Single-Pole, Normally Open 4-Pin OptoMOS Relay Parameter Rating Units Blocking Voltage 6 V P Load Current 9 ma rms / ma DC On-Resistance (max Features V rms Input/Output Isolation 6V P Blocking Voltage 1% Solid State Low Drive Power Requirements Arc-Free With No Snubbing Circuits No EMI/RFI Generation Small 4-Pin Package Applications Instrumentation Multiplexers Data Acquisition Electronic Switching I/O Subsystems Meters (Watt-Hour, Water, Gas Medical Equipment Patient/Equipment Isolation Security Aerospace Industrial Controls Description The G is a single-pole, normally open (1-Form-A Solid State Relay with an enhanced input to output isolation barrier of V rms. The relay output is constructed with efficient MOSFET switches that use IXYS Integrated Circuits Division's patented OptoMOS architecture. The input, a highly efficient infrared LED, controls the optically coupled output. Approvals UL Certified Component: File E7627 CSA Certified Component: Certificate 11727 EN/IEC 69-1 Certified Component: TUV Certificate B 13 12 82667 3 Ordering Information Part Number G GV GR GRTR Pin Configuration 1 + Control Description 4-Pin DIP (1/Tube 4-Pin DIP V-Bend (1/Tube 4-Pin Surface Mount (1/Tube 4-Pin Surface Mount (1/Reel 4 Load 2 3 Control Load Switching Characteristics of Normally Open Devices Form-A 9% 1% I LOAD t on t off DS--R7 www.ixysic.com 1
Absolute Maximum Ratings @ ºC Parameter Ratings Units Peak Blocking Voltage 6 V P Reverse Input Voltage V Input Control Current ma Peak (1ms 1 A Input Power Dissipation 1 1 mw Total Package Dissipation 2 mw Isolation Voltage, Input to Output V rms Operational Temperature -4 to +8 ºC Storage Temperature -4 to +1 ºC 1 Derate linearly 1.33mW / ºC 2 Derate linearly 3mW / ºC Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at + C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Electrical Characteristics @ ºC Parameters Conditions Symbol Min Typ Max Units Output Characteristics Load Current Continuous - I L - - 9 ma rms / ma DC Peak t=1ms I LPK - - ±3 ma P On-Resistance 1 I L =9mA R ON - 3 Off-State Leakage Current V L =6V P I LEAK - - 1 A Switching Speeds Turn-On =ma, V L =1V t on - - Turn-Off (See Timing Diagram t off - - ms Output Capacitance =ma, V L =V, f=1mhz C OUT - - pf Input Characteristics Input Control Current to Activate I L =9mA -. 2 Input Control Current to Deactivate -.2 - - ma Input Voltage Drop =ma V F.9 1.2 1.4 V Reverse Input Current V R =V I R - - 1 A Coon Characteristics Input to Output Capacitance V IO =V, f=1mhz C IO - 3 - pf 1 Measurement taken within 1 second of on-time. Timing Diagram ma I L ma 9% 1% t on t off 2 www.ixysic.com R7
PERFORMANCE DATA @ºC (Unless Otherwise Noted* 3 Typical LED Forward Voltage Drop (N=, =ma Typical Turn-On Time (N=, =2mA, I L =9mA DC 3 Typical Turn-Off Time (N=, =2mA, I L =9mA DC Device Count (N 3 2 1 1 Device Count (N 2 1 1 Device Count (N 3 2 1 1 1.17 1.19 1.21 1.23 1. LED Forward Voltage Drop (V.64.68.72.76.8.84.88 Turn-On (ms.22.24.26.28.3 Turn-Off (ms Typical for Switch Operation (N=, I L =9mA DC Typical for Switch Dropout (N=, I L =9mA DC 3 Typical On-Resistance Distribution (N=, I L =9mA DC Device Count (N 2 1 1 Device Count (N 2 1 1 Device Count (N 3 2 1 1.3.4..6.7.8.9 LED Current (ma.33.34.3.36.37.38.39 LED Current (ma 34.3 34.6 34.9 3.2 3. 3.8 36.1 On-Resistance ( 3 Typical Blocking Voltage Distribution (N= 3 Device Count (N 2 1 1 777 782 787 792 797 82 87 Blocking Voltage (V P LED Forward Voltage Drop (V 1.8 1.6 1.4 1.2 1. Typical LED Forward Voltage Drop =ma =1mA =ma.8-4 -2 2 4 6 8 1 12 Temperature (ºC Turn-On (ms Typical Turn-On vs. LED Forward Current =9mA DC 2. 1.8 1.6 1.4 1.2 1..8.6.4.2 1 1 2 3 3 4 4 LED Forward Current (ma Turn-Off Time (ms.7.6..4.3.2.1 Typical Turn-Off Time vs. LED Forward Current =9mA DC 1 1 2 3 3 4 4 LED Forward Current (ma *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R7 www.ixysic.com 3
