Proceedings A Comb-Based Capacitive MEMS Microphone with High Signal-to-Noise Ratio: Modeling and Noise-Level Analysis

Similar documents
19 th INTERNATIONAL CONGRESS ON ACOUSTICS MADRID, 2-7 SEPTEMBER 2007 CHALLENGES OF HIGH SNR (SIGNAL-TO-NOISE) SILICON MICROMACHINED MICROPHONES

A Micromechanical Binary Counter with MEMS-Based Digital-to-Analog Converter

Active Vibration Control in Ultrasonic Wire Bonding Improving Bondability on Demanding Surfaces

Proceedings Contactless Interrogation System for Capacitive Sensors with Time-Gated Technique

MICROMACHINED INTERFEROMETER FOR MEMS METROLOGY

High-speed wavefront control using MEMS micromirrors T. G. Bifano and J. B. Stewart, Boston University [ ] Introduction

PERFORMANCE OF A NEW MEMS MEASUREMENT MICROPHONE AND ITS POTENTIAL APPLICATION

Proceedings Improving the Durability of Screen Printed Conductors on Woven Fabrics for E-Textile Applications

HAPTIC A PROMISING NEW SOLUTION FOR AN ADVANCED HUMAN-MACHINE INTERFACE

Proceedings Piezoelectric Actuators for In-Liquid Particle Manipulation in Microfluidic Applications

Out-of-plane translatory MEMS actuator with extraordinary large stroke for optical path length modulation in miniaturized FTIR spectrometers

Module 5: Experimental Modal Analysis for SHM Lecture 36: Laser doppler vibrometry. The Lecture Contains: Laser Doppler Vibrometry

Micro-nanosystems for electrical metrology and precision instrumentation

Micro Coriolis Mass Flow Sensor with Extended Range for a Monopropellant Micro Propulsion System

Proceedings Development of a MEMS Plate Based on Thin-Film Piezoelectric AlN Actuators for Biological Applications

Multi-field Microphone when the Sound Field is unknown

Dynamic Modeling of Air Cushion Vehicles

3D Optical Motion Analysis of Micro Systems. Heinrich Steger, Polytec GmbH, Waldbronn

PROBLEM SET #7. EEC247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2015 C. Nguyen. Issued: Monday, April 27, 2015

Keywords: piezoelectric, micro gyroscope, reference vibration, finite element

3D Distortion Measurement (DIS)

CHAPTER 3 TWO DIMENSIONAL ANALYTICAL MODELING FOR THRESHOLD VOLTAGE

A New Model for Thermal Channel Noise of Deep-Submicron MOSFETS and its Application in RF-CMOS Design

INF 5490 RF MEMS. L12: Micromechanical filters. S2008, Oddvar Søråsen Department of Informatics, UoO

DAMPING, NOISE, AND IN-PLANE RESPONSE OF MEMS ACOUSTIC EMISSION SENSORS

INF 5490 RF MEMS. LN10: Micromechanical filters. Spring 2012, Oddvar Søråsen Department of Informatics, UoO

Bio-inspired Active Amplification in a MEMS Microphone using Feedback Computation

System Level Simulation of a Digital Accelerometer

MEMS. Platform. Solutions for Microsystems. Characterization

Acoustic Resonance Analysis Using FEM and Laser Scanning For Defect Characterization in In-Process NDT

Industrialization of Micro-Electro-Mechanical Systems. Werner Weber Infineon Technologies

Energy Income Estimation for Solar Cell Powered Wireless Sensor Nodes

IN-CHIP DEVICE-LAYER THERMAL ISOLATION OF MEMS RESONATOR FOR LOWER POWER BUDGET

INF 5490 RF MEMS. LN10: Micromechanical filters. Spring 2011, Oddvar Søråsen Jan Erik Ramstad Department of Informatics, UoO

A METHOD FOR A MODAL MEASUREMENT OF ELECTRICAL MACHINES

Modal analysis: a comparison between Finite Element Analysis (FEA) and practical Laser Doppler Vibrometer (LDV) testing.

