R8x SERIES Low Voltage 5mA LDO REGULATOR NO.EA--7 OUTLINE The R8x Series are CMOS-based positive voltage regulator ICs with high output voltage accuracy and low supply current. Each of these ICs consists of a voltage reference unit, an error amplifier, resistor-net for voltage setting, a current limit circuit which prevents the destruction by excess current, and so on. The output voltage of these ICs is fixed with high accuracy. The R8 Series has low dropout voltage caused by built in low on resistance transistor. Further, the consumption current of IC itself is Typ..µA at no load, at the same time, compared with the conventional low supply current regulator, transient response is improved in all the load range by our original seamless technology. Since the packages for these ICs are SOT--5 and ultra small PLP-, high density mounting of the ICs on boards is possible. FEATURES Low Supply Current...Typ. µa(except the current through CE pull-down circuit) Standby Current...Typ..µA Input Voltage Range....5V to.v...v to.v Low Dropout Voltage...Typ..V (IOUT=5mA.V Output type) Ripple Rejection...Typ. 55dB at khz (VOUT=.5V, IOUT=mA) Typ. db at khz (VOUT=.5V, IOUT=mA) High Accuracy...±.% (VOUT > =.5V), ±5mV (VOUT<.5V) Low Temperature-Drift Coefficient of... Typ. ±ppm/ C Excellent Line Regulation...Typ..%/V Small Packages...SOT--5,PLP- Built-in Fold Back Protection Circuit...Typ. 5mA (Current at short mode) Ceramic capacitors are recommended to be used with this IC (.µf or more) APPLICATIONS Stable voltage reference. Power source for electrical appliances such as cameras, camcorders, mobile communication equipment. Power source for battery-powered equipment.
R8x BLOCK DIAGRAMS R8xxxB R8xxxD VDD VOUT VDD VOUT Vref Current Limit Vref Current Limit CE GND CE GND SELECTION GUIDE The output voltage, auto discharge function*, and the package type for the ICs can be selected at the user's request. The selection can be made with designating the part number as shown below: R8xxxx-TR-x Part Number a b c d e Code a b c d e Designation of Package Type : N: SOT--5 (Mini mold) K: PLP- Contents Setting (VOUT) : Stepwise setting with a step of.v in the range of.v to.v is possible. Exceptions.5V output type: R8xx5,.85V output type: R8x8x5,.85V output type: R8x8x5. Designation of Mask Option B: active high, without auto discharge function* at OFF state. D: active high, with auto discharge function* at OFF state. Designation of Taping Type : Ex. TR (refer to Taping Specifications; TR type is the standard direction.) Designation of composition of pin plating: -F: Lead free plating (SOT--5) None: Au plating (PLP-) *) When the mode is into standby with CE signal, auto discharge transistor turns on, and it makes the turn-off speed faster than normal type.