PERFORMANCE DATA @ºC (Unless Otherwise Noted* Turn-On Time (ms. 4. 4. 3. 3. 2. 2. 1. 1.. -4 Typical Turn-On Time =7mA DC =ma =1mA -2 2 4 6 8 1 Temperature (ºC Turn-Off Time (ms 1..9.8.7.6..4.3.2.1-4 Typical Turn-Off Time ( =ma, I L =7mA DC -2 2 4 6 8 1 Temperature (ºC On-Resistance ( 7 6 4 3 2 1-4 Typical On-Resistance ( =2mA, I L =ma DC -2 2 4 6 8 1 Temperature (ºC 3. Typical for Switch Operation =ma DC 3. Typical for Switch Dropout =ma DC 9 Typical Load Current vs. Load Voltage ( =2mA LED Current (ma 2. 2. 1. 1.. LED Current (ma 2. 2. 1. 1.. Load Current (ma 6 3-3 -6. -4-2 2 4 6 8 1 Temperature (ºC. -4-2 2 4 6 8 1 Temperature (ºC -9-3. -2. -1. 1. 2. 3. Load Voltage (V Load Current (ma Maximum Load Current ( =2mA 1 9 8 7 6 4 3 2 1-4 -2 2 4 6 8 1 12 Temperature (ºC Blocking Voltage (V P 9 9 8 8 7 7 6 6-4 Typical Blocking Voltage -2 2 4 6 8 1 Temperature (ºC Leakage ( A.4.3.3..2.1.1. -4 Typical Leakage Measured Across Pins 3 & 4-2 2 4 6 8 1 Temperature (ºC Load Current (A Energy Rating Curve 1..9.8.7.6..4.3.2.1 1μs 1μs 1ms 1ms 1ms 1s 1s 1s Time *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R7
Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-2, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-33. ESD Sensitivity Device Moisture Sensitivity Level (MSL Rating G / GV MSL 1 GR MSL 3 This product is ESD Sensitive, and should be handled according to the industry standard JESD-6. Soldering Profile Provided in the table below is the Classification Temperature (T C of this product and the maximum dwell time the body temperature of this device may be above (T C - ºC. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. Additionally, for the GR, the solder reflow profile given in Technical Brief TB-2 "Pb-Free Solder Reflow Profile for Select Devices" must be followed. For the through-hole devices, G and GV, and any other processes, the guidelines of J-STD-2 must be observed. Board Wash Device Maximum Body Temperature (T c Time GR ºC 1 seconds IXYS Integrated Circuits Division recoends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow-up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler. Cleaning or drying methods that employ ultrasonic energy may damage the device, and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R7 www.ixysic.com
G.991 (.39 6.3 ±.127 (. ±. 3.3 ±. (.13 ±.2 MECHANICAL DIMENSIONS.4 (.1 PC Board Pattern (Top View 6 -.8 DIA. (6 -.31 DIA. 2.4 ±.127 (.1 ±. 7.62 ±.127 (.3 ±. 4.72 ±.127 (.18 ±. 9º (ALL.47 ±.76 (.18 ±.3 2.4 ±.127 (.1 ±. PIN 1 2.19 (.8.8 (.2 3.17 (.1 9º (ALL 9.144 ±.8 (.36 ±.2 7.62 ±. (.3 ±.1 6.3 ±.127 (. ±. (inches GV.991 (.39 6.3 ±. (. ±.2.4 (.1 1.16 ±.8 (.4 ±.2 3.3 ±. (.13 ±.2 PC Board Pattern (Top View 6 -.8 DIA. (6 -.31 DIA. 2.4 ±.127 (.1 ±. 1.16 ±.127 (.4 ±. 4.72 ±. (.18 ±.2 9º (ALL.47 ±.76 (.18 ±.3 Pin 1 1.778 (.7 2.4 ±. (.1 ±.2 2.92 (.11.127 (. 9º (ALL 7.62 ±.4 (.3 ±.1 6.3 ±.127 (. ±. (inches 6 www.ixysic.com R7
GR 2.4 ±.127 (.1 ±. 3.3 ±. (.13 ±.2 PCB Land Pattern.63 ±.4 (. ±.1 2.287 (.9 6.3 ±.127 (. ±. 9. (.37 7.62 ±.4 (.3 ±.1 8.8 (.346 9º ± 1º (ALL PIN #1.991 (.39 4.72 ±.127 (.18 ±..4 (.1 3.48 ±.76 (.137 ±.3 1.6 (.63.9 (.37 2.4 ±.127 (.1 ±. 2.287 ±.127 (.9 ±..12 min /.4 max (.4 min /.1 max (inches GRTR Tape & Reel 33.2 Dia (13. Dia B =. Top Cover (.197 Tape Thickness.12 Max (.4 Max K =4.2 (.16 K 1 =3.7 (.146 A =1.1 (.394 P=12. (.472 W=16.±.3 (.63±.12 Embossed Carrier Embossment (inches NOTES: 1. All dimensions meet EIA-481-C requirements 2. Unless otherwise noted, tolerances = ±.1 (.4 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 7 Specification: DS--R7 Copyright 216, IXYS Integrated Circuits Division All rights reserved. Printed in USA. 1/7/216