BMC s heritage deformable mirror technology that uses hysteresis free electrostatic

Veröffentlichungen am IKFF PIEZOELECTRIC TRAVELLING WAVE MOTORS GENERATING DIRECT LINEAR MOTION

A Compact W-Band Reflection-Type Phase Shifter with Extremely Low Insertion Loss Variation Using 0.13 µm CMOS Technology

Available online at ScienceDirect. Procedia Engineering 120 (2015 ) EUROSENSORS 2015

Proceeding The Alignment Method for Linear Scale Projection Lithography Based on CCD Image Analysis

Paper VI. Non-synchronous resonators on leaky substrates. J. Meltaus, V. P. Plessky, and S. S. Hong. Copyright 2005 IEEE.

Adaptive Focal Plane Array - A Compact Spectral Imaging Sensor

FEM SIMULATION FOR DESIGN AND EVALUATION OF AN EDDY CURRENT MICROSENSOR

Mechanical Spectrum Analyzer in Silicon using Micromachined Accelerometers with Time-Varying Electrostatic Feedback

Micromachined Floating Element Hydrogen Flow Rate Sensor

A HIGH SENSITIVITY POLYSILICON DIAPHRAGM CONDENSER MICROPHONE

MEASUREMENT OF SURFACE DISPLACEMENT EXCITED BY EMAT TRANSDUCER

Proceedings The First Frequency-Modulated (FM) Pitch Gyroscope

VHDL-AMS Behavioural Modelling of a CMUT Element Samuel Frew University of British Columbia

Liquid sensor probe using reflecting SH-SAW delay line

Design and Optimization of Ultrasonic Vibration Mechanism using PZT for Precision Laser Machining

Void Reduction in Reflow Soldering Processes by Sweep Stimulation of PCB Substrate

CASE STUDY OF OPERATIONAL MODAL ANALYSIS (OMA) OF A LARGE HYDROELECTRIC GENERATOR

MEMS Real-Time Clocks: small footprint timekeeping. Paolo Frigerio November 15 th, 2018

A study of Vibration Analysis for Gearbox Casing Using Finite Element Analysis

Acoustic resolution. photoacoustic Doppler velocimetry. in blood-mimicking fluids. Supplementary Information

Waveguide-Mounted RF MEMS for Tunable W-band Analog Type Phase Shifter

Vibrating MEMS resonators

KLauS4: A Multi-Channel SiPM Charge Readout ASIC in 0.18 µm UMC CMOS Technology

Faculty Development Program on Micro-Electro-Mechanical Systems (MEMS Sensor)

HIGH-EFFICIENCY MQW ELECTROABSORPTION MODULATORS

Design, Characterization & Modelling of a CMOS Magnetic Field Sensor

Switch-less Dual-frequency Reconfigurable CMOS Oscillator using One Single Piezoelectric AlN MEMS Resonator with Co-existing S0 and S1 Lamb-wave Modes

Dynamic Generation of DC Displacement AN 13

LOW-COST PIEZOELECTRIC ACTUATORS ANALYTICAL, NUMERICAL AND EXPERIMENTAL STUDIES WITH A FOCUS ON MOBILE ROBOTICS. Production of Instruments ABSTRACT

Design & Simulation of Multi Gate Piezoelectric FET Devices for Sensing Applications

Silicon Light Machines Patents

Piezoelectric Sensors and Actuators

Strip Detectors. Principal: Silicon strip detector. Ingrid--MariaGregor,SemiconductorsasParticleDetectors. metallization (Al) p +--strips

Micro and Smart Systems

Fibre Laser Doppler Vibrometry System for Target Recognition

MEMS in ECE at CMU. Gary K. Fedder

Design and simulation of a membranes-based acoustic sensors array for cochlear implant applications

Supporting Information

Available online at ScienceDirect. Procedia Computer Science 79 (2016 )

