SCT3030AL N-channel SiC power MOSFET

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SCT33AL N-channel SiC power MOSFET V DSS R DS(on) (Typ.) I D P D 65V 3mW 7A 262W Outline TO-247N () (2) (3) Inner circuit Features ) Low on-resistance 2) Fast switching speed 3) Fast reverse recovery 4) Easy to parallel 5) Simple to drive 6) Pb-free lead plating ; RoHS compliant Packaging specifications Packing Reel size (mm) () Gate (2) Drain (3) Source * Body Diode Tube - Application Solar inverters DC/DC converters Switch mode power supplies Induction heating Motor drives Type Tape width (mm) - Basic ordering unit (pcs) 3 Taping code Marking C SCT33AL Absolute maximum ratings (T a = 25 C) Drain - Source voltage Parameter Symbol Value Unit V DSS 65 V Continuous drain current T c = 25 C T c = C I D * I D * 7 A 49 A drain current I D,pulse *2 75 A Gate - Source voltage (DC) V GSS -4 to +22 V Gate-Source Surge Voltage (t surge < 3nsec) V GSS_surge *3 Recommended Drive Voltage V GS_op *4-4 to +26 V / +8 V Junction temperature T j 75 C Range of storage temperature T stg -55 to +75 C 28 ROHM Co., Ltd. All rights reserved. TSZ22 4 /2 TSQ52-SCT33AL 4.Jun.28 - Rev.5

SCT33AL Thermal resistance Parameter Symbol Values Min. Typ. Max. Unit Thermal resistance, junction - case R thjc -.44.57 C/W Electrical characteristics (T a = 25 C) Parameter Symbol Conditions Values Min. Typ. Max. Unit Drain - Source breakdown voltage V (BR)DSS V GS = V, I D = ma 65 - - V Zero gate voltage drain current I DSS V DS = 65V, V GS = V T j = 25 C - T j = 5 C - 2 - ma Gate - Source leakage current I GSS+ V GS = +22V, V DS = V - - na Gate - Source leakage current I GSS- V GS = -4V, V DS = V - - - na Gate threshold voltage V GS (th) V DS = V, I D = 3.3mA 2.7-5.6 V Static drain - source on - state resistance R DS(on) V GS = 8V, I D = 27A T j = 25 C - 3 39 T j = 25 C - 39.6 - mw Gate input resistance R G f = MHz, open drain - 7 - W 28 ROHM Co., Ltd. All rights reserved. TSZ22 5 2/2 TSQ52-SCT33AL 4.Jun.28 - Rev.5

SCT33AL Electrical characteristics (T a = 25 C) Parameter Symbol Conditions Values Min. Typ. Max. Unit Transconductance g fs V DS = V, I D = 27A - 9.4 - S Input capacitance C iss V GS = V - 526 - Output capacitance C oss V DS = 5V - 89 - pf Reverse transfer capacitance C rss f = MHz - 42 - Effective output capacitance, energy related C o(er) V GS = V V DS = V to 3V - 23 - pf Turn - on delay time t d(on) Rise time t r Turn - off delay time t d(off) Fall time t f V DD = 3V, I D = 8A - 22 - V GS = 8V/V - 4 - R L = 7W - 48 - R G = W - 27 - ns V DD = 3V, I D =27A Turn - on switching loss E on V GS = 8V/V R G = W L=25mH *E Turn - off switching loss E on includes diode off reverse recovery - 68 - - 2 - mj Gate Charge characteristics (T a = 25 C) Parameter Symbol Conditions Values Min. Typ. Max. Unit Total gate charge Q g V DD = 3V - 4 - Gate - Source charge Q gs I D = 27A - 25 - nc Gate - Drain charge Q gd V GS = 8V - 42 - Gate plateau voltage V (plateau) V DD = 3V, I D = 27A - 9.6 - V 28 ROHM Co., Ltd. All rights reserved. TSZ22 5 3/2 TSQ52-SCT33AL 4.Jun.28 - Rev.5

SCT33AL Body diode electrical characteristics (Source-Drain) (T a = 25 C) Parameter Symbol Conditions Values Min. Typ. Max. Unit Inverse diode continuous, forward current I S * Tc = 25 C - - 7 A Inverse diode direct current, pulsed I SM *2 - - 75 A Forward voltage V SD V GS = V, I S = 27A - 3.2 - V Reverse recovery time t rr Reverse recovery charge Q rr Peak reverse recovery current I rrm I F = 27A, V R = 6V di/dt = A/ms - 26 - ns - 3 - nc - - A * Limited only by maximum temperature allowed. *2 PW ms, Duty cycle % *3 Example of acceptable Vgs waveform *4 Please be advised not to use SiC-MOSFETs with V gs below 3V as doing so may cause thermal runaway. 28 ROHM Co., Ltd. All rights reserved. TSZ22 5 4/2 TSQ52-SCT33AL 4.Jun.28 - Rev.5

