PROLABS XENPAK-10GB-SR-C

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Transcription:

PROLABS XENPAK-10GB-SR-C 10GBASE-SR XENPAK 850nm Transceiver XENPAK-10GB-SR-C Overview PROLABS s XENPAK-10GB-SR-C 10 GBd XENPAK optical transceivers are designed for Storage, IP network and LAN, it is a hot pluggable module in the Z-direction that is mainly usable in typical router/switches line card applications. The XENPAK-10GB-SR-C is a fully integrated 10.3 Gb/s optical transceiver module that consists of a 850nm wavelength VCSEL optical transmitter and receiver, XAUI interface, Mux and Demux with clock and data recovery (CDR). In addition, they comply with the XENPAK Multi Sourcing Agreement (MSA). Product Features Up to 10 GBd bi-directional data links. Compliant with IEEE 802.3ae, 10GBASE-SR application. Compliant with XENPAK MSA. 850nm VCSEL laser. PIN Photo-detector. XAUI electrical interface: 4 lanes @ 3.125 GBd. MDIO, DOM (Digital Optics Monitoring) support. Hot Z-Pluggable. SC Connectors. Up to 300m on MMF Power Supply: 5V/3.3V/Adaptable Power Supply (APS: 1.2V) RoHS Compliance Operating temperature range: 0 to 70. Applications 10 GBd Ethernet Ordering Information Part Number XENPAK-10GB-SR-C Description 10GBASE-SR XENPAK Transceiver, SC Connectors, 850nm, MultiMode Fiber 300m

Absolute Maximum Ratings Storage Ambient Temperature T S 40 85 Supply Voltage (3.3V) V 3 0 4 V Supply Voltage (APS) V APS 0 1.5 V Optical Receiver Input P IMAX 1 dbm Average General Specifications Data Rate DR 10.3125 GBd Bit Error Rate BER 10-12 Total Power Consumption P 2.2 W Supply Voltage (+3.3V) V CC3 3.14 3.3 3.47 V Operating Environment Supply Voltage (APS) V CCAPS 1.152 1.2 1.248 V Operating Environment Supply Current (+3.3V) I CC3 300 ma Supply Current (APS) I CCAPS 1000 ma Case Operating Temperature T C 0 70 Link Distances 10.3 GBd Parameter Fiber Type Modal Bandwidth @ 850nm (MHz-km) Distance Range (m) 62.5/125um MMF 160 2-26 62.5/125um MMF 200 2-33 50/125um MMF 400 2-66 50/125um MMF 500 2-82 50/125um MMF 2000 2-300 Optical Characteristics - Transmitter Optical Wavelength 840 850 860 nm Launch Power P OUT 7 1 dbm Average Launch Power in OMA P OUT_OMA 4.3 2.8 dbm Launch Power of OFF Transmitter P OUT_OFF 30 dbm Average Side Mode Suppression Ratio SMSR 30 db Spectral Width (RMS) 0.45 nm Optical Extinction Ratio ER 3 db Optical Modulation amplitude OMA 525 uw Optical Return Loss Tolerance ORL T 12 db Relative Intensity Noise RIN 128 db/hz Transmitter Dispersion Penalty TDP 3.9 db Eye Mask Definition According to IEEE 802.3ae and 10GBASE-SR Optical Characteristics - Receiver Center Wavelength Range C 840 860 nm Optical Input Power P IN 12.5 0.5 dbm Average, Informative Receiver Sensitivity in OMA P IN_OMA 11.1 dbm Informative Stressed Receiver Sensitivity P IN_S 7.5 dbm Receiver Reflectance TR RX 12 db Receiver electrical 3dB upper cutoff frequency FR 12.3 GHz

Optical Characteristics Stressed Signal Calibration Vertical Eye Closure Penalty 2.2 db Stressed Eye Jitter 0.3 UI PP Electrical Characteristics - DC A. 1.2V COMS I/O DC Characteristics (PRTAD; LASI; RESET; TX_ON/OFF) External Pull-Up Resistor For Open Drain R PU 10 22 kω Output High Voltage V OH 1 V Output Low Voltage V OL 0.15 V Input High Voltage V IH 0.84 1.2 V Input Low Voltage V IL 0.36 V Input Pull-Down Current I PD 20 120 ua V IN=1.2V B. XAUI I/O DC Charateristics (TXLANE[0..3]; RXLANE[0..3]) Differential Input Amplitude (pk pk ) V IN_XAUI 200 1600 mv AC Coupled Differential Output Amplitude (pk pk ) V OUT_XAUI 800 1600 mv AC Coupled C. MDIO I/O DC Charateristics (MDIO; MDC) Output Low Voltage V OL 0.2 V I OL=100uA Output Low Current I OL 4 ma Input High Voltage V IH 0.84 1.2 V Input Low Voltage V IL 0.36 V Pull-Up Supply Voltage V PU 1.2 V Input Capacitance C IN 10 pf Load Capacitance C LOAD 470 pf External Pull-Up Resistance R PU 200 Ω

