P-Channel Enhancement Mode MOSFET Features Pin Configuration -0V/-13A, R DS(ON) =205mΩ (max.) @ V GS =-V R DS(ON) =300mΩ (max.) @ V GS =-4V Reliable and Rugged D S G S D G Lead Free and Green Devices Available (RoHS Compliant) Top View of TO-252-2 Top View of TO-251 0% UIS + R g Tested D Applications G Power Management in Desktop Computer or DC/DC Converters. S P-Channel MOSFET Ordering and Marking Information SM1A16PS Assembly Material Handling Code Temperature Range Package Code Package Code U : TO-252-2 UB : TO-251 Operating Junction Temperature Range C : -55 to 150 o C Handling Code TR : Tape & Reel for TO-252-2 Package TU : Tube for TO-251 Package Assembly Material G : Halogen and Lead Free Device SM1A16PS U/UB : SM1A16P XXXXX XXXXX - Lot Code Note : SINOPOWER lead-free products contain molding compounds/die attach materials and 0% matte tin plate termination finish; which are fully compliant with RoHS. SINOPOWER lead-free products meet or exceed the leadfree requirements of IPC/JEDEC J-STD-020D for MSL classification at lead-free peak reflow temperature. SINOPOWER defines Green to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). SINOPOWER reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. 1
Absolute Maximum Ratings Symbol Parameter Rating Unit Common Ratings (T A =25 C Unless Otherwise Noted) V DSS Drain-Source Voltage -0 V GSS Gate-Source Voltage ±20 V T J Maximum Junction Temperature 150 C T STG Storage Temperature Range -55 to 150 C I S Diode Continuous Forward Current -1 A I DP I D P D 300μs Pulse Drain Current Tested T C =25 C -52 T C =0 C -32 A Continuous Drain Current T C =25 C -13* T C =0 C -8 A Maximum Power Dissipation T C =25 C 50 T C =0 C 20 W R θjc Thermal Resistance-Junction to Case 2.5 C/W R θja Thermal Resistance-Junction to Ambient 50 C/W Note:* Current limited by bond wire. Electrical Characteristics (T A = 25 C unless otherwise noted) Symbol Parameter Test Conditions Static Characteristics SM1A16PSU/UB Min. Typ. Max. BV DSS Drain-Source Breakdown Voltage V GS =0V, I DS =-250µA -0 - - V I DSS Zero Gate Voltage Drain Current V DS =-80V, V GS =0V - - -1 T J =85 C - - -30 V GS(th) Gate Threshold Voltage V DS =V GS, I DS =-250µA -1 - -3 V I GSS Gate Leakage Current V GS =±16V, V DS =0V - - ± µa R DS(ON) a Drain-Source On-state Resistance Diode Characteristics V SD a V GS =-V, I DS =-7.8A - - 205 V GS =-4V, I DS =-6A - - 300 Diode Forward Voltage I SD =-1A, V GS =0V - -0.75-1.1 V trr Reverse Recovery Time I DS =-7.8A, - 34 - ns Qrr Reverse Recovery Charge dl SD /dt=0a/µs - 59 - nc Unit µa mω 2
Electrical Characteristics (Cont.) (T A = 25 C unless otherwise noted) Symbol Parameter Test Conditions Dynamic Characteristics b SM1A16PSU/UB Min. Typ. Max. C iss Input Capacitance V GS =0V, - 50 - C oss Output Capacitance V DS =-30V, - 70 - Reverse Transfer Capacitance Frequency=1.0MHz - 40 - C rss t d(on) Turn-on Delay Time - 11 21 t r Turn-on Rise Time V DD =-30V, R L =30Ω, - 19 I DS =-1A, V GEN =-V, t d(off) Turn-off Delay Time R G =6Ω - 55 0 Turn-off Fall Time - 30 55 t f Gate Charge Characteristics b Q g Total Gate Charge - 20.9 38 Q gs Gate-Source Charge V DS =-50V, V GS =-V, I DS =-7.8A - 4.2 - Gate-Drain Charge - 5.2 - Q gd Note a : Pulse test ; pulse width 300µs, duty cycle 2%. Note b : Guaranteed by design, not subject to production testing. Unit pf ns nc 3
Typical Operating Characteristics Power Dissipation Drain Current 60 15 50 12 P tot - Power (W) 40 30 20 -I D - Drain Current (A) 9 6 3 T C =25 o C 0 0 20 40 60 80 0 120 140 160 T C =25 o C,V G =-V 0 0 20 40 60 80 0 120 140 160 T j - Junction Temperature ( o C) T j - Junction Temperature ( o C) Safe Operation Area Thermal Transient Impedance -I D - Drain Current (A) 200 0 1 Rds(on) Limit 300µs 1ms ms 0ms 1s DC T C =25 o C 0.1 0.1 1 0 400 Normalized Transient Thermal Resistance 2 1 0.1 0.01 0.02 0.05 0.1 0.2 Duty = 0.5 Single Pulse Mounted on 1in 2 pad R θja :50 o C/W 0.01 1E-4 1E-3 0.01 0.1 1 0 -V DS - Drain-Source Voltage (V) Square Wave Pulse Duration (sec) 4
Typical Operating Characteristics (Cont.) Output Characteristics Drain-Source On Resistance 16 14 V GS =-5,-6,-7, -8,-9,-V -4V 320 280 -I D - Drain Current (A) 12 8 6 4 2-3.5V -3V R DS(ON) - On Resistance (mω) 240 200 160 120 80 V GS =-4V V GS =-V -2.5V 0 0 1 2 3 4 5 40 0 4 8 12 16 -V DS - Drain-Source Voltage (V) -I D - Drain Current (A) Gate-Source On Resistance Gate Threshold Voltage 400 I DS =-7.8A 1.6 I DS =-250µA 350 1.4 R DS(ON) - On Resistance (mω) 300 250 200 150 0 Normalized Threshold Voltage 1.2 1.0 0.8 0.6 0.4 50 2 3 4 5 6 7 8 9 0.2-50 -25 0 25 50 75 0 125 150 -V GS - Gate-Source Voltage (V) T j - Junction Temperature ( o C) 5
