Single-Pole, Normally Closed 4-Pin SOP OptoMOS Relay Parameter Rating Units Blocking Voltage 4 V P Load Current 1 ma rms / ma DC On-Resistance (max) 3 LED Current to Operate 2 ma Features 1V rms Input/Output Isolation Low Drive Power Requirements (TTL/CMOS Compatible) No Moving Parts High Reliability Arc-Free With No Snubbing Circuits No EMI/RFI Generation Small 4-Pin SOP Package Machine Insertable, Wave Solderable Tape & Reel Version Available Applications Telecommunications Telecom Switching Tip/Ring Circuits Modem Switching (Laptop, Notebook, Pocket Size) Hook Switch Dial Pulsing Ground Start Ringing Injection Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas) Medical Equipment-Patient/Equipment Isolation Security Aerospace Industrial Controls Description is a miniature single-pole, normally closed (1-Form-B) solid state relay. It uses IXYS Integrated Circuits Division s patented, optically coupled, OptoMOS architecture to provide 1V rms of input/output isolation in a small 4-Pin SOP package. uses IXYS Integrated Circuits Division s state of the art double-molded vertical construction packaging to produce one of the world s smallest relays. It is ideal for replacing larger, less-reliable reed and electromechanical relays. Approvals UL Recognized Component: File E7627 CSA Certified Component: Certificate 11727 Certified to: IEC69-1: 2 EN69-1: 26 TUV Certificate: B 9 7 4941 6 Ordering Information Part # TR Pin Configuration 1 + Control Description 4-Pin SOP (1/tube) 4-Pin SOP (2/reel) Switching Characteristics of Normally Closed Devices Form-B 4 Load 2 3 Control Load I LOAD 1% t off 9% t on Pb e3 DS--R2 www.ixysic.com 1
Absolute Maximum Ratings @ 2ºC Parameter Ratings Units Blocking Voltage 4 V P Reverse Input Voltage V Input Control Current ma Peak (1ms) 1 A Input Power Dissipation 1 mw Total Power Dissipation 1 4 mw Isolation Voltage, Input to Output 1 V rms Operational Temperature -4 to +8 C Storage Temperature -4 to +12 C 1 Derate linearly 3.33 mw / ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Electrical Characteristics @ 2ºC Parameter Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous 1 =ma I L - - 1 ma rms / ma DC Peak t =1ms I LPK - - ±3 ma P On-Resistance 2 I L =1mA R ON - 26 3 Switching Speeds Turn-On t =ma, V L =1V on -.31 2 Turn-Off t off -.3 2 ms Off-State Leakage Current V L =4V, =2mA I LEAK - - 1 µa Output Capacitance =2mA, V L = V, f=1mhz C OUT - 6 - pf Input Characteristics Input Control Current to Activate 3 I L =1mA - - 2 ma Input Control Current to Deactivate -.1 - - ma Input Voltage Drop =ma V F.9 1.2 1.4 V Reverse Input Current V R =V I R - - 1 µa Common Characteristics Capacitance, Input to Output - C I/O - 1 - pf 1 Load current derates linearly from 1mA @ 2 o C to 6mA @ 8 o C. 2 Measurement taken within 1 second of on-time. 3 For applications requiring high temperature operation (greater than 6 C) a LED drive current of 4mA is recommended. R2 2 www.ixysic.com