R8x PIN CONFIGURATIONS SOT--5 PLP- 5 Top View 5 Bottom View 5 (Mark side) PIN DESCRIPTIONS SOT--5 (R8N) PLP- (R8K) Pin No Symbol Pin Description Pin No Symbol Pin Description GND Ground Pin VDD Input Pin VDD Input Pin GND Ground Pin VOUT Output pin CE Chip Enable Pin NC No Connection NC No Connection 5 CE Chip Enable Pin 5 NC No Connection ABSOLUTE MAXIMUM RATINGS VOUT Output pin Tab in the parts have GND level. (They are connected to the reverse side of this IC.) Do not connect to other wires or land patterns. Symbol Item Rating Unit VIN Input Voltage.5 V VCE Input Voltage (CE Pin). to.5 V VOUT. to VIN+. V IOUT Output Current ma PD Power Dissipation (SOT--5) * Power Dissipation (PLP-) * 5 Topt Operating Temperature Range to 85 C Tstg Storage Temperature Range 55 to 5 C ) For Power Dissipation, please refer to PACKAGE INFORMATION to be described. mw
R8x ELECTRICAL CHARACTERISTICS R8xxxB/D Topt=5 C Symbol Item Conditions Min. Typ. Max. Unit VOUT VIN=Set VOUT+V VOUT >.5V.99. IOUT=mA VOUT < =.5V ( 5mV) (+5mV) IOUT Output Current VIN VOUT=.V 5 ma VOUT/ IOUT VDIF Load Regulation Dropout Voltage VIN=Set VOUT+V ma < = IOUT < = 5mA V 8 mv Refer to the ELECTRICAL CHARACTERISTICS by OUTPUT VOLTAGE ISS Supply Current VIN=Set VOUT+V, IOUT=mA. 7. µa Istandby Supply Current (Standby) VIN=Set VOUT+V, VCE=GND.. µa VOUT/ VIN RR Line Regulation Ripple Rejection Set VOUT+.5V < = VIN < =.V IOUT=mA f=khz f=khz VOUT=.5V,IOUT=mA.. %/V 55 db VIN Input Voltage.5. V VOUT/ Topt Temperature Coefficient IOUT=mA C < = Topt < = 85 C ± ppm/ C Ilim Short Current Limit VOUT=V 5 ma IPD CE Pull-down Current.5..55 µa VCEH CE Input Voltage H.. V VCEL CE Input Voltage L.. V en Output Noise BW=Hz to khz µvrms RLOW Nch Tr.On resistance for auto discharge function (Only applied to D Version) CE= L 5 Ω
R8x ELECTRICAL CHARACTERISTICS by OUTPUT VOLTAGE Dropout Voltage VDIF (V) VOUT (V) Condition Typ. Max.. < = VOUT <...8. < = VOUT <..5.75. < = VOUT <.5..7.5 < = VOUT <... IOUT=5mA. < = VOUT <.8...8 < = VOUT <...9. < = VOUT <.8.9. VOUT=..5. Topt = 5 C TYPICAL APPLICATIONS VDD VOUT VOUT C R8x Series C CE GND (External components example; Output capacitor: Ceramic type Input capacitor: Ceramic type Output Capacitor:.µF Kyocera CM5BKAB Murata GRM55BCKA87B.µF Kyocera CM5X5R5KAB TDK C5JBJ5K Murata GRM55BJ5KE8B 5
R8x TEST CIRCUITS VDD VOUT C R8x Series V C VOUT IOUT CE GND C=Ceramic.µF C=Ceramic.µF Fig. Standard test Circuit VDD VOUT A ISS C R8x Series C CE GND C=Ceramic.µF C=Ceramic.µF Fig. Supply Current Test Circuit VDD VOUT Pulse Generator R8x Series C IOUT CE GND C=Ceramic.µF Fig. Ripple Rejection, Line Transient Response Test Circuit
