MHz. The package options are ceramic/metal flange and pill package. Package Type: , PN: CGHV14250F, CGHV14250P

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MHz. The package options are ceramic/metal flange and pill package. Package Type: , PN: CGHV14250F, CGHV14250P

PRELIMINARY. Cree s CGHV59070 is an internally matched gallium nitride (GaN) high electron mobility transistor

= 25 C), 50 V. Parameter 800 MHz 850 MHz 900 MHz 950 MHz 1000 MHz Units. Small Signal Gain db

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= 25 C), 50 V. Parameter 500 MHz 1.0 GHz 1.5 GHz 2.0 GHz 2.5 GHz Units. Small Signal Gain db

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CGH55015F2 / CGH55015P2

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GTVA123501FA. Thermally-Enhanced High Power RF GaN on SiC HEMT 350 W, 50 V, MHz. Description. Features. RF Characteristics

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Transcription:

CGHV1425 25 W, 12-14 MHz, GaN HEMT for L-Band Radar Systems Cree s CGHV1425 is a gallium nitride (GaN) high electron mobility transistor (HEMT) designed specifically with high efficiency, high gain and wide bandwidth capabilities, which makes the CGHV1425 ideal for 1.2-1.4 GHz L-Band radar amplifier applications. The transistor could be utilized for band specific applications ranging from 9 through 18 MHz. The package options are ceramic/metal flange and pill package. Package Type: 44162, 44161 PN: CGHV1425F, CGHV1425P Typical Performance Over 1.2-1.4 GHz (T C = 25 C) of Demonstration Amplifier Parameter 1.2 GHz 1.25 GHz 1.3 GHz 1.35 GHz 1.4 GHz Units Output Power 365 365 35 31 33 W 18.6 18.6 18.4 17.9 18.2 db 8 8 77 74 76 % Note: Measured in the CGHV1425-AMP amplifier circuit, under 5 μs pulse width, 1% duty cycle, P IN = 37 dbm. Features Rev 1.1 December 215 Reference design amplifier 1.2-1.4 GHz Operation FET Tuning range UHF through 18 MHz 33 W Typical Output Power 18 db Power 77% Typical <.3 db Pulsed Amplitude Droop Internally pre-matched on input, unmatched output Subject to change without notice. 1

Absolute Maximum Ratings (not simultaneous) Parameter Symbol Rating Units Conditions Drain-Source Voltage V DSS 125 Volts 25 C Gate-to-Source Voltage V GS -1, +2 Volts 25 C Storage Temperature T STG -65, +15 C Operating Junction Temperature T J 225 C Maximum Forward Gate Current I GMAX 42 ma 25 C Maximum Drain Current 1 I DMAX 18 A 25 C Soldering Temperature 2 T S 245 C Screw Torque τ 4 in-oz CW Thermal Resistance, Junction to Case 3 R θjc.95 C/W P DISS = 167 W, 65 C Pulsed Thermal Resistance, Junction to Case 3 R θjc.57 C/W P DISS = 167 W, 5 µsec, 1%, 85 C Pulsed Thermal Resistance, Junction to Case 4 R θjc.63 C/W P DISS = 167 W, 5 µsec, 1%, 85 C Case Operating Temperature 5 T C -4, +13 C P DISS = 167 W, 5 µsec, 1% Note: 1 Current limit for long term, reliable operation 2 Refer to the Application Note on soldering at http:///document-library 3 Measured for the CGHV1425P 4 Measured for the CGHV1425F 5 See also, the Power Dissipation De-rating Curve on Page 5 Electrical Characteristics Characteristics Symbol Min. Typ. Max. Units Conditions DC Characteristics 1 (T C = 25 C) Gate Threshold Voltage V GS(th) -3.8-3. -2.3 V DC V DS = 1 V, I D = 41.8 ma Gate Quiescent Voltage V GS(Q) -2.7 V DC V DS = 5 V, I D = 5 ma Saturated Drain Current 2 I DS 31.4 37.6 A V DS = 6. V, V GS = 2. V Drain-Source Breakdown Voltage V BR 15 V DC V GS = -8 V, I D = 41.8 ma RF Characteristics 3 (T C = 25 C, F = 1.3 GHz unless otherwise noted) Output Power P OUT 275 33 W V DD = 5 ma, P IN = 37 dbm D E 63 77 % V DD = 5 ma, P IN = 37 dbm Power G P 18.2 db V DD = 5 ma, P IN = 37 dbm Pulsed Amplitude Droop D -.3 db V DD = 5 ma Output Mismatch Stress VSWR 5 : 1 Y Dynamic Characteristics No damage at all phase angles, V DD = 5 ma, P IN = 37 dbm Pulsed Input Capacitance C GS 15 pf V DS = 5 V, V gs = -8 V, f = 1 MHz Output Capacitance C DS 16 pf V DS = 5 V, V gs = -8 V, f = 1 MHz Feedback Capacitance C GD 1.35 pf V DS = 5 V, V gs = -8 V, f = 1 MHz Notes: 1 Measured on wafer prior to packaging. 2 Scaled from PCM data. 3 Measured in CGHV1425-AMP. Pulse Width = 5 μs, Duty Cycle = 1%. Copyright 214-215 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of 2 CGHV1425 Rev 1.1