Electrical Characteristics - AC A. XAUI Input AC Characteristics (TXLANE[0..3]) Baud Rate BR XAUI_IN 3.125 GBd Baud Rate Tolerance BR TOL_XAUI 100 100 ppm Differential Input Impedance Z IN_XAUI 100 Ω Differential Return Loss RL IN 10 db 100 MHz to 2.5 GHz Input Differential Skew T IN_SKEW 75 ps Crossing Point Jitter Amplitude Tolerance J XAUI_TOL 0.65 UI PP IEEE 802.3ae B. XAUI Output AC Charateristics (RXLANE[0..3]) Baud Rate BR XAUI_OUT 3.125 GBd Baud Rate Variation BR XAUI_VAR 100 100 ppm XAUI Eye Mask (far-end) According to IEEE 802.3ae Output Differential Skew T OUT_SKEW 15 ps Output Differential Impedance Z OUT_XAUI 100 Ω DC Differential Output Return 100 MHz to 2.5 GHz RL Loss OUT 10 db Total Jitter TJ XAUI 0.35 UI Near-end No pre-equalization Deterministic Jitter DJ XAUI 0.17 UI 1 UI=320 ps C. Power-On Reset Charateristics Power-On Reset and According to XENPAK MSA Issue TX_ONOFF Charateristics D. MDIO I/O AC Charateristics (MDIO; MDC) MDIO Data Hold Time T HOLD 10 ns MDIO Data Setup Time T SU 10 ns Delay from MDC Rising Edge to MDIO Data Change T DELAY 300 ns MDC Clock Rate f MAX 2.5 MHz

Dimensions ALL DIMENSIONS ARE ±0.2mm UNLESS OTHERWISE SPECIFIED

Pin Assignment Pin 1 to Pin 35 PIN # Symbol I/O Logic Description Remarks 1 GND I Supply Electrical ground 2 GND I Supply Electrical ground 3 GND I Supply Electrical ground 4 RESERVED Reserved 5 3.3V I Supply Power 6 3.3V I Supply Power 7 APS I Supply Adaptive Power Supply 8 APS I Supply Adaptive Power Supply 9 LASI O Open Drain Link Alarm Status Interrupt. 10-22k ohm pull up on host 10 RESET I 1.2V CMOS TX OFF when MDIO RESET 11 VEND SPECIFIC Vendor Specific Pin. Leave unconnected 12 TX ON/OFF I 1.2V CMOS Transmitter ON/OFF 13 RESERVED Reserved 14 MOD DETECT O Pulled low inside module through 1k ohm 15 VEND SPECIFIC Vendor Specific Pin. Leave unconnected 16 VEND SPECIFIC Vendor Specific Pin. Leave unconnected 17 MDIO I/O Open Drain Management Data IO 18 MDC I 1.2V CMOS Management Data Clock 19 PRTAD4 I 1.2V CMOS Port Address bit 4 (Low=0) 20 PRTAD3 I 1.2V CMOS Port Address bit 3 (Low=0) 21 PRTAD2 I 1.2V CMOS Port Address bit 2 (Low=0) 22 PRTAD1 I 1.2V CMOS Port Address bit 1 (Low=0) 23 PRTAD0 I 1.2V CMOS Port Address bit 0 (Low=0) 24 VEND SPECIFIC Vendor Specific Pin. Leave unconnected 25 APS SET O Feedback output for APS 26 RESERVED Reserved for Avalanche Photodiode use 27 APS SENSE O Analog APS Sense Connection 28 APS I Supply Adaptive Power Supply 29 APS I Supply Adaptive Power Supply 30 3.3V I Supply Power 31 3.3V I Supply Power 32 RESERVED Reserved 33 GND I Supply Electrical Ground 34 GND I Supply Electrical Ground 35 GND I Supply Electrical Ground

Pin Assignment Pin 36 to Pin 70 PIN # Symbol I/O Logic Description Remarks 36 GND I Supply Electrical ground 37 GND I Supply Electrical ground 38 RESERVED Reserved 39 RESERVED Reserved 40 GND I Supply Electrical ground 41 RX LANE 0+ O AC Module XAUI Output Lane 0+ 42 RX LANE 0 O AC Module XAUI Output Lane 0 43 GND I Supply Electrical ground 44 RX LANE 1+ O AC Module XAUI Output Lane 1+ 45 RX LANE 1 O AC Module XAUI Output Lane 1 46 GND I Supply Electrical ground 47 RX LANE 2+ O AC Module XAUI Output Lane 2+ 48 RX LANE 2 O AC Module XAUI Output Lane 2 49 GND I Supply Electrical ground 50 RX LANE 3+ O AC Module XAUI Output Lane 3+ 51 RX LANE 3 O AC Module XAUI Output Lane 3 52 GND I Supply Electrical ground 53 GND I Supply Electrical ground 54 GND I Supply Electrical ground 55 TX LANE 0+ O AC Module XAUI Input Lane 0+ 56 TX LANE 0 O AC Module XAUI Input Lane 0 57 GND I Supply Electrical ground 58 TX LANE 1+ O AC Module XAUI Input Lane 1+ 59 TX LANE 1 O AC Module XAUI Input Lane 1 60 GND I Supply Electrical ground 61 TX LANE 2+ O AC Module XAUI Input Lane 2+ 62 TX LANE 2 O AC Module XAUI Input Lane 2 63 GND I Supply Electrical ground 64 TX LANE 3+ O AC Module XAUI Input Lane 3+ 65 TX LANE 3 O AC Module XAUI Input Lane 3 66 GND I Supply Electrical ground 67 RESERVED Reserved 68 RESERVED Reserved 69 GND I Supply Electrical Ground 70 GND I Supply Electrical Ground

Electrical Pad Layout Top of Transceiver PCB Bottom of Transceiver PCB As viewed through top References 1. IEEE standard 802.3. IEEE Standard Department, 2002., 10GBASE-SR 2. XENPAK Multi-Source Agreement (MSA).