Trench gate field-stop IGBT, HB series 650 V, 40 A high speed. Features. Description G1C2TE3

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Transcription:

Trench gate field-stop IGBT, HB series 650 V, 40 A high speed Datasheet - production data TAB 2 3 1 D²PAK Figure 1: Internal schematic diagram C(2, TAB) G(1) E(3) Features Maximum junction temperature: TJ = 175 C High speed switching series Minimized tail current Low saturation voltage: VCE(sat) = 1.6 V (typ.) @ IC = 40 A Tight parameter distribution Safe paralleling Low thermal resistance Applications Photovoltaic inverters High frequency converters Description This device is an IGBT developed using an advanced proprietary trench gate field-stop structure. The device is part of the new HB series of IGBTs, which represents an optimum compromise between conduction and switching loss to maximize the efficiency of any frequency converter. Furthermore, the slightly positive VCE(sat) temperature coefficient and very tight parameter distribution result in safer paralleling operation. G1C2TE3 Table 1: Device summary Order code Marking Package Packing STGB40H65FB GB40H65FB D²PAK Tape and reel June 2016 DocID029491 Rev 1 1/17 This is information on a product in full production. www.st.com

Contents STGB40H65FB Contents 1 Electrical ratings... 3 2 Electrical characteristics... 4 2.1 Electrical characteristics (curves)... 6 3 Test circuits... 10 4 Package information... 11 4.1 D²PAK package information... 11 4.2 D²PAK packing information... 14 5 Revision history... 16 2/17 DocID029491 Rev 1

Electrical ratings 1 Electrical ratings Table 2: Absolute maximum ratings Symbol Parameter Value Unit VCES Collector-emitter voltage (VGE = 0) 650 V IC Continuous collector current at TC = 25 C 80 A Continuous collector current at TC = 100 C 40 ICP (1) Pulsed collector current 160 A VGE Gate-emitter voltage ±20 V PTOT Total dissipation at TC = 25 C 283 W TSTG Storage temperature range - 55 to 150 TJ Operating junction temperature range - 55 to 175 C Notes: (1) Pulse width limited by maximum junction temperature. Table 3: Thermal data Symbol Parameter Value Unit RthJC Thermal resistance junction-case 0.53 RthJA Thermal resistance junction-ambient 62.5 C/W DocID029491 Rev 1 3/17

Electrical characteristics STGB40H65FB 2 Electrical characteristics TC = 25 C unless otherwise specified Table 4: Static characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit V(BR)CES VCE(sat) Collector-emitter breakdown voltage Collector-emitter saturation voltage VGE = 0 V, IC = 2 ma 650 V VGE = 15 V, IC = 40 A 1.6 2 VGE = 15 V, IC = 40 A, TJ = 125 C VGE = 15 V, IC = 40 A, TJ = 175 C VGE(th) Gate threshold voltage VCE = VGE, IC = 1 ma 5 6 7 V ICES Collector cut-off current VGE = 0 V, VCE = 650 V 25 µa IGES Gate-emitter leakage current VCE = 0 V, VGE = ±20 V ±250 na 1.7 1.8 V Table 5: Dynamic characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit Cies Input capacitance - 5412 - Coes Output capacitance VCE= 25 V, f = 1 MHz, VGE = 0 V - 198 - pf Cres Reverse transfer capacitance - 107 - Qg Total gate charge VCC = 520 V, IC = 40 A, - 210 - Qge Gate-emitter charge VGE = 15 V (see Figure 23: - 39 - nc Qgc Gate-collector charge "Gate charge test circuit") - 82-4/17 DocID029491 Rev 1

Electrical characteristics Table 6: Switching characteristics (inductive load) Symbol Parameter Test conditions Min. Typ. Max. Unit td(on) Turn-on delay time 40 - tr Current rise time 13 - (di/dt)on Turn-on current slope VCE = 400 V, IC = 40 A, 2413 - A/µs VGE = 15 V, RG = 5 Ω td(off) Turn-off-delay time 142 - (see Figure 22: "Test tf Current fall time circuit for inductive load 27 - ns Eon (1) Turn-on switching energy switching" ) 498 - Eoff (2) Turn-off switching energy 363 - µj Ets Total switching energy 861 - td(on) Turn-on delay time 38 - tr Current rise time 14 - (di/dt)on Turn-on current slope VCE = 400 V, IC = 40 A, 2186 - A/µs VGE = 15 V, RG = 5 Ω td(off) Turn-off-delay time 141 - TJ = 175 C (see Figure tf Current fall time 22: "Test circuit for 61 - ns Eon (1) Turn-on switching energy inductive load switching" ) 1417 - Eoff (2) Turn-off switching energy 764 - µj Ets Total switching energy 2181 - Notes: (1) Energy losses include reverse recovery of the external diode. The diode is the same of the co-packed STGW40H65DFB. (2) Including the tail of the collector current. ns ns DocID029491 Rev 1 5/17