SCT33AL Electrical characteristic curves Fig. Power Dissipation Derating Curve Fig.2 Maximum Safe Operating Area 3 Operation in this area is limited by R DS(on) Power Dissipation : P D [W] 25 2 5 5 5 5 2 Single Pulse P W = ms P W = ms P W = ms P W = ms.. Case Temperature : T C [ C] Transient Thermal Resistance : R th [K/W] Fig.3 Typical Transient Thermal Resistance vs. Pulse Width.. Single Pulse..... Pulse Width : P W [s] 28 ROHM Co., Ltd. All rights reserved. TSZ22 5 5/2 TSQ52-SCT33AL 4.Jun.28 - Rev.5

SCT33AL Electrical characteristic curves Fig.4 Typical Output Characteristics(I) Fig.5 Typical Output Characteristics(II) 7 6 2V 8V 35 3 2V 8V 4V 5 4 3 2 6V 4V 2V V 25 2 5 6V 2V V V GS = 8V 5 V GS = 8V 2 4 6 8 2 3 4 5 Fig.6 T j = 5 C Typical Output Characteristics(I) 7 6 5 4 3 2 2V 8V 6V 2V 4V V V GS = 8V Fig.7 T j = 5 C Typical Output Characteristics(II) 35 3 25 2 5 2V 8V 6V 2V 4V V V GS = 8V T a = 5ºC 2 4 6 8 5 T a = 5ºC 2 3 4 5 28 ROHM Co., Ltd. All rights reserved. TSZ22 5 6/2 TSQ52-SCT33AL 4.Jun.28 - Rev.5

SCT33AL Electrical characteristic curves Fig.8 Typical Transfer Characteristics (I) Fig.9 Typical Transfer Characteristics (II) 7 V DS = V 6 V DS = V. T a = 5ºC T a = 75ºC T a = -25ºC 5 4 3 2 T a = 5ºC T a = 75ºC T a = -25ºC. 2 4 6 8 2 4 6 8 2 2 4 6 8 2 4 6 8 2 Gate - Source Voltage : V GS [V] Gate - Source Voltage : V GS [V] Gate Threshold Voltage : V GS(th) [V] Fig. Gate Threshold Voltage vs. Junction Temperature 6 5 4 3 2 V DS = V I D = 3.3mA -5 5 5 2 Junction Temperature : T j [ C] Transconductance : g fs [S] Fig. Transconductance vs. Drain Current V DS = V T a = 5ºC T a = 75ºC T a = -25ºC.. 28 ROHM Co., Ltd. All rights reserved. TSZ22 5 7/2 TSQ52-SCT33AL 4.Jun.28 - Rev.5

SCT33AL Electrical characteristic curves Static Drain - Source On-State Resistance : R DS(on) [W] Fig.2 Static Drain - Source On - State Resistance vs. Gate Source Voltage.2..8.6.4.2 I D = 27A I D = 47A 6 8 2 4 6 8 2 22 Gate - Source Voltage : V GS [V] Static Drain - Source On-State Resistance : R DS(on) [W] Fig.3 Static Drain - Source On - State Resistance vs. Junction Temperature.2..8.6.4.2 V GS = 8V I D = 47A I D = 27A -5 5 5 2 Junction Temperature : T j [ºC] Static Drain - Source On-State Resistance : R DS(on) [W].. Fig.4 Static Drain - Source On - State Resistance vs. Drain Current V GS = 8V T a = 5ºC T a = 25ºC T a = 75ºC T a = -25ºC 28 ROHM Co., Ltd. All rights reserved. TSZ22 5 8/2 TSQ52-SCT33AL 4.Jun.28 - Rev.5

SCT33AL Electrical characteristic curves Capacitance : C [pf] Switching Time : t [ns] Fig.5 Typical Capacitance vs. Drain - Source Voltage f = MHz V GS = V C rss C oss C iss. t d(off) Fig.7 Switching Characteristics t f t r t d(on) V DD = 3V V GS = 8V R G = W Gate - Source Voltage : V GS [V] Coss Stored Energy : E OSS [mj] 2 5 5 2 5 Fig.6 Coss Stored Energy 5 2 3 4 Fig.8 Dynamic Input Characteristics V DD = 3V I D = 27A. 2 3 4 5 6 7 8 9 Total Gate Charge : Q g [nc] 28 ROHM Co., Ltd. All rights reserved. TSZ22 5 9/2 TSQ52-SCT33AL 4.Jun.28 - Rev.5

