BTA16 BW/CW BTB16 BW/CW

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BTA16 BW/CW BTB16 BW/CW SNUBBERLESS TRIACS. FEATURES HIGH COMMUTATION : (di/dt)c > 14A/ms without snubber HIGH SURGE CURRENT : I TSM = 160A. V DRM UP TO 800V BTA Family : INSULATING VOLTAGE = 2500V (RMS) (UL RECOGNIZED : E81734) DESCRIPTION The BTA/BTB16 BW/CW triac family are high performance glass passivated chips technology. The SNUBBERLESS concept offer suppression of RC network and it is suitable for application such as phase control and static switching on inductive or resistive load. ABSOLUTE RATINGS (limiting values) A1 A2 G TO220AB (Plastic) Symbol Parameter Value Unit IT(RMS) ITSM RMS on-state current (360 conduction angle) Non repetitive surge peak on-state current ( Tj initial = 25 C ) BTA Tc = 80 C 16 A BTB Tc = 90 C tp = 8.3 ms 170 A tp = 10 ms 160 I2t I2t value tp = 10 ms 128 A2s di/dt Critical rate of rise of on-state current Gate supply : IG = 500mA dig/dt = 1A/µs Repetitive F = 50 Hz 20 A/µs Non Repetitive 100 Tstg Tj Storage and operating junction temperature range - 40 to + 150-40 to + 125 C C Tl Maximum lead temperature for soldering during 10 s at 4.5 mm from case 260 C Symbol Parameter BTA / BTB16-... BW/CW Unit 400 600 700 800 VDRM VRRM Repetitive peak off-state voltage Tj = 125 C 400 600 700 800 V March 1995 1/5

THERMAL RESISTANCES Symbol Parameter Value Unit Rth (j-a) Junction to ambient 60 C/W Rth (j-c) DC Junction to case for DC BTA 3.1 C/W BTB 2.3 Rth (j-c) AC Junction to case for 360 conduction angle ( F= 50 Hz) BTA 2.3 C/W BTB 1.75 GATE CHARACTERISTICS (maximum values) PG (AV) =1W PGM = 10W (tp = 20 µs) IGM =4A(tp=20µs) VGM = 16V (tp = 20 µs). ELECTRICAL CHARACTERISTICS Symbol Test Conditions Quadrant Suffix Unit BW CW IGT VD=12V (DC) RL=33Ω Tj=25 C I-II-III MIN 2 1 ma MAX 50 35 VGT VD=12V (DC) RL=33Ω Tj=25 C I-II-III MAX 1.5 V VGD VD=VDRM RL=3.3kΩ Tj=125 C I-II-III MIN 0.2 V tgt VD=VDRM IG = 500mA di G /dt = 3A/µs Tj=25 C I-II-III TYP 2 µs I L I G =1.2 I GT Tj=25 C I-III TYP 40 - ma II TYP 80 - I-III MAX - 50 II MAX - 80 I H * I T = 500mA gate open Tj=25 C MAX 50 35 ma V TM * I TM = 22.5A tp= 380µs Tj=25 C MAX 1.60 V I DRM IRRM V DRM VRRM Rated Rated Tj=25 C MAX 0.01 ma Tj=125 C MAX 2 dv/dt * Linear slope up to V D =67%V DRM gate open Tj=125 C MIN 500 250 V/µs TYP 750 500 (di/dt)c * Without snubber Tj=125 C MIN 14 8.5 A/ms * For either polarity of electrode A2 voltage with reference to electrode A1. TYP 28 17 2/5

ORDERING INFORMATION BTA16 BW/CW / BTB16 BW/CW Package IT(RMS) VDRM /VRRM Sensitivity Specification A V BW CW BTA 16 400 X X (Insulated) 600 X X 700 X X 800 X X BTB 400 X X (Uninsulated) 600 X X 700 X X 800 X X Fig.1 : Maximum RMS power dissipation versus RMS on-state current (F=50Hz). (Curves are cut off by (di/dt)c limitation) Fig.2 : Correlation between maximum RMS power dissipation and maximum allowable temperatures (Tamb and Tcase) for different thermal resistances heatsink + contact (BTA). Fig.3 : Correlation between maximum RMS power dissipation and maximum allowable temperatures (T amb and Tcase) for different thermal resistances heatsink + contact (BTB). Fig.4 : RMS on-state current versus case temperature. 3/5

Fig.5 : Relative variation of thermal impedance versus pulse duration. Fig.6 : Relative variation of gate trigger current and holding current versus junction temperature. Zth/Rth 1 Zth(j-c) 0.1 Zth(j-a) tp(s) 0.01 1E-3 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 Fig.7 : Non Repetitive surge peak on-state current versus number of cycles. Fig.8 : Non repetitive surge peak on-state current for a sinusoidal pulse with width : t 10ms, and corresponding value of I 2 t. Fig.9 : On-state characteristics (maximum values). 4/5

PACKAGE MECHANICAL DATA TO220AB Plastic I P A O = N = G D F B C J H L M REF. DIMENSIONS Millimeters Inches Min. Max. Min. Max. A 10.20 10.50 0.401 0.413 B 14.23 15.87 0.560 0.625 C 12.70 14.70 0.500 0.579 D 5.85 6.85 0.230 0.270 F 4.50 0.178 G 2.54 3.00 0.100 0.119 H 4.48 4.82 0.176 0.190 I 3.55 4.00 0.140 0.158 J 1.15 1.39 0.045 0.055 L 0.35 0.65 0.013 0.026 M 2.10 2.70 0.082 0.107 N 4.58 5.58 0.18 0.22 O 0.80 1.20 0.031 0.048 P 0.64 0.96 0.025 0.038 Cooling method : C Marking : type number Weight : 2.3 g Recommended torque value : 0.8 m.n. Maximum torque value : 1 m.n. Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of SGS-THOMSON Microelectronics. 1995 SGS-THOMSON Microelectronics - Printed in Italy - All rights reserved. SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 5/5