V GS ±12 I DM P D T J, T STG Maximum Junction-to-Lead

AO V Complementary MOSFET

V DS. 100% UIS Tested 100% R g Tested. Top View S2 G2 S1 G1

Top View S1 G1 S2 G2. Orderable Part Number Package Type Form Minimum Order Quantity AO4630 SO-8 Tape & Reel Symbol V DS ±12 V GS I D

AONE V Dual Asymmetric N-Channel MOSFET

V DS I D (at V GS =10V) R DS(ON) (at V GS = 4.5V) 100% UIS Tested 100% R g Tested

AOL1454G 40V N-Channel AlphaSGT TM

AOTL V N-Channel AlphaSGT TM

I D (at V GS =-4.5V) -4A R DS(ON) (at V GS = -1.8V) ESD protected V DS V GS -4 I D T A =70 C -3.5 I DM P D T J, T STG. R θjl

V DS. Pin 1 G1 D2. Maximum Drain-Source Voltage -12 Gate-Source Voltage Continuous Drain Current G Pulsed Drain Current C V GS I D I DM P D

AON7400A 30V N-Channel MOSFET

V DS I D (at V GS =10V) R DS(ON) (at V GS =4.5V) 100% UIS Tested 100% R g Tested SOIC-8 D1. Top View. S2 Pin1

AON V P-Channel MOSFET

AON V P-Channel MOSFET

V DS I D (at V GS =-4.5V) -50A R DS(ON) (at V GS =-1.5V) 100% UIS Tested 100% R g Tested. DFN 3.3x3.3 EP D. Symbol V Gate-Source Voltage V GS I D

V DS I D (at V GS =-4.5V) R DS(ON) (at V GS =-1.8V) D1 G2 Bottom

V DS. 100% UIS Tested 100% R g Tested. Top View V GS -200 T A =25 C T A =70 C I DM I DSM I AS E AS P D P DSM T J, T STG

V DS I D (at V GS =10V) R DS(ON) (at V GS =4.5V) 100% UIS Tested 100% Rg Tested

AON7422E 30V N-Channel MOSFET

V DS. 100% UIS Tested 100% R g Tested. Symbol. Gate-Source Voltage Continuous Drain Current Pulsed Drain Current C V GS I DM T A =25 C I D

V DS I D (at V GS =10V) R DS(ON) (at V GS =7V) 100% UIS Tested 100% R g Tested

AONS V N-Channel AlphaSGT TM

AOTF409 P-Channel Enhancement Mode Field Effect Transistor

V DS I D (at V GS =10V) R DS(ON) (at V GS =4.5V) 100% UIS Tested 100% R g Tested. Top View. Symbol Drain-Source Voltage 30 Gate-Source Voltage V GS

AON V N-Channel MOSFET

AOW V N-Channel MOSFET

V DS I D (at V GS =10V) R DS(ON) (at V GS = 4.5V) 100% UIS Tested 100% R g Tested DFN5X6 D. Top View

V DS I D (at V GS =10V) R DS(ON) (at V GS =4.5V) 100% UIS Tested 100% R g Tested DFN5X6 D. Top View

AONS V N-Channel AlphaSGT TM

AO4433 P-Channel Enhancement Mode Field Effect Transistor

AOD454A N-Channel Enhancement Mode Field Effect Transistor

AOT2618L/AOB2618L/AOTF2618L

AO7801 Dual P-Channel Enhancement Mode Field Effect Transistor

AON7264E 60V N-Channel AlphaSGT TM

V DS I D (at V GS =10V) R DS(ON) (at V GS =4.5V) 100% UIS Tested 100% Rg Tested

AO882 Electrical Characteristics (T J =2 C unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units STATIC PARAMETERS BV DSS DrainSource