Electrical characteristics 2.1 Electrical characteristics (curves) Figure 2: Power dissipation vs. case temperature STGB40H65FB Figure 3: Collector current vs. case temperature Figure 4: Output characteristics (TJ = 25 C) Figure 5: Output characteristics (TJ = 175 C) Figure 6: VCE(sat) vs. junction temperature Figure 7: VCE(sat) vs. collector current 6/17 DocID029491 Rev 1

Figure 8: Collector current vs. switching frequency Electrical characteristics Figure 9: Forward bias safe operating area Figure 10: Transfer characteristics Figure 11: Normalized VGE(th) vs. junction temperature Figure 12: Normalized V(BR)CES vs. junction temperature Figure 13: Capacitance variations DocID029491 Rev 1 7/17

Electrical characteristics Figure 14: Gate charge vs. gate-emitter voltage STGB40H65FB Figure 15: Switching energy vs. collector current Figure 16: Switching energy vs. gate resistance Figure 17: Switching energy vs. temperature Figure 18: Switching energy vs. collector emitter voltage Figure 19: Switching times vs. collector current 8/17 DocID029491 Rev 1

Figure 20: Switching times vs. gate resistance Electrical characteristics Figure 21: Thermal impedance DocID029491 Rev 1 9/17

Test circuits STGB40H65FB 3 Test circuits Figure 22: Test circuit for inductive load switching Figure 23: Gate charge test circuit V CC G C A A L=100 µh 12 V 47 kω 100 nf 1 kω + E R G B B G C 3.3 µf E D.U.T 1000 µf V CC V i V GMAX 2200 µf I G =CONST 2.7 kω 100 Ω D.U.T. V G - 47 kω P W 1 kω AM01504v 1 AM01505v1 Figure 24: Switching waveform 10/17 DocID029491 Rev 1

Package information 4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 4.1 D²PAK package information Figure 25: D²PAK (TO-263) type A package outline 0079457_A_rev22 DocID029491 Rev 1 11/17

Package information STGB40H65FB Table 7: D²PAK (TO-263) type A package mechanical data mm Dim. Min. Typ. Max. A 4.40 4.60 A1 0.03 0.23 b 0.70 0.93 b2 1.14 1.70 c 0.45 0.60 c2 1.23 1.36 D 8.95 9.35 D1 7.50 7.75 8.00 D2 1.10 1.30 1.50 E 10 10.40 E1 8.50 8.70 8.90 E2 6.85 7.05 7.25 e 2.54 e1 4.88 5.28 H 15 15.85 J1 2.49 2.69 L 2.29 2.79 L1 1.27 1.40 L2 1.30 1.75 R 0.4 V2 0 8 12/17 DocID029491 Rev 1

Package information Figure 26: D²PAK (TO-263) recommended footprint (dimensions are in mm) DocID029491 Rev 1 13/17

Package information 4.2 D²PAK packing information Figure 27: Tape outline STGB40H65FB 14/17 DocID029491 Rev 1

Figure 28: Reel outline Package information Table 8: D²PAK tape and reel mechanical data Tape Reel Dim. mm mm Dim. Min. Max. Min. Max. A0 10.5 10.7 A 330 B0 15.7 15.9 B 1.5 D 1.5 1.6 C 12.8 13.2 D1 1.59 1.61 D 20.2 E 1.65 1.85 G 24.4 26.4 F 11.4 11.6 N 100 K0 4.8 5.0 T 30.4 P0 3.9 4.1 P1 11.9 12.1 Base quantity 1000 P2 1.9 2.1 Bulk quantity 1000 R 50 T 0.25 0.35 W 23.7 24.3 DocID029491 Rev 1 15/17

Revision history STGB40H65FB 5 Revision history Table 9: Document revision history Date Revision Changes 27-Jun-2016 1 Initial release. 16/17 DocID029491 Rev 1

IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 2016 STMicroelectronics All rights reserved DocID029491 Rev 1 17/17