Correction for Synchronization Errors in Dynamic Measurements

Estimation of BER from Error Vector Magnitude for Optical Coherent Systems

COMPARISON OF NUMERICALLY DETERMINED NOISE OF A 290 KW INDUCTION MOTOR USING FEM AND MEASURED ACOUSTIC RADIATION

SILICON BASED CAPACITIVE SENSORS FOR VIBRATION CONTROL

Development of a Package for a Triaxial High-G Accelerometer Optimized for High Signal Fidelity

On the accuracy reciprocal and direct vibro-acoustic transfer-function measurements on vehicles for lower and medium frequencies

Advanced Features of InfraTec Pyroelectric Detectors

Miniaturising Motion Energy Harvesters: Limits and Ways Around Them

A Compact Dual-Mode Wearable Antenna for Body-Centric Wireless Communications

Electric polarization properties of single bacteria measured with electrostatic force microscopy

Application of MEMS accelerometers for modal analysis

Application of optical measurement techniques for experimental modal analyses of lightweight structures

1-D EQUIVALENT CIRCUIT FOR RF MEMS CAPACITIVE SWITCH

BEAMFORMING WITHIN THE MODAL SOUND FIELD OF A VEHICLE INTERIOR

Part 2: Second order systems: cantilever response

A Doubly Decoupled X-axis Vibrating Wheel Gyroscope

430. The Research System for Vibration Analysis in Domestic Installation Pipes

CHAPTER 2 POLARIZATION SPLITTER- ROTATOR BASED ON A DOUBLE- ETCHED DIRECTIONAL COUPLER

Resonant MEMS Acoustic Switch Package with Integral Tuning Helmholtz Cavity

Energy Circulation Methods for Surface Acoustic Wave Motor

MEMS On-wafer Evaluation in Mass Production Testing At the Earliest Stage is the Key to Lowering Costs

Maximizing LPM Accuracy AN 25

Proceedings Statistical Evaluation of the Positioning Error in Sequential Localization Techniques for Sensor Networks

Behavioral Modeling and Simulation of Micromechanical Resonator for Communications Applications

Transcription:

Proceedings A Comb-Based Capacitive MEMS Microphone with High Signal-to-Noise Ratio: Modeling and Noise-Level Analysis Sebastian Anzinger 1,2, *, Johannes Manz 1, Alfons Dehe 2 and Gabriele Schrag 1 1 Institute for Physics of Electrotechnology at Technical University of Munich, 80333 Munich, Germany; manz@tep.ei.tum.de (J.M.); schrag@tep.ei.tum.de (G.S.) 2 Infineon Technologies AG, 85579 Neubiberg, Germany; Alfons.Dehe@infineon.com * Correspondence: sebastian.anzinger@tum.de; Tel.: +49-89-2892-3122 Presented at the Eurosensors 2017 Conference, Paris, France, 3 6 September 2017. Published: 8 August 2017 Abstract: We present a physics-based system-level model for optimizing a novel comb-based capacitive MEMS microphone towards high signal-to-noise ratios. The model includes non-linear coupling effects between the electrodes as well as the physical dependencies on relevant design parameters, thus enabling predictive statements w.r.t. the device performance. It is calibrated and validated by finite element simulations and laser Doppler vibrometer measurements of first prototypes. Being formulated as a generalized Kirchhoffian network, it can be implemented in a standard circuit simulation tool. The predicted signal-to-noise ratio of this concept reaches up to 78 db(a), which significantly exceeds state-of-the-art devices. Keywords: capacitive comb microphone; system-level simulation; noise; signal-to-noise-ratio 1. Motivation and Description of Device Concept Conventional backplate-based silicon microphones have reached a mature state in the market, especially in mobile communication applications. Consisting of a moveable membrane, which detects incident acoustical waves by the capacitance change w.r.t. a stiff, perforated backplate [1], they suffer from high fluidic noise, which limits the signal-to-noise-ratio (SNR) achievable by this technology. In order to overcome this constraint, a novel microphone concept was recently introduced in [2]. Thereby radially aligned comb fingers are attached to the bottom side of a moveable membrane (see Figure 1). Figure 1. (a) Schematic view of the microphone introduced in [2]. Radially aligned combs attached to the membrane form the interdigitated comb-structure with respect to the stator; (b) Bottom view of the comb structure (SEM picture of a prototype); (c) Cross-sectional view of the comb-system. Proceedings 2017, 1, 458; doi:10.3390/proceedings1040346 www.mdpi.com/journal/proceedings