R8x TYPICAL CHARACTERISTICS ) vs. Output Current (Topt=5 C) R8xx.. R8x8x...8.... VDD=.5V VDD=.8V VDD=.V VDD=.7V VDD=.V 5 5 5 5.5..5..5. VDD=.V VDD=.5V VDD=.8V VDD=.8V 5 5 5 5.5..5..5..5..5. R8xx VDD=.V VDD=5.V VDD=.V 5 5 5 5 ) vs. Input Voltage (Topt=5 C) R8xx.. R8x8x...8... IOUT=mA IOUT=mA IOUT=mA.5..5..5 IOUT=mA IOUT=mA IOUT=mA. 5. 5 7
R8x R8xx 5..5..5..5..5..5. IOUT=mA IOUT=mA IOUT=mA 5 ) Supply Current vs. Input Voltage R8xx R8x8x Supply Current ISS(µA) 8 Supply Current ISS(µA) 8.... 5..8.8.8 5.8 R8xx Supply Current ISS(µA) 8 5 8
R8x ) vs. Temperature (IOUT=mA) R8xx.....9.8.7 VIN=.V. - -5 5 5 75 85 Temperature Topt( C) R8x8x VIN=.8V..95.9.85.8.75.7.5. - -5 5 5 75 85 Temperature Topt( C) R8xx VIN=5V..5..5..95.9.85.8 - -5 5 5 75 85 Temperature Topt( C) 5) Supply Current vs. Temperature (Topt=5 C) R8xx Supply Current ISS(µA) VIN=.V 9 8 7 5 - -5 5 5 75 85 Temperature Topt( C) Supply Current ISS(µA) R8x8x VIN=.8V 9 8 7 5 - -5 5 5 75 85 Temperature Topt( C) 9
R8x Supply Current ISS(µA) R8xx VIN=5V 9 8 7 5 - -5 5 5 75 85 Temperature Topt( C) ) Dropout Voltage vs. Output Current R8xx Dropout Voltage VDIF(mV) 8 7 5 85 C 5 C - C 5 5 75 5 5 Dropout Voltage VDIF(mV) 5 5 5 85 C 5 C - C R8x8x 5 5 75 5 5 R8xx Dropout Voltage VDIF(mV) 5 5 5 85 C 5 C - C 5 5 75 5 5
R8x 7) Dropout Voltage vs. Set (Topt=5 C) Dropout Voltage VDIF(mV) 7 5 ma ma ma ma 5mA..5..5..5. Set VREG(V) 8) Ripple Rejection vs. Input Bias Voltage (Vripple=.Vp-p) Ripple Rejection RR(dB) 8 7 5 Hz khz khz khz R8x8x IOUT=mA.9.... Ripple Rejection RR(dB) 8 7 5 Hz khz khz khz R8x8x IOUT=mA.9.... R8x8x Ripple Rejection RR(dB) 8 7 5 Hz khz khz khz IOUT=mA.9....
R8x 9) Ripple Rejection vs. Frequency (COUT=ceramic.µF) Ripple Rejection RR(dB) 8 7 5 R8xx VIN=.VDC+.Vp-p IOUT=mA IOUT=mA IOUT=mA. Frequency f(khz) Ripple Rejection RR(dB) 8 7 5 R8x8x VIN=.8VDC+.Vp-p IOUT=mA IOUT=mA IOUT=mA. Frequency f(khz) R8xx Ripple Rejection RR(dB) 8 7 5 VIN=5.VDC+.Vp-p IOUT=mA IOUT=mA IOUT=mA. Frequency f(khz) ) Input Transient Response (tr=tf=5µs, IOUT=mA) R8xx COUT=Ceramic.µF R8xx COUT=Ceramic µf... Input Voltage... Input Voltage. 5 7 8 9. 5 7 8 9
R8x R8x8x R8x8x COUT=Ceramic.µF COUT=Ceramic.µF.9.8.7 Input Voltage 5.9.8.7 Input Voltage 5. 5 7 8 9. 5 7 8 9 R8xx R8xx COUT=Ceramic.µF 7 COUT=Ceramic.µF 7...9 Input Voltage 5...9 Input Voltage 5.8 5 7 8 9.8 5 7 8 9 ) Load Transient Response (tr=tf=.5µs, CIN=Ceramic.µF) R8x8x VIN=.8V,COUT=.µF 5 R8x8x VIN=.8V,COUT=.µF..8. Output Current 5mA ma 5..8.. Output Current ma 5mA 5. 8 8. 5 5 75 5 5 75
R8x R8x8x R8x8x VIN=.8V,COUT=µF 5 VIN=.8V,COUT=µF..8. Output Current 5mA ma 5..8. Output Current ma 5mA 5. 8 8. 5 5 75 5 5 75 R8x8x R8xx VIN=.8V,COUT=.µF 5 VIN=.V,COUT=.µF 5.9.8.7 VR Output Current 5mA ma 5... VR Output Current 5mA ma 5. 5 7 8.8 8 8 R8xx R8xx VIN=.V,COUT=µF 5 VIN=5.V,COUT=.µF 5... VR Output Current 5mA ma 5...8 VR Output Current 5mA ma 5.8 8 8. 8 8
