Freescale Semiconductor Technical Data Heterojunction Bipolar Transistor Technology (InGaP HBT) Broadband High Linearity Amplifier The is a general purpose amplifier that is internally input and output matched. It is designed for a broad range of Class A, small-- signal, high linearity, general purpose applications. It is suitable for applications with frequencies from 4 to 36 MHz, such as cellular, PCS, BWA, WLL, PHS, CATV, VHF, UHF, UMTS and general small--signal RF. Features Frequency: 4--36 MHz P1dB: 18.5 dbm @ 9 MHz Small--Signal Gain: 2 db @ 9 MHz Third Order Output Intercept Point: 32 dbm @ 9 MHz Single Voltage Supply Internally Matched to 5 Ohms Cost--effective SOT--89 Surface Mount Plastic Package In Tape and Reel. T1 Suffix = 1, Units, 12 mm Tape Width, 7--inch Reel. Table 1. Typical Performance (1) Characteristic Small--Signal Gain (S21) Input Return Loss (S11) Output Return Loss (S22) Power Output @1dB Compression Third Order Output Intercept Point Symbol 9 MHz 214 MHz 35 MHz Unit G p 2 18 16 db IRL -- 25 -- 25 -- 19 db ORL -- 22 -- 18 -- 17 db P1dB 18.5 18 15.5 dbm OIP3 32 31 28.5 dbm 1.,T A =25 C, 5 ohm system. Table 3. Thermal Characteristics Thermal Resistance, Junction to Case Case Temperature 123 C, 5.6 Vdc, 58 ma, no RF applied Table 2. Maximum Ratings Document Number: Rev. 9, 1/214 4-36 MHz, 2 db 18.5 dbm InGaP HBT GPA 1 2 3 SOT -89 Rating Symbol Value Unit Supply Voltage V CC 7 V Supply Current I CC 3 ma RF Input Power P in 1 dbm Storage Temperature Range T stg --65 to +15 C Junction Temperature T J 15 C Characteristic Symbol Value (2) Unit R JC 92. C/W 2. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf. Select Documentation/Application Notes -- AN1955., 24--28, 212, 214. All rights reserved. 1
Table 4. Electrical Characteristics (V CC = 5.6 Vdc, 9 MHz, T A =25 C, 5 ohm system, in Freescale Application Circuit) Characteristic Symbol Min Typ Max Unit Small--Signal Gain (S21) G p 18 2 db Input Return Loss (S11) IRL -- 25 db Output Return Loss (S22) ORL -- 22 db Power Output @ 1dB Compression P1dB 18.5 dbm Third Order Output Intercept Point OIP3 32 dbm Noise Figure NF 4.1 db Supply Current I CC 4 58 75 ma Supply Voltage V CC 5.6 V Table 5. Functional Pin Description Pin Number 1 RF in 2 Ground Pin Function 3 RF out /DC Supply Table 6. ESD Protection Characteristics Test Conditions/Test Methodology Human Body Model (per JESD 22--A114) Machine Model (per EIA/JESD 22--A115) Charge Device Model (per JESD 22--C11) Table 7. Moisture Sensitivity Level Class Test Methodology Rating Package Peak Temperature Unit Per JESD 22--A113, IPC/JEDEC J--STD--2 1 26 C 1 2 Figure 1. Functional Diagram 2 A IV 3 2
5 OHM TYPICAL CHARACTERISTICS 25 I CC, COLLECTOR CURRENT (ma) G p, SMALL--SIGNAL GAIN (db) G p, SMALL--SIGNAL GAIN (db) 2 15 1 23 21 19 17 15 13 T C =85 C -- 4 C 25 C f, FREQUENCY (GHz) 1 2 3 4 Figure 2. Small -Signal Gain (S21) versus Frequency 11 9 1 12 14 16 18 P out, OUTPUT POWER (dbm) Figure 4. Small -Signal Gain versus Output Power 1 8 6 4 2 4.9 9 MHz 196 MHz 35 MHz 214 MHz 26 MHz 2 S11, S22 (db) P1dB, 1 db COMPRESSION POINT (dbm) --1 --2 --3 --4 21 2 19 18 17 16 15 14.5 S22 S11 1 2 3 f, FREQUENCY (GHz) Figure 3. Input/Output Return Loss versus Frequency 1 1.5 2 f, FREQUENCY (GHz) 2.5 Figure 5. P1dB versus Frequency 21 1 khz Tone Spacing 18 5 5.1 5.2 5.3 5.4 5.5 5.6 5.7 1 2 3 4 V CC, COLLECTOR VOLTAGE (V) f, FREQUENCY (GHz) Figure 6. Collector Current versus Collector Voltage OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dbm) 33 3 27 24 Figure 7. Third Order Output Intercept Point versus Frequency 3 4 3.5 3
