Dual EIA423/EIA232D Line Driver The MC34A dual is singleended line driver has been designed to satisfy the requirements of EIA standards EIA423 and EIA232D, as well as CCITT X.26, X.2 and Federal Standard FIDS3. It is suitable for use where signal wave shaping is desired and the output load resistance is greater than 4. Output slew rates are adjustable from. s to s by a single external resistor. Output level and slew rate are insensitive to power supply variations. Input undershoot diodes limit transients below ground and output current limiting is provided in both output states. The MC34A has a standard. input logic threshold for TTL or NMOS compatibility. Features PNP Buffered Inputs to Minimize Input Loading Short Circuit Protection Adjustable Slew Rate Limiting MC34A Equivalent to 9636A Output Levels and Slew Rates are Insensitive to Power Supply oltages No External Blocking Diode Required for EE Supply Second Source A9636A PbFree Packages are Available SOIC D SUFFIX CASE 7 PDIP P SUFFIX CASE 626 MARKING DIAGRAMS 34A ALYW MC34AP AWL YYWWG A = Assembly Location L, WL = Wafer Lot Y, YY = Year W, WW = Work Week or G = PbFree Package (Note: Microdot may be in either location) PIN CONNECTIONS Wave Shape CC Input A 2 7 Output A Input B 3 6 Output B GND 4 EE Wave Shape Control ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 3 of this data sheet. MC34A Driver RS423 Interface TTL Logic Figure. Simplified Application MC346 ThreeState Receiver Semiconductor Components Industries, LLC, 26 July, 26 Rev. Publication Order Number: MC34A/D
MAXIMUM RATINGS (Note ) Power Supply oltages Rating Symbol alue Unit CC + EE Output Current Source Sink I O+ + I O ma Operating Ambient Temperature T A to + 7 C Junction Temperature Range T J C Storage Temperature Range T stg 6 to + C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. Devices should not be operated at these values. The Electrical Characteristics provide conditions for actual device operation. RECOMMENDED OPERATING CONDITIONS Power Supply oltages Characteristic Symbol Min Typ Max Unit CC. EE 3.2 2 2 3.2. Operating Temperature Range T A 2 7 C Wave Shaping Resistor R WS k TARGET ELECTRICAL CHARACTERISTICS (Unless otherwise noted, specifications apply over recommended operating conditions) Characteristic Symbol Min Typ Max Unit Input oltage Low Logic State IL. Input oltage High Logic State IH 2. Input Current Low Logic State ( IL =.4 ) I IL A Input Current High Logic State ( IH = 2.4 ) ( IH =. ) Input Clamp Diode oltage (I IK = ma) IK. Output oltage Low Logic State (R L = ), EIA423 (R L = 3. k ), EIA232D (R L = 4 ), EIA423 Output oltage High Logic State (R L = ), EIA423 (R L. = 3. k ), EIA232D (R L = 4 ), EIA423 I IH I IH2 OL 6. 6. 6. OH.. 4. Output Resistance (R L 4 ) R O 2 Output ShortCircuit Current (Note 2) ( in = out = ) ( in = IH(Min), out = ) I OSH I OSL +.. 4. 6. 6. 6. + Output Leakage Current (Note 3) ( CC = EE =, 6. o 6. ) I ox A A ma Power Supply Currents (R W = k, R L =, IL in IH ) I CC I EE + ma 2. One output shorted at a time. 3. No EE diode required. 2