R8x R8xx VIN=5.V,COUT=µF 5...8 VR Output Current 5mA ma 5. 8 8 ) Turn on speed by CE pin (CIN=Ceramic.µF) R8xx R8xx COUT=.µF,VIN=.V COUT=.µF,VIN=.V,IOUT=mA..8. CE Input Voltage IOUT=mA IOUT=mA..8. CE Input Voltage 5 7 8 9 5 7 8 9 R8x8x R8x8x COUT=.µF,VIN=.V,IOUT=mA COUT=µF,VIN=.V,IOUT=mA CE Input Voltage CE Input Voltage 8 8 8 8 5
R8x R8xx R8xx COUT=.µF,VIN=.V,IOUT=mA 9 COUT=µF,VIN=.V,IOUT=mA 9 CE Input Voltage CE Input Voltage 8 8 8 8 ) Turn-off Speed by CE pin (CIN=Ceramic.µF) (D version) R8xD COUT=.µF,VIN=.V R8xD COUT=µF,VIN=.V..8. CE Input Voltage IOUT=mA IOUT=mA 5 7 8 9..8. CE Input Voltage IOUT=mA IOUT=mA 8 8 R8x8D R8x8D COUT=.µF,VIN=.V COUT=µF,VIN=.V CE Input Voltage IOUT=mA IOUT=mA 8 8 CE Input Voltage IOUT=mA IOUT=mA 5 7 8
R8x R8xD R8xD COUT=.µF,VIN=.V COUT=µF,VIN=.V IOUT=mA IOUT=mA CE Input Voltage 8 8 5 IOUT=mA IOUT=mA CE Input Voltage 5 7 8 5 External Components and Technical Notes Phase Compensation In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For this purpose, be sure to use a.µf or more capacitor CL (Ceramic type). If a tantalum capacitor is used, and its ESR (Equivalent Series Resistance) of CL is large, the loop oscillation may result. Because of this, select CL carefully considering its frequency characteristics. Mounting on Board Make VDD and GND lines sufficient. If their impedance is high, pick-up the noise or unstable operation may result. Connect the capacitor with a.µf or more between VDD and GND as close as possible. Set external components, especially the output capacitor, as close as possible to the ICs and make wiring as short as possible. (Refer to the typical application) 7
PACKAGE INFORMATION PE-SOT--5-5 SOT--5 (SC-7A) PACKAGE DIMENSIONS Unit: mm.9±..9±. (.95) (.95) +....8±. 5 +....8±. to..±. +..5.5. MIN. TAPING SPECIFICATION.±. φ.5 +..±..±.5.75±...5±.5 8.±...MAX..±..±. TR User Direction of Feed TAPING REEL DIMENSIONS (reel=pcs).±. 9.±. ±. ±.5 ±.8 + 8.5
PACKAGE INFORMATION PE-SOT--5-5 POWER DISSIPATION (SOT--5) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: (Power Dissipation (SOT--5) is substitution of SOT--.) Measurement Conditions Standard Land Pattern Environment Mounting on Board (Wind velocity=m/s) Board Material Glass cloth epoxy plactic (Double sided) Board Dimensions mm mm.mm Copper Ratio Top side : Approx. 5%, Back side : Approx. 5% Through-hole φ.5mm pcs Measurement Result (Topt=5 C,Tjmax=5 C) Standard Land Pattern Free Air Power Dissipation mw 5mW Thermal Resistance θja=(5 5 C)/.W= C/W C/W Power Dissipation PD(mW) 5 5 On Board Free Air 5 5 75 85 5 5 Ambient Temperature ( C) Power Dissipation Measurement Board Pattern IC Mount Area Unit : mm RECOMMENDED LAND PATTERN.7 MAX....95.95.9 (Unit: mm)