Typical Performance Figure 1. - CGHV1425 Typical Sparameters Tcase = 25 C V DD = 5 ma 3 2 1 Mag gnitude (db) -1-2 -3 S(2,1) S(1,1) S(2,2) -4 1 1.1 1.2 1.3 1.4 1.5 1.6 45 Frequency (GHz) Figure 2. - CGHV1425 Typical RF Results V DD = 5 ma, P IN = 37 dbm Tcase = 25 C, Pulse Width = 5 µs, Duty Cycle = 1 % 9 4 8 Outpu Power (W) 35 3 25 Output Power 2 15 1 Output Power Output Power 7 6 5 4 3 2 rain Efficiency (%) (db) & Dr 5 1 1.1 1.15 1.2 1.25 1.3 1.35 1.4 1.45 1.5 Frequency (GHz) Copyright 214-215 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of 3 CGHV1425 Rev 1.1

Typical Performance 4 35 Figure 3. - CGHV1425 Typical RF Results V DD = 5 ma, P IN = 37 dbm Tcase = 85 C, Pulse Width = 5 µs, Duty Cycle = 1 % 8 7 Outp put Power (W) 3 25 2 15 1 Output Power Output Power 6 5 4 3 2 (db) & (%) 5 1 1.1 1.15 1.2 1.25 1.3 1.35 1.4 1.45 1.5 Frequency (GHz) Figure 4. - CGHV1425 CW RF Results V DD = 5 ma, P IN = 37 dbm, Tcase = 65 C 35 3 7 6 Outpu Power (W) 25 5 Output Power 2 4 15 3 1 2 5 Pout 1 Drain Eff 1.1 1.15 1.2 1.25 1.3 1.35 1.4 1.45 1.5 Frequency (GHz) (db) and (%) Copyright 214-215 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of 4 CGHV1425 Rev 1.1

Source and Load Impedances D Z Source Z Load G S Frequency (MHz) Z Source Z Load 9.6 - j.3 5.3 + j.1 1.7 - j.8 4.3 +j.8 11 1.3 - j1.1 3.3 + j.8 12 1.8 - j1.1 3. + j.4 13 2.5 - j.7 2.5 + j.4 14 3.4 - j.7 2.3 + j.1 15 1.8 - j.9 2.3 + j Note 1. V DD = 5 ma in the 44162 package Note 2. Optimized for power gain, P SAT and Note 3. When using this device at low frequency, series resistors should be used to maintain amplifier stability CGHV1425F Power Dissipation De-rating Curve Figure 4. - CGHV1425 Transient Power Dissipation De-Rating Curve 18 16 Pill - 5 µs 1% 14 Power Dissipation (W) 12 1 8 6 Flange - CW Note 1 4 Flange - 5 us 1 % Pill - 5 us 1 % 2 Flange - 1 ms - 2 % Pill - 1 ms - 2 % 25 5 75 1 125 15 175 2 225 25 Maximum Case Temperature ( C) Note 1. Area exceeds Maximum Case Temperature (See Page 2). Copyright 214-215 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of 5 CGHV1425 Rev 1.1