AOD2910E 100V N-Channel MOSFET

AOD4132 N-Channel Enhancement Mode Field Effect Transistor

AON V N-Channel MOSFET

AOD V N-Channel MOSFET

AOD414 N-Channel Enhancement Mode Field Effect Transistor

AOD404 N-Channel Enhancement Mode Field Effect Transistor

AO4430 N-Channel Enhancement Mode Field Effect Transistor

AOL1414 N-Channel Enhancement Mode Field Effect Transistor

Symbol Drain-Source Voltage -30 Gate-Source Voltage Continuous Drain T A =25 C T A =70 C Pulsed Drain Current C V DS V GS

AON5802B Common-Drain Dual N-Channel Enhancement Mode Field Effect Transistor General Description

V DS D1/D2 V GS I D I DM P DSM W. T A =70 C 1 Junction and Storage Temperature Range T J, T STG

V T j,max. I DM R DS(ON),max < 0.19Ω Q g,typ E 400V. 100% UIS Tested 100% R g Tested G D S S. Package Type TO-220F Green.

I D (at V GS =10V) 2.8A. R DS(ON) (at V GS =10V) < 4.8Ω. 100% UIS Tested! 100% R g Tested!

AOTF5N50FD. 500V, 5A N-Channel MOSFET with Fast Recovery Diode. V DS I D (at V GS =10V) R DS(ON) (at V GS =10V)

V DS -20V I D (at V GS =-4.5V) R DS(ON) (at V GS = -1.8V) ESD protected TSOP6 D. Top View. Drain-Source Voltage -20 V

AOW10T60P/AOWF10T60P 600V,10A N-Channel MOSFET

AOTF380A60L/AOT380A60L

V DS I D (at V GS =10V) R DS(ON) (at V GS =10V) 100% UIS Tested 100% R g Tested. TO-262F Bottom View. Top View G D S S G. Symbol

AOTF7N60FD. 600V, 7A N-Channel MOSFET with Fast Recovery Diode. V DS I D (at V GS =10V)

V DS I D (at V GS =10V) R DS(ON) (at V GS =10V) < 0.51Ω. 100% UIS Tested 100% R g Tested. Top View TO-220F. Symbol

AOE V Dual Asymmetric N-Channel AlphaMOS

AOTF9N V, 9A N-Channel MOSFET. V DS I D (at V GS =10V) R DS(ON) (at V GS =10V) < 1.3Ω

Top View DFN5X6D PIN1 V DS V GS I D I DM I DSM I AS. 100ns V SPIKE 31 P D 12 P DSM. Junction and Storage Temperature Range T J, T STG

AOT14N50/AOB14N50/AOTF14N50

AOT12N60FD/AOB12N60FD/AOTF12N60FD

AOD407 P-Channel Enhancement Mode Field Effect Transistor

AOT12N65/AOTF12N65/AOB12N65

AOK40N30 300V,40A N-Channel MOSFET

V DS I D (at V GS =10V) R DS(ON) (at V GS =10V) < 0.056Ω. 100% UIS Tested 100% R g Tested. Symbol. Symbol

V DS I D (at V GS =10V) R DS(ON) (at V GS =10V) < 0.37Ω. 100% UIS Tested 100% R g Tested TO-220F. Symbol

600V 37A αmos TM Power Transistor. V T j,max I DM. 100% UIS Tested 100% R g Tested S G G AOB42S60L

600V 39A α MOS TM Power Transistor. V T j,max I DM. Symbol V DS V GS I D I AR E AR E AS P D. dv/dt T J, T STG T L

AOT20S60L/AOB20S60L/AOTF20S60L/AOTF20S60

AON V P-Channel MOSFET

AO4402G 20V N-Channel MOSFET

AOW V N-Channel MOSFET

AO4728L N-Channel Enhancement Mode Field Effect Transistor

V DS I D (at V GS =10V) R DS(ON) (at V GS =10V) < 0.37Ω. 100% UIS Tested 100% R g Tested. Symbol. Symbol