Proceedings 2017, 1, 346 2 of 5 In conjunction with a spidernet-like stator fixed to the substrate underneath, they form an interdigitated comb-system. This specific design as a backplate-free device is expected to exhibit lower losses and, thus, higher SNR compared to classical microphones. First system-level models of this design are presented in [2,3], describing the microphone as a system of two coupled one-dimensional harmonic oscillators. Membrane and stator are both considered moveable and couple via electrostatic and fluidic damping forces. However, up to now, only linearized operation around a fixed working point (e.g., fixed fluidic damping coefficient taken from FE-simulation) could be simulated. In this work, the model is extended to a generalized, physics-based description including the dependencies on the relevant design parameters for all involved coupling mechanisms, thus building the basis for predictive simulation and optimization with respect to the key figures noise and SNR. 2. Physics-Based Modeling of Electrostatic Force and Fluidic Damping The microphone model is intended for system-level simulation covering the interplay of the transducer, package and read-out electronics. Hence, the model complexity for each subsystem has to be reduced. For the comb read-out, periodic boundary conditions are applied and only the twodimensional cut as shown in Figures 2a and 3a is considered for deriving the electrostatic and fluidic subdomain models. Subsequently the 2D models are extruded to model the full 3D operation. 2.1. Capacitive Transducer Model The capacitive transducer model is built by summing up the electric capacitance between membrane and stator ( ) and the electric capacitance between the comb fingers ( ), both depending on the vertical displacement : (1) Here, is the permittivity, the lateral width of the stator comb, and the lateral distance between motor and stator combs. Fringing fields are taken into account introducing an effective overlap of the combs, where is extracted from finite element simulation (FE). The total active capacitance of the microphone is obtained by multiplying Equation (1) with the number of comb-systems (N), the radial length of combs (L) and a factor of 2 for symmetry reasons. Figure 2c shows that the resulting model exhibits an accuracy of above 95% for parameter variations within the relevant design space. Figure 2. (a) Electrostatic potential inside the comb structure as obtained by FE-simulation; (b) Effective comb overlap accounting for fringing-field effects (c) Capacitance of comb fingers vs. vertical deflection: comparison between compact model and data from electrostatic FE simulations.

Proceedings 2017, 1, 346 3 of 5 2.2. Fluidic Damping Model Fluidic FE simulations have been carried out in order to identify the most dominant contributions to the fluidic damping. The air flow in the symmetric basic cell of the comb structure is depicted in Figure 3a. It is dominated by the broader channel between two neighboring comb systems ( spacing path ), allowing to neglect the slide-film damping effects in the comb-path. The contributions to the damping can be modeled applying a fluidic network consisting of a Hagen- Poiseuille flow in the channel, a viscous orifice flow, and a transit region represented by. Analytical formulations for the network components can be derived from the Stokes equation and e.g., be found in [4]. Using a correction structurally similar to to take into account the residual flow through the comb-path, the fluidic damping model can be formulated as:, 3 12 3 (2) Here, is the viscosity of air and the mean distance of two neighboring comb cells. The correction factor is extracted from FE-Simulation. The resulting damping forces obtained by Equation (2) show an overall precision of 97% compared to FE-Simulations (see Figure 3c). Finally, the total damping force is obtained by extruding this model in radial direction and multiplying Equation (2) by the number of comb-systems and a factor of 2 for symmetry reasons. Figure 3. Derivation of the viscous damping model: (a) Fluid flow induced by moving membrane as obtained by FE simulations; (b) System-level model describing the fluidic damping in the comb system (c) Validation of damping model and discrimination of different contributions. 2.3. Verification of the System-Level Model In order to validate the above described models, they are implemented into a system-level model derived in [2], allowing for comparison of the membrane frequency response to data recorded by laser Doppler (LDV) vibrometry of first prototypes. The simulations reproduce the amplitude as well as the resonance frequencies and their peak widths (which is equivalent to the Q factor) for varying bias voltages with excellent agreement (Figure 4a). This proves the quality of the derived submodels as well as the quality of total system-level model including the couplings between the single energy domains. Comparison of measured and simulated amplitudes and Q factors for different design variants are listed in Table 1. The accuracy of over 94% for all design variants validates the 3D extrusion of the subdomain models and demonstrates the predictive power of the system model.