TRANSITION TIMES (Unless otherwise noted, C L = 3 pf, f =. khz, CC = EE = 2. ± %, T A = 2 C, R L = 4. Transition times measured % to 9% and 9% to %) Characteristic Symbol Min Typ Max Unit Transition Time, LowtoHigh State Output (R W = k ) (R W = k ) (R W = k ) (R W = k ) t TLH.. 4.4 4 7 4 s Transition Time, HightoLow State Output (R W = k ) (R W = k ) (R W = k ) (R W = k ) t THL.. 4.4 4 7 4 s ORDERING INFORMATION Device Operating Temperature Range Package Shipping MC34AD MC34ADG SOIC SOIC (PbFree) 9 Units / Rail 9 Units / Rail MC34ADR2 SOIC / Tape & Reel MC34ADR2G T A = to +7 C SOIC (PbFree) / Tape & Reel MC34AP PDIP Units / Rail MC34APG PDIP (PbFree) Units / Rail For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD/D. To Scope (Input) CC To Scope (Output) MC34A Pulse Generator f =. khz P W = s R WS R L C L (Includes Probe and Jig Capacitance) 3. EE Note: Input Rise and Fall Times (% to 9%) ns Input OH 9% 9% Output OL % % t THL t TLH Figure 2. Test Circuit and Waveforms for Transition Times 3
6. WAE SHAPE RESISTOR, R w (k Ω ) C L = 3 pf 6.... TRANSITION TIMES, t TLH /t THL ( s) out, OUTPUT OLTAGE () 4. 2. 2. 4. CC = 2 EE = 2 R WS = k R L = 4 C T A = 2 C 7 C. in, INPUT OLTAGE () 2. Figure 3. Output Transition Times versus Wave Shape Resistor alue Figure 4. Input/Output Characteristics versus Temperature I out, OUTPUT CURRENT (ma) 4 3 2 2 3 4. PowerOn in = IH(Min) T A = 2 C CC = 2 EE = 2 R WS = k I out, OUTPUT CURRENT (ma)...6.4.2.2.4 CC = EE = in = T A = 2 C (No diode required at EE Pin.).6 in =.. 6. 4. 2. 2. 4. 6... 6. 4. 2. 2. 4. 6.. out, OUTPUT OLTAGE () out, OUTPUT OLTAGE () Figure. Output Current versus Output oltage PowerOff I xx, SUPPLY CURRENT (ma) 2... 6. 4. 2. 2. 4. 6... 2. in =, in = IH CC = 2 EE = 2 R WS = k, R L = in = in = IH I CC I EE 2 3 4 6 7 T A, AMBIENT TEMPERATURE ( C) 9 t THL, RISE/FALL TIME ( s) t TLH μ k CC = 2 EE = 2 C L = 3 pf T A = C, 7 C T A = 2 C k R WS, WAE SHAPING RESISTANCE ( ) M Figure 6. Supply Current versus Temperature Figure 7. Rise/Fall Time versus R WS 4
PACKAGE DIMENSIONS SOIC NB D SUFFIX PLASTIC PACKAGE CASE 77 ISSUE AH X B Y Z H G A D 4 S C.2 (.) M Z Y S X S.2 (.) M SEATING PLANE Y. (.4) M N X 4 M K J NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.M, 92. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION. (.6) PER SIDE.. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE.27 (.) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 7 THRU 76 ARE OBSOLETE. NEW STANDARD IS 77. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 4...9.97 B 3. 4...7 C.3.7.3.69 D.33..3.2 G.27 BSC. BSC H..2.4. J.9.2.7. K.4.27.6. M N.2...2 S. 6.2.22.244 SOLDERING FOOTPRINT*.2.6 7..27 4...6.24.27. SCALE 6: mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
PACKAGE DIMENSIONS PDIP P SUFFIX PLASTIC PACKAGE CASE 626 ISSUE L NOTE 2 T SEATING PLANE H B 4 F A C N D K G.3 (.) M T A M B M L J M NOTES:. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 2. PACKAGE CONTOUR OPTIONAL (ROUND OR SQUARE CORNERS). 3. DIMENSIONING AND TOLERANCING PER ANSI Y4.M, 92. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 9.4.6.37.4 B 6. 6.6.24.26 C 3.94 4.4..7 D.3...2 F.2.7.4.7 G 2.4 BSC. BSC H.76.27.3. J.2.3..2 K 2.92 3.43..3 L 7.62 BSC.3 BSC M N.76..3.4 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 63, Denver, Colorado 27 USA Phone: 336727 or 34436 Toll Free USA/Canada Fax: 3367276 or 344367 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 229 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 42 33 79 29 Japan Customer Focus Center Phone: 37733 6 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MC34A/D