AON V P-Channel MOSFET

AOL1422 N-Channel Enhancement Mode Field Effect Transistor

AONS V N-Channel MOSFET

AOT460 N-Channel Enhancement Mode Field Effect Transistor

AO3160E 600V,0.04A N-Channel MOSFET

AO V P-Channel MOSFET

V DS I D (at V GS =10V) R DS(ON) (at V GS = 4.5V) 100% UIS Tested 100% R g Tested. Top View 5 G

V DS. ESD Protected 100% UIS Tested 100% R g Tested

AOP608 Complementary Enhancement Mode Field Effect Transistor

V DS. 100% UIS Tested 100% R g Tested SOIC-8 D

V DS. 100% UIS Tested 100% R g Tested

AO4423/AO4423L 30V P-Channel MOSFET

AOD21357/AOI V P-Channel MOSFET

V DS. 100% UIS Tested 100% R g Tested

V DS I D (at V GS =10V) R DS(ON) (at V GS =4.5V) 100% UIS Tested 100% R g Tested. DFN 3x3A D. Pin 1

AOD410 N-Channel Enhancement Mode Field Effect Transistor

AO4912 Asymmetric Dual N-Channel Enhancement Mode Field Effect Transistor

AO V P-Channel MOSFET. V DS R DS(ON) (at V GS =-4.5V) -30V

AON V N-Channel AlphaMOS

V DS I D (at V GS =10V) R DS(ON) (at V GS =10V) < 6.0mΩ (< 5.7mΩ ) R DS(ON) (at V GS =6V) < 7.9mΩ (< 7.6mΩ ) 100% UIS Tested 100% R g Tested G S G

AO V P-Channel MOSFET V DS. -60V I D (at V GS =-10V) -4A R DS(ON) (at V GS = -4.5V)

V DS I D (at V GS =10V) R DS(ON) (at V GS =10V) < 2.6mΩ (< 2.4mΩ ) R DS(ON) (at V GS =6V) < 3.2mΩ (< 3.0mΩ ) 100% UIS Tested 100% R g Tested TO-263

V DS I D (at V GS =10V) R DS(ON) (at V GS =10V) < 0.38Ω. 100% UIS Tested 100% R g Tested TO-262F. Bottom View. Top View G D S S G D S G D.

AO V N-Channel MOSFET

AO V P-Channel MOSFET

V DS I D (at V GS =10V) R DS(ON) (at V GS =10V) 100% UIS Tested 100% R g Tested TO-263 D 2 PAK D D S G S D

Transcription:

AO668 V Complementary MOSFET General Description The AO668 combines advanced trench MOSFET technology with a low resistance package to provide extremely low R DS(ON). This device is ideal for load switch and battery protection applications. RoHS and HalogenFree Compliant Product Summary NChannel PChannel V DS = 3V V ID= 3.4A (VGS=V) 3.3A (V GS =4.5V) R DS(ON) R DS(ON) < 6mΩ (V GS =V) < 75mΩ (V GS =4.5V) < 7mΩ (V GS =4.5V) < 5mΩ (V GS =.5V) < 9mΩ (V GS =.5V) < 35mΩ (V GS =.8V) Top View TSOP6 Bottom View Top View D D Absolute Maximum Ratings T A =5 C unless otherwise noted Parameter Symbol Max nchannel Max pchannel Units DrainSource Voltage 3 V Junction and Storage Temperature Range V DS GateSource Voltage ± ±8 V Continuous Drain Current Pulsed Drain Current C Power Dissipation B Pin T A =5 C T A =7 C T A =5 C T A =7 C V GS I D I DM P D T J, T STG G S G 6 5 3 4 3.4.7.5.8 D S D G 55 to 5 3.3.5 3.5.8 S nchannel G A W C S pchannel Thermal Characteristics Parameter Maximum JunctiontoAmbient A Maximum JunctiontoAmbient A D Maximum JunctiontoLead t s SteadyState SteadyState Symbol Typ Max 75 R qja 5 3 5 65 R qjl Units C/W C/W C/W Rev.: January 7 www.aosmd.com Page of 9