5 OHM TYPICAL CHARACTERISTICS OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dbm) IMD, THIRD ORDER INTERMODULATION DISTORTION (dbc) NF, NOISE FIGURE (db) 36 33 3 27 24 f = 9 MHz 1 khz Tone Spacing 21 5.5 5.55 5.6 5.65 5.7 V CC, COLLECTOR VOLTAGE (V) Figure 8. Third Order Output Intercept Point versus Collector Voltage 8 6 4 2 --3 --4 --5 --6 OIP3, THIRD ORDER OUTPUT INTERCEPT POINT (dbm) MTTF (YEARS) 36 35 34 33 32 31 3 --4 --2 2 4 6 8 T, TEMPERATURE (_C) Figure 9. Third Order Output Intercept Point versus Case Temperature --7 f = 9 MHz 1 khz Tone Spacing --8 1 3 3 6 9 12 15 18 12 125 13 135 14 145 15 P out, OUTPUT POWER (dbm) T J, JUNCTION TEMPERATURE ( C) Figure 1. Third Order Intermodulation Distortion versus Output Power NOTE: The MTTF is calculated with,i CC =58mA Figure 11. MTTF versus Junction Temperature ACPR, ADJACENT CHANNEL POWER RATIO (dbc) --6 --7.5 1 1.5 2 2.5 3 3.5 4 2 4 6 8 1 12 14 f, FREQUENCY (GHz) P out, OUTPUT POWER (dbm) Figure 12. Noise Figure versus Frequency Figure 13. Single -Carrier W -CDMA Adjacent Channel Power Ratio versus Output Power 1 5 1 4 --2 --3 --4 --5 f = 9 MHz 1 khz Tone Spacing 8 Vdc Supply with 43 Ω Dropping Resistor V CC = 5.6 Vdc, f = 214 MHz Single--Carrier W--CDMA, 3.84 MHz Channel Bandwidth Input Signal PAR = 8.5 db @.1% Probability(CCDF) 1 4
5 OHM APPLICATION CIRCUIT: 4-8 MHz V SUPPLY S21, S11, S22 (db) 3 2 1 --1 --2 --3 --4 RF INPUT Z1 C1 Z2 Z1, Z5.347 x.58 Microstrip Z2.575 x.58 Microstrip Z3.172 x.58 Microstrip S21 S11 S22 DUT Figure 15. S21, S11 and S22 versus Frequency V CC 2 4 6 8 f, FREQUENCY (MHz) Z3 Figure 14. 5 Ohm Test Circuit Schematic Table 8. 5 Ohm Test Circuit Component Designations and Values R1 L1 Z4 C1 C3 C2 C4 Z5 RF OUTPUT Z4.43 x.58 Microstrip PCB Getek Grade ML2C,.31, r =4.1 Figure 16. 5 Ohm Test Circuit Component Layout C5 R1 MMG3XX Rev 2 Part Description Part Number Manufacturer C1, C2, C3.1 F Chip Capacitors C63C13J5RAC Kemet C4 1 pf Chip Capacitor C63C12J5RAC Kemet C5 47 pf Chip Capacitor C85C47J5RAC Kemet L1 47 nh Chip Inductor BK2125HM471--T Taiyo Yuden R1 8.2 Ω Chip Resistor RK73B2ATTE8R2J KOA Speer Table 9. Supply Voltage versus R1 Values Supply Voltage 6 7 8 9 1 11 12 V R1 Value 6.9 24 41 59 76 93 11 Note: To provide V CC = 5.6 Vdc and I CC = 58 ma at the device. L1 C5 C4 C3 C2 5
5 OHM APPLICATION CIRCUIT: 8-36 MHz V SUPPLY S21, S11, S22 (db) 2 1 --1 --2 RF INPUT S22 Z1 S21 S11 --3 8 13 18 23 28 33 38 f, FREQUENCY (MHz) Figure 18. S21, S11 and S22 versus Frequency C1 Z2 Z1, Z5.347 x.58 Microstrip Z2.575 x.58 Microstrip Z3.172 x.58 Microstrip Figure 17. 5 Ohm Test Circuit Schematic Table 1. 5 Ohm Test Circuit Component Designations and Values DUT V CC Z3 R1 L1 Z4 C3 C1 C2 C4 Z5 RF OUTPUT Z4.43 x.58 Microstrip PCB Getek Grade ML2C,.31, r =4.1 C5 R1 MMG3XX Rev 2 L1 C5 C4 C3 Figure 19. 5 Ohm Test Circuit Component Layout Part Description Part Number Manufacturer C1, C2 39 pf Chip Capacitors C85C39J5RAC Kemet C3.1 F Chip Capacitor C63C13J5RAC Kemet C4 1 pf Chip Capacitor C63C12J5RAC Kemet C5 47 pf Chip Capacitor C85C47J5RAC Kemet L1 56 nh Chip Inductor HK16856NJ--T Taiyo Yuden R1 8.2 Ω Chip Resistor RK73B2ATTE8R2J KOA Speer C2 6