Typical Operating Characteristics (Cont.) Drain-Source On Resistance Source-Drain Diode Forward Normalized On Resistance 2.5 2.0 1.5 1.0 0.5 V GS = -V I DS = -7.8A -I S - Source Current (A) 20 1 T j =150 o C T j =25 o C R ON @T j =25 o C: 150mΩ 0.0-50 -25 0 25 50 75 0 125 150 T j - Junction Temperature ( o C) 0.1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 -V SD - Source-Drain Voltage (V) Capacitance Gate Charge C - Capacitance (nc) 1400 Frequency=1MHz 1200 Ciss 00 800 600 400 200 Coss Crss 0 0 5 15 20 25 30 35 40 -V GS - Gate-Source Voltage (V) 9 8 7 6 5 4 3 2 1 V DS = -50V I DS = -7.8A 0 0 3 6 9 12 15 18 21 -V DS - Drain-Source Voltage (V) Q G - Gate Charge (nc) 6
Avalanche Test Circuit and Waveforms VDS L tav DUT EAS RG VDD VDD tp IAS IL 0.01W tp VDSX(SUS) VDS Switching Time Test Circuit and Waveforms VDS RG VGS DUT RD VDD VGS % td(on) tr td(off) tf tp 90% VDS 7
Disclaimer Sinopower Semiconductor, Inc. (hereinafter Sinopower ) has been making great efforts to development high quality and better performance products to satisfy all customers needs. However, a product may fail to meet customer s expectation or malfunction for various situations. All information which is shown in the datasheet is based on Sinopower s research and development result, therefore, Sinopower shall reserve the right to adjust the content and monitor the production. In order to unify the quality and performance, Sinopower has been following JEDEC while defines assembly rule. Notwithstanding all the suppliers basically follow the rule for each product, different processes may cause slightly different results. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the products. Sinopower does not grant customers explicitly or implicitly, any license to use or exercise intellectual property or other rights held by Sinopower and other parties. Sinopower shall bear no responsible whatsoever for any dispute arising from the use of such technical information. The products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability, such as the failure or malfunction of which any may result in a direct threat to human life or a risk of human injury. Sinopower shall bear no responsibility in any way for use of any of the products for the above special purposes. If a product is intended to use for any such special purpose, such as vehicle, military, or medical controller relevant applications, please contact Sinopower sales representative before purchasing. 8
Classification Profile 9
Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Preheat & Soak Temperature min (T smin ) Temperature max (T smax ) Time (T smin to T smax ) (t s ) 0 C 150 C 60-120 seconds 150 C 200 C 60-120 seconds Average ramp-up rate (T smax to T P ) 3 C/second max. 3 C/second max. Liquidous temperature (T L ) Time at liquidous (t L ) Peak package (T p )* body Temperature Time (t P )** within 5 C of the specified classification temperature (T c ) 183 C 60-150 seconds 217 C 60-150 seconds See Classification Temp in table 1 See Classification Temp in table 2 20** seconds 30** seconds Average ramp-down rate (T p to T smax ) 6 C/second max. 6 C/second max. Time 25 C to peak temperature 6 minutes max. 8 minutes max. * Tolerance for peak profile Temperature (T p ) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (t p ) is defined as a supplier minimum and a user maximum. Table 1. SnPb Eutectic Process Classification Temperatures (Tc) Package Volume mm 3 Thickness <350 Table 2. Pb-free Process Classification Temperatures (Tc) Volume mm 3 350 <2.5 mm 235 C 220 C 2.5 mm 220 C 220 C Package Thickness Volume mm 3 <350 Volume mm 3 350-2000 Volume mm 3 >2000 <1.6 mm 260 C 260 C 260 C 1.6 mm 2.5 mm 260 C 250 C 245 C 2.5 mm 250 C 245 C 245 C Reliability Test Program Test item Method Description SOLDERABILITY JESD-22, B2 5 Sec, 245 C HTRB JESD-22, A8 00 Hrs, 80% of VDS max @ Tjmax HTGB JESD-22, A8 00 Hrs, 0% of VGS max @ Tjmax PCT JESD-22, A2 168 Hrs, 0%RH, 2atm, 121 C TCT JESD-22, A4 500 Cycles, -65 C~150 C Customer Service Sinopower Semiconductor, Inc. 5F, No. 6, Dusing 1St Rd., Hsinchu Science Park, Hsinchu, 30078, Taiwan TEL: 886-3-5635818 Fax: 886-3-5635080