AO668 NChannel Electrical Characteristics (T J =5 C unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units STATIC PARAMETERS BV DSS DrainSource Breakdown Voltage I D =5mA, V GS =V 3 V I DSS V DS =3V, V GS =V T J =55 C 5 I GSS GateBody leakage current V DS =V, V GS =±V ± na V GS(th) Gate Threshold Voltage V DS =V GS I D =5mA.5.5 V R DS(ON) Zero Gate Voltage Drain Current Static DrainSource OnResistance V GS =V, I D =3.4A V GS =4.5V, I D =3A V GS =.5V, I D =A 46 6 T J =5 C 73 88 5 7 mw 6 9 mw g FS Forward Transconductance V DS =5V, I D =3.4A 4 S V SD Diode Forward Voltage I S =A,V GS =V.75 V I S Maximum BodyDiode Continuous Current.5 A DYNAMIC PARAMETERS C iss Input Capacitance 35 pf C oss Output Capacitance V GS =V, V DS =5V, f=mhz 35 pf C rss Reverse Transfer Capacitance 8 pf R g Gate resistance V GS =V, V DS =V, f=mhz.9.8.7 W SWITCHING PARAMETERS Q g (V) Total Gate Charge 6 nc Q g (4.5V) Total Gate Charge 3 nc V GS =V, V DS =5V, I D =3.4A Q gs Gate Source Charge.55 nc Q gd Gate Drain Charge.8 nc t D(on) TurnOn DelayTime.5 ns t r TurnOn Rise Time VGS=V, VDS=5V, RL=4.4Ω,.5 ns t D(off) TurnOff DelayTime RGEN=3Ω 6 ns t f TurnOff Fall Time ns t rr Body Diode Reverse Recovery Time I F =3.4A, di/dt=a/ms 6 ns Q rr Body Diode Reverse Recovery Charge I F =3.4A, di/dt=a/ms. nc A. The value of R qja is measured with the device mounted on in FR4 board with oz. Copper, in a still air environment with T A =5 C. The value in any given application depends on the user's specific board design. B. The power dissipation P D is based on T J(MAX) =5 C, using s junctiontoambient thermal resistance. C. Repetitive rating, pulse width limited by junction temperature T J(MAX) =5 C. Ratings are based on low frequency and duty cycles to keep initialt J =5 C. D. The R qja is the sum of the thermal impedence from junction to lead R qjl and lead to ambient. E. The static characteristics in Figures to 6 are obtained using <3 ms pulses, duty cycle.5% max. F. These curves are based on the junctiontoambient thermal impedence which is measured with the device mounted on in FR4 board with oz. Copper, assuming a maximum junction temperature of T J(MAX) =5 C. The SOA curve provides a single pulse rating. ma mw APPLICATIONS OR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Rev.: January 7 www.aosmd.com Page of 9

R DS(ON) (mw) I S (A) R DS(ON) (mw) Normalized OnResistance I D (A) I D (A) AO668 NChannel: TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 5 V 5 V DS =5V 9 4.5V 3V 9 6 3 V GS =V 6 3 5 C 5 C 3 4 5 V DS (Volts) Fig : OnRegion Characteristics (Note E) < 88mΩ (V GS =.5V).5.5.5 3 V GS (Volts) Figure : Transfer Characteristics (Note E) 8 7 6 5 V GS =.5V V GS =4.5V V GS =V 4 4 6 8 I D (A) Figure 3: OnResistance vs. Drain Current and Gate Voltage (Note E).8.6.4..8 V GS =4.5V I D =3A V GS =V I D =3.4A 3 5 V GS =.5V I 5 D =A 5 5 75 5 5 75 Temperature ( C) Figure 4: OnResistance vs. Junction Temperature 8 (Note E) 4.E I D =3.4A.E 4 8 5 C.E.E.E3 5 C 5 C 6 5 C.E4 4 4 6 8 V GS (Volts) Figure 5: OnResistance vs. GateSource Voltage (Note E).E5...4.6.8.. V SD (Volts) Figure 6: BodyDiode Characteristics (NoteE) Rev.: January 7 www.aosmd.com Page 3 of 9