5 OHM TYPICAL CHARACTERISTICS Table 11. Common Emitter S -Parameters (,T A =25 C, 5 Ohm System) f S 11 S 21 S 12 S 22 MHz S 11 S 21 S 12 S 22 1.1837.158 1.8154 176.164.6918.196.4789 11.134 15.937 --92.445 1.61985 173.58.6785 --.796.571 --49.334 2.2263 96.518 11.6276 17.83.795 --2.253.7322 --17.196 25.249 11.715 1.97614 167.952.746 --2.513.6689 --28.31 3.215 91.299 1.93416 165.552.752 --2.899.7111 --35.935 35.1939 77.961 1.89886 163.145.744 --3.499.7696 --41.16 4.212 71.36 1.85777 16.93.755 --3.885.893 --47.831 45.2169 63.516 1.81348 158.599.753 --4.455.869 --52.772 5.2447 55.112 1.76682 156.269.756 --4.766.984 --57.16 55.2643 49.889 1.71841 154.26.758 --5.297.9479 --6.897 6.2857 47.33 1.67367 151.767.757 --5.783.9752 --65.139 65.394 43.937 1.61782 149.477.766 --6.195.116 --69.112 7.3356 42.55 1.56473 147.215.764 --6.72.1489 --72.747 75.3495 4.1 1.5489 144.98.773 --7.82.1746 --76.469 8.3599 38.298 1.44613 142.748.784 --7.625.1146 --8.336 85.3675 36.713 1.38955 14.536.789 --8.18.11345 --84.39 9.378 34.449 1.32195 138.333.716 --8.539.11524 --88.629 95.414 35.697 1.26867 136.75.711 --8.95.11712 --93.45 1.3975 34.93 1.19351 133.939.7128 --9.497.11971 --97.41 15.411 35.48 1.13374 131.742.7142 --1.15.1257 --11.389 11.413 34.972 1.5555 129.66.7148 --1.588.12293 --16.494 115.478 36.31 9.98381 127.42.7156 --1.989.12475 --111.339 12.445 38.732 9.9685 125.299.7171 -- 11.51.1272 --115.996 125.45 39.914 9.83535 123.178.7179 --12.25.12882 --12.553 13.3952 43.11 9.7634 121.77.7197 --12.554.1322 --125.245 135.3786 44.538 9.68157 118.951.728 --13.57.1352 --129.596 14.3796 46.354 9.6628 116.874.7224 --13.66.13836 --133.849 145.3675 48.792 9.52474 114.777.7243 --14.151.14227 --138.332 15.3229 27.259 9.45514 112.739.7269 --14.685.13499 --14.27 155.339 25.231 9.36984 11.697.728 --15.24.1388 --143.23 16.3475 23.271 9.29518 18.724.7296 --15.823.14111 --146.41 165.367 22.494 9.2159 16.764.7327 --16.372.14376 --149.267 17.383 21.485 9.15729 14.763.7341 --16.955.14728 --152.56 175.3976 21.793 9.752 12.811.7361 --17.538.14882 --155.31 18.435 21.332 9.137 1.821.7373 --18.47.1531 --157.889 185.493 21.941 8.92666 98.873.7383 --18.59.15553 --16.786 19.49 2.661 8.84934 96.931.747 --19.216.1587 --163.24 195.4127 17.824 8.75854 95.8.7433 --19.75.1617 --165.666 2.455 2.129 8.69148 93.46.7451 --2.324.1659 --168.355 25.4148 18.841 8.6161 91.185.7482 --2.966.16929 --17.838 21.4198 18.596 8.5446 89.293.7498 --21.435.17351 --173.6 215.4249 18.599 8.4755 87.398.7512 --22.217.17715 --176.54 22.439 19.388 8.39794 85.51.7543 --22.79.1832 --178.865 225.4316 19.789 8.32788 83.624.756 --23.41.18422 178.51 (continued) 7
5 OHM TYPICAL CHARACTERISTICS Table 11. Common Emitter S -Parameters (,T A =25 C, 5 Ohm System) (continued) f S 11 S 21 S 12 S 22 MHz S 11 S 21 S 12 S 22 23.4326 21.542 8.24837 81.777.7591 --24.34.1871 175.83 235.4285 23.93 8.17883 79.926.761 --24.632.1981 173.166 24.428 25.661 8.142 78.94.7638 --25.226.19358 17.371 245.4222 28.349 8.349 76.296.7665 --25.841.19769 167.872 25.4157 3.594 7.96381 74.438.7693 --26.474.279 164.997 255.462 32.718 7.89112 72.648.7715 --27.199.2422 162.24 26.4117 35.498 7.8353 7.815.7744 --27.94.2869 159.371 265.47 39.668 7.76263 69.11.7768 --28.528.21293 156.39 27.499 4.736 7.68838 67.13.786 --29.281.21614 153.567 275.4248 44.129 7.6288 65.378.7826 --29.943.22114 15.373 28.4329 47.59 7.55264 63.561.785 --3.741.226 147.517 285.4466 51.43 7.48275 61.767.7867 --31.392.2348 144.417 29.4661 53.41 7.41535 6.19.7893 --32.182.23581 141.675 295.4876 57.415 7.34593 58.235.7915 --32.93.2416 138.661 3.4991 59.71 7.28251 56.493.7945 --33.641.24698 136.2 35.528 61.593 7.21536 54.73.7976 --34.4.25213 133.272 31.5426 64.12 7.152 52.913.7989 --35.181.25854 13.712 315.5536 65.235 7.8162 51.15.817 --35.962.26426 128.119 32.5758 65.884 7.1653 49.45.827 --36.771.2778 125.669 325.621 66.564 6.94732 47.655.854 --37.539.27729 123.284 33.6243 66.72 6.88222 45.916.871 --38.36.28468 12.844 335.6498 65.787 6.8188 44.235.897 --39.51.295 118.633 34.6832 65.869 6.75612 42.521.8112 --39.867.29718 116.391 345.749 65.731 6.69433 4.89.8128 --4.621.326 114.187 35.7294 65.97 6.63494 39.85.8144 --41.453.3819 112.291 355.7565 65.299 6.57111 37.382.8171 --42.369.31389 11.431 36.7682 64.978 6.5118 35.77.8186 --43.91.31878 18.662 8
1.7 1.27.86.64 3.86 3.48.58 Recommended Solder Stencil 5.33 1.27 7.62 NOTES: 1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE USED IN PCB LAYOUT DESIGN. 2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN. 3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL AND RF PERFORMANCE. 4. RECOMMENDED VIA PATTERN SHOWN HAS.381 x.762 MM PITCH. Figure 2. Recommended Mounting Configuration 1N ( ) YYWW Figure 21. Product Marking.35 diameter 2.49 2.54 9
PACKAGE DIMENSIONS 1
11
12
PRODUCT DOCUMENTATION AND SOFTWARE Refer to the following resources to aid your design process. Application Notes AN1955: Thermal Measurement Methodology of RF Power Amplifiers AN31: General Purpose Amplifier and MMIC Biasing Software.s2p File For Software, do a Part Number search at http://www.freescale.com, and select the Part Number link. Go to Software & Tools on the part s Product Summary page to download the respective tool. FAILURE ANALYSIS At this time, because of the physical characteristics of the part, failure analysis is limited to electrical signature analysis. In cases where Freescale is contractually obligated to perform failure analysis (FA) services, full FA may be performed by third party vendors with moderate success. For updates contact your local Freescale Sales Office. The following table summarizes revisions to this document. REVISION HISTORY Revision Date Description 5 Mar. 27 Corrected and updated Part Numbers in Tables 8 and 1, Component Designations and Values, to RoHS compliant part numbers, pp. 6, 7 6 July 27 Replaced Case Outline 1514--1 with 1514--2, Issue D, pp. 1, 11--13. Case updated to add missing dimension for Pin 1 and Pin 3. 7 Mar. 28 Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings, p. 1 Corrected Fig. 13, Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power y--axis (ACPR) unit of measure to dbc, p. 5 Corrected S--Parameter table frequency column label to read MHz versus GHz and corrected frequency values from GHz to MHz, pp. 8, 9 8 Feb. 212 Corrected temperature at which ThetaJC is measured from 25 C to 123 C and added no RF applied to Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no RF signal applied, p. 1 Table 6, ESD Protection Characteristics, removed the word Minimum after the ESD class rating. ESD ratings are characterized during new product development but are not 1% tested during production. ESD ratings provided in the data sheet are intended to be used as a guideline when handling ESD sensitive devices, p. 3 Removed I CC bias callout from applicable graphs and Table 11, Common Emitter S--Parameters heading as bias is not a controlled value, pp. 4--9 Added.s2p File availability to Product Software, p. 14 9 Oct. 214 Added Fig. 21, Product Marking, p. 9 Added Failure Analysis information, p. 13 13
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