PACKAGE INFORMATION PE-PLP-- PLP- PACKAGE DIMENSIONS Unit: mm A..5 M AB.±.5 B.±.5.5.5..5±.5.5±.5.9±.5 INDEX.±.5 -C. TAPING SPECIFICATION S.5 S.MAX. Bottom View.±.5.±.5 Attention: Tabs or Tab suspension leads in the parts have VDD or GND level.(they are connected to the reverse side of this IC.) Refer to PIN DISCRIPTION. Do not connect to other wires or land patterns..±..5 +..±..±.5.5±.5 8.±..75±..9.±..9.MAX. TAPING REEL DIMENSIONS (reel=5pcs) TR.±. User Direction of Feed.±. 9.±. ±. ±.5 ±.8 +.5 8
PACKAGE INFORMATION PE-PLP-- POWER DISSIPATION (PLP-) This specification is at mounted on board. Power Dissipation (PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: (PLP- is a reference value calculated from the PLP8- package.) Measurement Conditions Environment Board Material Board Dimensions Standard Land Pattern Mounting on Board (Wind velocity=m/s) Glass cloth epoxy plactic (Double sided) mm mm.mm Copper Ratio Top side : Approx. 5%, Back side : Approx. 5% Through-hole φ.5mm pcs Measurement Result Power Dissipation Thermal Resistance (Topt=5 C,Tjmax=5 C) Standard Land Pattern 5mW θja=(5 5 C)/.5W=79 C/W Power Dissipation PD(mW) 5 5 On Board 5 5 75 85 5 5 Ambient Temperature ( C) Measurement Board Pattern Power Dissipation IC Mount Area Unit : mm RECOMMENDED LAND PATTERN.5.5.5.5 C..9.9..5.5.5 (Unit: mm)
MARK INFORMATION ME-R8K- R8K SERIES MARK SPECIFICATION PLP- to : Product Code (refer to Part Number vs. Product Code) 5 5, : Lot Number Part Number vs. Product Code Product Code Product Code Part Number Part Number R8KB E B R8KD F D R8KB E B R8KD F D R8KB E B R8KD F D R8K5B E 5 B R8K5D F 5 D R8KB E B R8KD F D R8K7B E 7 B R8K7D F 7 D R8K8B E 8 B R8K8D F 8 D R8K9B E 9 B R8K9D F 9 D R8KB E B R8KD F D R8KB E B R8KD F D R8KB E B R8KD F D R8KB E B R8KD F D R8KB E B R8KD F D R8K5B E 5 B R8K5D F 5 D R8KB E B R8KD F D R8K7B E 7 B R8K7D F 7 D R8K8B E 8 B R8K8D F 8 D R8K9B E 9 B R8K9D F 9 D R8KB E B R8KD F D R8KB E B R8KD F D R8KB E B R8KD F D R8KB E B R8KD F D R8KB E B R8KD F D R8K5B E 5 B R8K5D F 5 D R8KB E B R8KD F D R8K7B E 7 B R8K7D F 7 D R8K8B E 8 B R8K8D F 8 D R8K9B E 9 B R8K9D F 9 D R8KB E B R8KD F D R8KB5 E 5 R8KD5 F 5 R8K8B5 E 8 5 R8K8D5 F 8 5 R8K8B5 E 8 5 R8K8D5 F 8 5
MARK INFORMATION ME-R8N- R8N SERIES MARK SPECIFICATION SOT--5 (SC-7A) 5,, : Product Code (refer to Part Number vs. Product Code), 5 : Lot Number Part Number vs. Product Code Product Code Product Code Part Number Part Number R8NB C R8ND C R8NB D R8ND D R8NB E R8ND E R8N5B F R8N5D F R8NB G R8ND G R8N7B H R8N7D H R8N8B J R8N8D J R8N9B K R8N9D K R8NB A R8ND A R8NB B R8ND B R8NB C R8ND C R8NB D R8ND D R8NB E R8ND E R8N5B F R8N5D F R8NB G R8ND G R8N7B H R8N7D H R8N8B J R8N8D J R8N9B K R8N9D K R8NB A R8ND A R8NB B R8ND B R8NB C R8ND C R8NB D R8ND D R8NB E R8ND E R8N5B F R8N5D F R8NB G R8ND G R8N7B H R8N7D H R8N8B J R8N8D J R8N9B K R8N9D K R8NB L R8ND L R8NB5 M R8ND5 M R8N8B5 N R8N8D5 N R8N9B5 P R8N9D5 P