Z qja Normalized Transient Thermal Resistance I D (Amps) Power (W) V GS (Volts) Capacitance (pf) AO668 NChannel: TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 8 V DS =5V I D =3.4A 4 3 C iss 6 4 C oss 3 4 5 6 7 Q g (nc) Figure 7: GateCharge Characteristics < 88mΩ C(V rss GS =.5V) 5 5 V DS (Volts) Figure 8: Capacitance Characteristics. T A =5 C... R DS(ON) limited T J(Max) =5 C T C =5 C DC ms ms... V DS (Volts) Figure 9: Maximum Forward Biased Safe Operating Area (Note F) ms ms s. E5.. 3 5 Pulse Width (s) Figure : Single Pulse Power Rating JunctiontoAmbient (Note F) D=T on /T T J,PK =T A P DM.Z qja.r qja R qja =3 C/W In descending order D=.5,.3,.,.5,.,., single pulse.. Single Pulse P D T. E5.... Pulse Width (s) Figure : Normalized Maximum Transient Thermal Impedance (Note F) T on Rev.: January 7 www.aosmd.com Page 4 of 9

AO668 Gate Charge Test Circuit & Waveform Qg V Qgs Qgd Ig RL Resistive Switching Test Circuit & Waveforms Charge Rg 9% % td(on) t r t d(off) t f t on t off Unclamped Inductive Switching (UIS) Test Circuit & Waveforms L E = / LI AR AR BV DSS Rg Id Id I AR Diode Recovery Test Circuit & Waveforms Q = Idt rr Ig Isd L Isd I F di/dt I RM t rr Rev.: January 7 www.aosmd.com Page 5 of 9

AO668 PChannel Electrical Characteristics (T J =5 C unless otherwise noted) Symbol Parameter Conditions Min Typ Max Units STATIC PARAMETERS BV DSS DrainSource Breakdown Voltage I D =5mA, V GS =V V I DSS Zero Gate Voltage Drain Current V DS =V, V GS =V T J =55 C 5 ma I GSS GateBody leakage current V DS =V, V GS = ±8V ± na V GS(th) Gate Threshold Voltage V DS =V GS I D =5mA.4.65 V V GS =4.5V, I D =3.3A 63 75 mw T J =5 C 87 5 R DS(ON) Static DrainSource OnResistance V GS =.5V, I D =.5A 78 5 mw V GS =.8V, I D =A 96 35 mw g FS Forward Transconductance V DS =5V, I D =3.3A 3 S V SD Diode Forward Voltage I S =A,V GS =V.7 V I S Maximum BodyDiode Continuous Current.5 A DYNAMIC PARAMETERS C iss Input Capacitance 5 pf C oss Output Capacitance V GS =V, V DS =V, f=mhz 7 pf C rss Reverse Transfer Capacitance 5 pf R g Gate resistance V GS =V, V DS =V, f=mhz 5 3 W SWITCHING PARAMETERS Q g (4.5V) Total Gate Charge 6 nc Q gs Gate Source Charge V GS =4.5V, V DS =V, I D =3.3A.6 nc Q gd Gate Drain Charge.8 nc t D(on) TurnOn DelayTime ns t r TurnOn Rise Time V GS =4.5V, V DS =V, R L =4W, ns t D(off) TurnOff DelayTime R GEN =6W 6 ns t f TurnOff Fall Time 3 ns t rr Body Diode Reverse Recovery Time I F =3.3A, di/dt=a/ms 6 ns Q rr Body Diode Reverse Recovery Charge I F =3.3A, di/dt=a/ms 4 nc A. The value of R qja is measured with the device mounted on in FR4 board with oz. Copper, in a still air environment with T A =5 C. The value in any given application depends on the user's specific board design. B. The power dissipation P D is based on T J(MAX) =5 C, using s junctiontoambient thermal resistance. C. Repetitive rating, pulse width limited by junction temperature T J(MAX) =5 C. Ratings are based on low frequency and duty cycles to keep initialt J =5 C. D. The R qja is the sum of the thermal impedence from junction to lead R qjl and lead to ambient. E. The static characteristics in Figures to 6 are obtained using <3ms pulses, duty cycle.5% max. F. These curves are based on the junctiontoambient thermal impedence which is measured with the device mounted on in FR4 board with oz. Copper, assuming a maximum junction temperature of T J(MAX) =5 C. The SOA curve provides a single pulse rating. APPLICATIONS OR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,FUNCTIONS AND RELIABILITY WITHOUT NOTICE. Rev.: January 7 www.aosmd.com Page 6 of 9