SCT33AL Electrical characteristic curves Switching Energy : E [mj] Fig.9 Typical Switching Loss vs. Drain - Source Voltage 4 35 3 25 2 5 5 I D =27A V GS = 8V/V R G =W L=25mH E on E off Switching Energy : E [mj] Fig.2 Typical Switching Loss vs. Drain Current 2 8 6 4 2 V DD =3V V GS = 8V/V R G =W L=25mH E on E off 2 3 4 5 2 3 4 5 6 7 8 Fig.2 Typical Switching Loss vs. External Gate Resistance 2 Switching Energy : E [mj] 8 6 4 2 V DD =3V I D =27A V GS = 8V/V L=25mH E on E off 5 5 2 25 3 External Gate Resistance : R G [W] 28 ROHM Co., Ltd. All rights reserved. TSZ22 5 /2 TSQ52-SCT33AL 4.Jun.28 - Rev.5

SCT33AL Electrical characteristic curves Fig.22 Inverse Diode Forward Current vs. Source - Drain Voltage Fig.23 Reverse Recovery Time vs.inverse Diode Forward Current Inverse Diode Forward Current : I S [A]. V GS = V T a = 5ºC T a = 75ºC T a = -25ºC Reverse Recovery Time : t rr [ns] di / dt = A / us V R = 3V V GS = V. 2 3 4 5 6 7 8 Source - Drain Voltage : V SD [V] Inverse Diode Forward Current : I S [A] 28 ROHM Co., Ltd. All rights reserved. TSZ22 5 /2 TSQ52-SCT33AL 4.Jun.28 - Rev.5

SCT33AL Measurement circuits Fig.- Switching Time Measurement Circuit Fig.-2 Switching Waveforms Fig.2- Gate Charge Measurement Circuit Fig.2-2 Gate Charge Waveform Fig.3- Switching Energy Measurement Circuit Fig.3-2 Switching Waveforms E on = I D V DS E off = I D V DS Same type device as D.U.T. V DS I rr V surge D.U.T. I D I D Fig.4- Reverse Recovery Time Measurement Circuit Fig.4-2 Reverse Recovery Waveform D.U.T. 28 ROHM Co., Ltd. All rights reserved. TSZ22 5 2/2 TSQ52-SCT33AL 4.Jun.28 - Rev.5

Notice Notes ) 2) 3) 4) 5) 6) 7) 8) 9) ) ) 2) The information contained herein is subject to change without notice. Before you use our Products, please contact our sales representative and verify the latest specifications : Although ROHM is continuously working to improve product reliability and quality, semiconductors can break down and malfunction due to various factors. Therefore, in order to prevent personal injury or fire arising from failure, please take safety measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no responsibility for any damages arising out of the use of our Poducts beyond the rating specified by ROHM. Examples of application circuits, circuit constants and any other information contained herein are provided only to illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM or any other parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of such technical information. The Products specified in this document are not designed to be radiation tolerant. For use of our Products in applications requiring a high degree of reliability (as exemplified below), please contact and consult with a ROHM representative : transportation equipment (i.e. cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, and power transmission systems. Do not use our Products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters. ROHM shall have no responsibility for any damages or injury arising from non-compliance with the recommended usage conditions and specifications contained herein. ROHM has used reasonable care to ensur the accuracy of the information contained in this document. However, ROHM does not warrants that such information is error-free, and ROHM shall have no responsibility for any damages arising from any inaccuracy or misprint of such information. Please use the Products in accordance with any applicable environmental laws and regulations, such as the RoHS Directive. For more details, including RoHS compatibility, please contact a ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations. When providing our Products and technologies contained in this document to other countries, you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act. 3) This document, in part or in whole, may not be reprinted or reproduced without prior consent of ROHM. Thank you for your accessing to ROHM product informations. More detail product informations and catalogs are available, please contact us. ROHM Customer Support System http:///contact/ 25 ROHM Co., Ltd. All rights reserved. R2S

SCT33AL - Web Page Distribution Inventory Part Number SCT33AL Package TO-247N Unit Quantity 45 Minimum Package Quantity 3 Packing Type Tube Constitution Materials List inquiry RoHS Yes