CGHV1425-AMP Demonstration Amplifier Circuit Bill of Materials Designator Description Qty R1 RES, 1/16W, 63, 1%, 562 OHMS 1 R2 RES, 5.1 OHM, +/-1%, 1/16W, 63 1 R3 RES, 1/16W, 63, 1%, 47 OHMS 1 L1 INDUCTOR, CHIP, 6.8 nh, 63 SMT 1 C1, C23 CAP, 27pF, +/- 5%, 25V, 85, ATC 6F 2 C2 CAP, 2.pF, +/-.1pF, 63, ATC 1 C3, C4 CAP,.5pF, +/-.5pF, 85, ATC 6F 2 C5,C6 CAP, 1.pF, +/-.5 pf, 85, ATC 6F 2 C7,C8,C9,C1 CAP, 3.pF, +/-.1pF, 25V, 85, ATC 6F 4 C11,C24 CAP, 47pF,+/-5%, 25V, 85, ATC 6F 2 C12,C25 CAP, 1pF, +/-5%, 25V, 85, ATC 6F 2 C13,C26 CAP, 33PF, 85,1V, X7R 2 C14 CAP 1uF 16V TANTALUM 1 C15,C16,C17,C18 CAP, 3.9pF, +/-.1pF, 25V, 85, ATC 6F 4 C19,C2 CAP, 1.2pF, +/-.5pF, 85, ATC 6F 2 C27 CAP, 1.UF, 1V, 1%, X7R, 121 1 C28 CAP, 33 UF, +/-2%, 1V, ELECTROLYTIC 1 J1,J2 CONN, SMA, PANEL MOUNT JACK, FL 2 J3 HEADER RT>PLZ.1CEN LK 9POS 1 J4 CONNECTOR ; SMB, Straight, JACK,SMD 1 W1 CABLE,18 AWG, 4.2 1 PCB, RO435,.2 MIL THK, CGHV1425, 1.2-1.4GHZ 1 Q1 CGHV1425 1 CGHV1425-AMP Demonstration Amplifier Circuit Copyright 214-215 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of 6 CGHV1425 Rev 1.1

CGHV1425-AMP Demonstration Amplifier Circuit Outline CGHV1425-AMP Demonstration Amplifier Circuit Schematic Copyright 214-215 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of 7 CGHV1425 Rev 1.1

Product Dimensions CGHV1425F (Package Type 44162) Product Dimensions CGHV1425P (Package Type 44161) Copyright 214-215 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of 8 CGHV1425 Rev 1.1

Part Number System CGHV1425F Type Power Output (W) Upper Frequency (GHz) Cree GaN High Voltage Parameter Value Units Upper Frequency 1 1.4 GHz Power Output 25 W Type F = Flanged P = Package - Table 1. Note 1 : Alpha characters used in frequency code indicate a value greater than 9.9 GHz. See Table 2 for value. Character Code Code Value A B 1 C 2 D 3 E 4 F 5 G 6 H 7 J 8 K 9 Examples: 1A = 1. GHz 2H = 27. GHz Table 2. Copyright 214-215 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of 9 CGHV1425 Rev 1.1

Product Ordering Information Order Number Description Unit of Measure Image CGHV1425F GaN HEMT Each CGHV1425P GaN HEMT Each CGHV1425-TB Test board without GaN HEMT Each CGHV1425P-AMP Test board with GaN HEMT installed Each CGHV1425F-AMP Test board with GaN HEMT installed Each Copyright 214-215 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of 1 CGHV1425 Rev 1.1

Disclaimer Specifications are subject to change without notice. believes the information contained within this data sheet to be accurate and reliable. However, no responsibility is assumed by Cree for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Cree. Cree makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose. Typical parameters are the average values expected by Cree in large quantities and are provided for information purposes only. These values can and do vary in different applications and actual performance can vary over time. All operating parameters should be validated by customer s technical experts for each application. Cree products are not designed, intended or authorized for use as components in applications intended for surgical implant into the body or to support or sustain life, in applications in which the failure of the Cree product could result in personal injury or death or in applications for planning, construction, maintenance or direct operation of a nuclear facility. For more information, please contact: Sarah Miller Marketing Cree, RF Components 1.919.47.532 Ryan Baker Marketing & Sales Cree, RF Components 1.919.47.7816 Tom Dekker Sales Director Cree, RF Components 1.919.47.5639 Copyright 214-215 All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of 11 CGHV1425 Rev 1.1