R DS(ON) (mw) I S (A) R DS(ON) (mw) Normalized OnResistance I D (A) I D (A) AO668 PChannel: TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 5 4.5V 4V 3.5V 3V 5 V DS =5V 5.5V V 5 C 5 5 5 C V GS =.5V 3 4 5 V DS (Volts) Fig : OnRegion Characteristics (Note E).5.5.5 3 V GS (Volts) Figure : Transfer Characteristics (Note E) 5.6 3.4 V GS =.5V I D =.5A 3 9 7 V GS =.8V V GS =.5V V GS =4.5V. V GS =.8V I D =A V 5 GS =4.5V I D =3.3A 5 5 4 6 8 I D (A) Figure 3: OnResistance vs. Drain Current and Gate Voltage (Note E).8 5 5 75 5 5 75 Temperature ( C) Figure 4: OnResistance vs. Junction Temperature (Note E) 8 8 6 4 8 5 C I D =3.3A.E.E 4.E.E.E3 5 C 5 C 6 5 C.E4 4 4 6 8 V GS (Volts) Figure 5: OnResistance vs. GateSource Voltage (Note E).E5...4.6.8.. V SD (Volts) Figure 6: BodyDiode Characteristics (Note E) Rev.: January 7 www.aosmd.com Page 7 of 9

Z qja Normalized Transient Thermal Resistance I D (Amps) Power (W) V GS (Volts) Capacitance (pf) AO668 PChannel: TYPICAL ELECTRICAL AND THERMAL CHARACTERISTICS 5 4 V DS =V I D =3.3A 8 3 6 C iss 4 C oss 3 4 5 6 Q g (nc) Figure 7: GateCharge Characteristics C rss 5 5 V DS (Volts) Figure 8: Capacitance Characteristics. T A =5 C... R DS(ON) limited T J(Max) =5 C T A =5 C DC... V DS (Volts) Figure 9: Maximum Forward Biased Safe Operating Area (Note F) ms ms ms s. E5.. 3 5 Pulse Width (s) Figure : Single Pulse Power Rating JunctiontoAmbient (Note F) D=T on /T T J,PK =T A P DM.Z qja.r qja R qja =3 C/W In descending order D=.5,.3,.,.5,.,., single pulse.. Single Pulse T. E5.... Pulse Width (s) Figure : Normalized Maximum Transient Thermal Impedance (Note F) P D T on Rev.: January 7 www.aosmd.com Page 8 of 9

AO668 Gate Charge Test Circuit & Waveform Qg V Qgs Qgd Ig Charge RL Resistive Switching Test Circuit & Waveforms ton toff td(on) tr td(off) tf Rg 9% % Id L Unclamped Inductive Switching (UIS) Test Circuit & Waveforms E = / LI AR AR Rg Id BV DSS I AR Diode Recovery Test Circuit & Waveforms Q = Idt rr Ig Isd L Isd I F di/dt I RM t rr Rev.: January 7 www.aosmd.com Page 9 of 9