CPC1976Y. AC Power Switch INTEGRATED CIRCUITS DIVISION. Description. Features. Approvals. Ordering Information. Applications.

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Transcription:

AC Power Switch Parameter Rating Units AC Operating Voltage 2-24 V rms Load Current 2 A rms On-State Voltage Drop. V rms (at I L = 2A rms ) Blocking Voltage 6 V P Features Load Current up to 2A rms 6V P Blocking Voltage ma Sensitivity Zero-Crossing Detection DC Control, AC Output Optically Isolated TTL and CMOS Compatible Low EMI and RFI Generation High Noise Immunity Machine Insertable, Wave Solderable Applications Programmable Control Process Control Power Control Panels Remote Switching Gas Pump Electronics Contactors Large Relays Solenoids Motors Heaters Description is an AC Solid State Switch utilizing dual power SCR thyristor outputs. This device also includes zero-cross turn-on circuitry and is specified with a blocking voltage of 6V P. In addition, tightly controlled zero-cross circuitry ensures low noise switching of AC loads by minimizing the generation of transients. The optically coupled input and output circuits provide 37V rms of isolation and noise immunity between the control and load circuits. As a result, the is well suited for industrial environments where electromagnetic interference would disrupt the operation of plant facility communication and control systems. Approvals UL Recognized Component: File E69938 CSA Certified Component: File 43639 Ordering Information Part # Y Pin Configuration Description 4-Pin (8-Pin Body) SIP (2/Tube) ZC 2 3 4 LED + LED AC Load AC Load Zero-Cross Waveforms Control AC Line Load Current Voltage Across Relay DS--R www.ixysic.com

Absolute Maximum Ratings @ 2ºC Parameter Ratings Units Blocking Voltage (V DRM ) 6 V P Reverse Input Voltage V Input Control Current ma Peak (ms) A Input Power Dissipation mw Total Power Dissipation 2 24 mw Isolation Voltage, Input to Output 37 V rms ESD, Human Body Model 4 kv i 2 t for Fusing (/2 Sine Wave, Hz) 8 A 2 s Operational Temperature -4 to +8 C Storage Temperature -4 to +2 C Derate linearly.33 mw / ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. 2 Derate linearly 2 mw / ºC Electrical Characteristics @ 2ºC Parameters Conditions Symbol Min Typ Max Units Output Characteristics Load Current, Continuous V L =2-24V rms I L.7-2 A rms Maximum Surge Current t < 6ms I PK - - 2 A Off State Leakage Current V DRM I LEAK - - A On-State Voltage Drop I L =2A P - -..2 V P Critical Rate of Rise - dv/dt 2 - V/ s Switching Speeds Turn-on I F = ma t on - -. cycles Turn-off t off - -. cycles Zero-Cross Turn-On Voltage st half-cycle - - 7 2 V Subsequent half-cycle - - - V Holding Current - I H - - 7 ma Latching Current - I L - - ma Operating Frequency - 2 - Hz Load Power Factor for Guaranteed Turn-On 2 6Hz PF.2 - - - Input Characteristics Input Control Current to Activate 3 6Hz I F - - ma Input Drop-out Voltage - -.8 - - V Input Voltage Drop I F =ma V F.9.2.4 V Reverse Input Current V R =V I R - - A Common Characteristics Input to Output Capacitance - C I/O - - 3 pf Zero Cross st half-cycle @ <Hz. 2 Snubber circuits may be required at low power factors. 3 For high-noise environments, or for high-frequency operation, use I F > ma. R 2 www.ixysic.com

PERFORMANCE DATA @ 2ºC (Unless Otherwise Noted)* 3 LED Forward Voltage Distribution (N=, I F =ma) 3 LED Current to Operate Distribution (N=, V L =2V AC /6Hz) 2 Zero-Cross Voltage Distribution 3 2 2 2 2.2.26.27.28.29.3 LED Forward Voltage (V)..7.9 2. 2. 2.7 6.2 6.4 6.6 6.8 7. 7.2 7.4 Zero-Cross Voltage (V) 2 On-State Voltage Drop Distribution (N=, I F =ma, I L =2A P ) 2 Blocking Voltage Distribution (N=) 2.4.6.8..2.4 On-State Voltage Drop (V) 874 876 878 88 882 884 886 Blocking Voltage (V P ) LED Forward Voltage (V).6..4.3.2 LED Forward Voltage vs. Temperature I F =ma I F =2mA I F =ma I F =ma. -4-2 2 4 6 8 LED Current to Operate (ma) LED Current to Operate vs. Temperature (Resistive Load) (I L =A, f=6hz) 2. 2. 2..9.8-4 -2 2 4 6 8 Zero-Cross Voltage (V) Zero-Cross Voltage vs. Temperature =ma, R L =2 ) 9 8 7 6 4 3 2-4 -2 2 4 6 8 3. 2.9 2.8 2.7 2. LED Current to Operate (Resistive) vs. Load Frequency (V P =3V, R L =, I L =2A rms ) 2. 2 2 3 3 4 Load Frequency (Hz) 3. 2.9 2.8 2.7 2. LED Current to Operate (Inductive) vs. Load Frequency (V L =2V, Z L =4mH, 22 ) 2. 2 2 3 3 4 Load Frequency (Hz) 3. 2.9 2.8 2.7 2. LED Current to Operate (Inductive) vs. Load Frequency (V L =2V, Z L =96mH, ) 2. 2 2 3 3 4 Load Frequency (Hz) * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R www.ixysic.com 3

PERFORMANCE DATA @ 2ºC (Unless Otherwise Noted)* Holding Current (ma) Holding Current vs. Temperature (R L =.9 ) 9 8 7 6 4 3 2-4 -2 2 4 6 8 Load Voltage (V).2.. Load Voltage vs. Temperature =ma).9 I L =2.A.8 I L =2A I L =A I L =.A.7-4 -2 2 4 6 8 Load Current (A) 3 2 - -2 Load Current vs. Load Voltage =ma) T A =+8ºC T A =+2ºC T A = -4ºC -3-2. -. -. -..... 2. Load Voltage (V) 2. Maximum Load Current vs. Temperature =ma) Blocking Voltage vs. Temperature Leakage Current vs. Temperature Load Current (A rms ) 2.... Blocking Voltage (V P ) 9 9 8 Leakage Current ( A) V L =6V V L =4V V L =2V. -4-2 2 4 6 8 8-4 -2 2 4 6 8. -4-2 2 4 6 8 Maximum Non-Repetitive Surge Current (Values Apply to T J =ºC Before Surge) 2 Load Current (A P ) 2. Time (ms) * The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R 4 www.ixysic.com

Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-2, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-33. Device Moisture Sensitivity Level (MSL) Rating Y MSL ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-62. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-2 must be observed. Device Y Maximum Temperature x Time 24ºC for 3 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. R www.ixysic.com

Y Pin 2.82±.38 (.83±.).778 (.7) MECHANICAL DIMENSIONS.6±.27 (.4±.).762±.76.6±.27 (.3±.3) (.4±.).6±.2 (.6±.4) ±.27.8±.27 (.±.) (.2±.).6±.27 (.4±.) 3.32±. (.3±.2) 7º TYP 4 Places 4.72±.27 (.8±.).38±.3 (.±.).778 (.7).7 (.69) Pin PCB Hole Pattern. DIA. x4 (.4 DIA. x4).8 (.2).6 (.4) (.) 7º TYP 4 Places Dimensions mm (inches) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS--R Copyright 23, IXYS Integrated Circuits Division All rights reserved. Printed in USA. /2/23