PERFORMANCE DATA* 2 Typical LED Forward Voltage Drop (N=, =ma, T A 2 Typical Turn-On Time (N=, =ma, I L =6mA, T A 3 Typical Turn-Off Time (N=, =ma, I L =6mA, T A 2 1 1 2 1 1 2 2 1 1 1.2 1.2 1.26 1.26 1.27 1.27 LED Forward Voltage (V).24.26.28.3.32.34.36 Turn-On Time (ms).2.23.26.29.32.3.38 Turn-Off Time (ms) 2 Form-B for Switch Operation (N=, I L =12mA, T A 2 Typical On-Resistance Distribution (N=, =ma, I L =1mA, T A 2 Typical Blocking Voltage Distribution (N=, =2mA, T A 2 1 1 1 1 2 1 1.12.14.16.18.2.22 24 2 2 26 27 28 28 On-Resistance ( ) 4 41 42 43 44 4 46 47 Blocking Voltage (V P ) Typical LED Forward Voltage vs. Forward Current (T A 12 Typical Turn-Off Time vs. LED Forward Current =6mA, T A 318 Typical Turn-On Time vs. LED Forward Current =6mA, T A Forward Current (ma) 4 3 2 1 Turn-Off Time ( s) 1 8 6 4 2 Turn-On Time ( s) 316 314 312 31 38 1.1 1.1 1.2 1.2 1.3 1.3 1.4 1.4 1. 1. Forward Voltage (V) 1 2 3 4 36 1 2 3 4 LED Forward Voltage (V) 1.6 1. 1.4 1.3 Typical LED Forward Voltage Drop =ma =2mA 1.2 =1mA 1.1 =ma =2mA 1. -4-2 2 4 6 8 1 Turn-Off Time ( s) 2 16 12 8 4 Typical Turn-Off Time =6mA) =2mA =ma -4-2 2 4 6 8 1 Turn-On Time ( s) 4 4 3 3 2 2 1 Typical Turn-On Time =6mA) =ma =2mA 1-4 -2 2 4 6 8 1 *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R2 www.ixysic.com 3
PERFORMANCE DATA*.8.7.6..4.3.2 Typical for Switch Operation =6mA).1-4 -2 2 4 6 8 1 On-Resistance ( ) Typical On-Resistance ( =ma, I L =6mA) 4 4 3 3 2 2-4 -2 2 4 6 8 1 Load Current (ma) 1 1 - -1-1 Typical Load Current vs. Load Voltage ( =ma, T A -3-2 -1 1 2 3 Load Voltage (V) Load Current (ma) 11 1 9 8 7 6 Maximum Load Current ( =ma) -4-2 2 4 6 8 1 Blocking Voltage (V P ) 46 46 4 4 44 Typical Blocking Voltage ( =ma) 44-4 -2 2 4 6 8 1 Leakage Current (na) 14 12 1 8 6 4 2 Leakage Current Measured Between Pins 3&4 ( =ma, V L =4V) -4-2 2 4 6 8 1 Output Capacitence (pf) 7 6 4 3 2 1 Output Capacitance vs. Load Voltage ( =2mA, f=1mhz, T A.1 1 1 1 1 Load Voltage (V) Load Current (A) 1..8.6.4.2 Energy Rating Curve (T A. 1 s 1 s 1ms 1ms 1ms 1s 1s 1s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R2 4 www.ixysic.com
Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-2, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-33. Device Moisture Sensitivity Level (MSL) Rating MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-62. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-2 must be observed. Device Maximum Temperature x Time 26ºC for 3 seconds Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. Pb e3 R2 www.ixysic.com
MECHANICAL DIMENSIONS 4.89 ±.23 (.161 ±.8).2 ±.2 (.8 ±.1) Recommended PCB Land Pattern.6 (.217) 3.81 ±.76 (.1 ±.3) Pin 1 2.4 Typ (.1 Typ) 6.96 ±.12 (.24 ±.4) 1.2 ±.2 (.4 ±.1).432 ±.127 (.17 ±.) 1.3 (.12).6 (.22) 2.184 Max (.86 Max) Lead to package standoff:.637 ±.383 (.2 ±.1) 2.4 (.1).762 ±.12 (.3 ±.4).381 TYP. (.1 TYP.) Dimensions mm (inches) TR Tape & Reel 33.2 Dia (13. Dia) Top Cover Tape Thickness.12 Max (.4 Max) B =4.7 (.18) W=12. (.472) K =2.7 (.16) K 1 =2.3 (.91) A =6. (.26) User Direction of Feed P=8. (.31) Embossed Carrier Dimensions mm (inches) Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS--R2 Copyright 212, IXYS Integrated Circuits Division OptoMOS is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 12/14/212