Proceedings 2017, 1, 346 4 of 5 Table 1. Simulated and measured Q-factors and displacements for different design variants (N: number of comb-systems, L: radial width of comb-fingers). Parameter Q-Factor (sim.) Q-Factor (meas.) Amplitude at 1 khz (sim.) Amplitude at 1 khz (meas.) N = 60, L = 150 μm 10.0 9.91 0.04 40.8 nm 39.5 0.3 nm N = 30, L = 150 μm 14.6 13.7 0.50 26.1 nm 26.3 4.5 nm N = 90, L = 200 μm 7.69 7.39 0.08 58.9 nm 61.0 0.2 nm (a) (b) Figure 4. (a) Frequency response of the microphone: comparison with LDV measurements for different bias voltages (b) Spectral noise density of a device with 50% overlap of the combs. 3. Noise and SNR The validated, physics-based system-level model can now be applied to optimize the device concept w.r.t. its total SNR. In order to get the highest dynamic range and a linear sensor response, an overlap of the combs of 50% is suggested, which has not been technologically realized yet. Figure 4b shows the simulated spectral noise density and discriminates the contributions of different parts of the device to the overall noise level, considering a fully packaged microphone as described in [2]. It revealed that the proposed variant yields very promising SNR values of up to 78 db(a), which is exceeding stateof-the art microphones. The simulated sensitivity of the microphone amounts to 45.2. Although the noise contribution of the ASIC is neglected here, the results indicate the potential and the promising perspective of the device for further investigations. 4. Conclusions We presented a physics-based and hence predictive system-level model describing the electrode coupling in comb-based capacitive MEMS-microphones designed for high SNR. All subdomain models are validated by FE-simulations and measurements. The system model is applied to investigate the potential of the device w.r.t. the obtainable SNR. Simulations of a design variant with 50% overlap of the comb fingers reveal a very promising SNR of 78 db(a) and provide the design space for the technological realization of optimized devices. Acknowledgments: This project has received funding from the Electronic Component Systems for European Leadership Joint Undertaking (Grant Agreement No. 692480). Conflicts of Interest: The authors declare no conflict of interest.

Proceedings 2017, 1, 346 5 of 5 References 1. Dehé, A.; Wurzer, M.; Füldner, M.; Krumbein, U. The Infineon Silicon MEMS Microphone. In Proceedings of the SENSOR 2013, Nürnberg, Germany, 14 16 May 2013; pp. 95 99. 2. Manz, J.; Bosetti, G.; Dehé, A.; Schrag, G. A Novel Silicon Star-Comb Microphone Concept for Enhanced Signal-to-noise Ratio: Modeling, Design and First Prototype. In Proceedings of the Transducers 2017, Kaohsiung, Taiwan, 18 22 June 2017. 3. Bosetti, G.; Manz, J.; Schrag, G.; Dehé, A. Modeling of an Out-of-plane Capacitive MEMS Transducer with Dynamically Coupled Electrodes. In Proceedings of the DTIP 2017, Bordeaux, France, 29 May 1 June 2017; pp. 29 33. 4. Niessner, M.; Schrag, G. Mixed-Level Approach for the Modeling of Distributed Effects in Microsystems, in System-Level Modeling of MEMS; Wiley-VCH: Weinheim, Germany, 2013; pp. 163 189. 2017 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).