TOSHIBA Insulated Gate Bipolar Transistor Silicon N Channel IGBT GT60M324

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GT6M4 TOSHIBA Insulated Gate Bipolar Transistor Silicon N Channel IGBT GT6M4 Consumer Application Voltage Resonance Inverter Switching Application Sixth Generation IGBT Unit: mm FRD included between emitter and collector Enhancement mode type High speed IGBT : t f =.μs (typ.) (I C = 6A) FRD : t rr =.μs (typ.) (di/dt = A/μs) Low saturation voltage: V CE (sat) =.7V (typ.) (I C = 6A) High Junction temperature : T j = 7 (max) Absolute Maximum Ratings (Ta = C) Characteristics Symbol Rating Unit Collector-emitter voltage V CES V Gate-emitter voltage V GES ± V Collector current Diode forward current Collector power dissipation () DC I C 6 ms I CP DC I F ms I FP P C 4 W Junction temperature T j 7 C A A JEDEC JEITA TOSHIBA -6CC Weight: 4.6 g (typ.) Storage temperature T stg 4 to 7 C Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ( Handling Precautions / Derating Concept and Methods ) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Marking In general, loss of IGBT increases more when it has positive temperature coefficient and gets higher temperature. In case that the temperature rise due to loss of IGBT exceeds the heat release capacity of a device, it leads to thermorunaway and results in destruction. Therefore, please design heat release of a device with due consideration to the temperature rise of IGBT. Equivalent Circuit Collector TOSHIBA 6M4 Part No. (or abbreviation code) Lot No. Note Gate Note : A line under a Lot No. identifies the indication of product Labels. [[G]]/RoHS COMPATIBLE or [[G]]/RoHS [[Pb]] Emitter Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. The RoHS is the Directive //EC of the European Parliament and of the Council of 7 January on the restriction of the use of certain hazardous substances in electrical and electronic equipment. --

GT6M4 Electrical Characteristics (Ta = C) Characteristics Symbol Test Condition Min Typ. Max Unit Gate leakage current I GES V GE = ± V, V CE = ± na Collector cut-off current I CES V CE = V, V GE =. ma Gate-emitter cut-off voltage V GE (OFF) I C = 6 ma, V CE = V 4. 7. V I C = A, V GE = V..6 Collector-emitter saturation voltage V CE (sat) I C = A, V GE = V.4. V I C = 6 A, V GE = V.7. Input capacitance C ies V CE = V, V GE =, f = MHz 6 pf Rise time t r Resistive Load. Switching time Turn-on time t on V CC = 6 V, I C = 6 A. Fall time t f V GG = ± V, R G = Ω.. μs Turn-off time t off (Note ).6 Diode forward voltage V F I F = A, V GE =.. V Reverse recovery time t rr I F = A, V GE =, di/dt = A/μs. µs Thermal Resistance (IGBT) Rth(j-c). C/W Thermal Resistance (Diode) Rth(j-c) 4. C/W Note : Switching time measurement circuit and input/output waveforms R G V GE % % Ω V CC I C % % V CE % % t f t off t r t on --

GT6M4 Tc = 4 C 6 4. V GE = 7. V 6 4. VGE =7. V 4 4 Tc = C. VGE = V 6 4 VGE = 7. V 6 4 Tc=-4 4 4 Collector -emitter voltage VCE (V) Collector-emitter saturation voltage VCE (sat) (V) 4 VGE = V V CE (sat) Tc 6 4 IC = A I C V GE VCE = V 6 4 Tc = C 4 7 7 7 4 6 Case temperature Tc ( C) Gate-emitter voltage VGE (V) --

GT6M4 V CE, V GE Q G C V CE RL = Ω VCE = V 6 4 Gate-emitter voltage VGE (V) Capacitance C (pf) VGE = f = MHz Cies Coes Cres 6 4. Gate charge Q G (nc) Collector-emitter voltage V CE (V) Switching Time R G Switching Time I C Switching time (μs).... VCC = 6 V IC = 6 A VGG = ± V toff ton tr tf Switching time (μs).... VCC = 6 V RG = Ω VGG = ± V toff ton tr tf... Gate resistance R G (Ω). 4 6 7 Collector current I C (A) IC max (pulsed) * IC max (continuous) DC operation Safe Operating Area *: Single non-repetitive pulse Curves must be derated linearly with increases in temperature. ms* ms* μs* μs* Transient thermal impedance(junction case) rth(j c) ( C/W) r th (j c ) t w Diode stage IGBT stage 4 Collector-emitter voltage V CE (V) Pulse width t w (s) 4 --

GT6M4 Forward current IF (A) 6 4 I F V F VGE = Tc = C 4 Peak reverse recovery current Irr (A) 7 6 I rr, t rr I F di/dt = A/μs Irr trr... Reverse recovery time trr (μs)...... Forward voltage V F (V) 4 6 Forward current I F (A) Peak reverse recovery current Irr (A) 4 trr Irr I rr, t rr di/dt IF = 6 A..7.. Reverse recovery time trr (μs) di/dt (A/μs) --

GT6M4 RESTRICTIONS ON PRODUCT USE Toshiba Corporation, and its subsidiaries and affiliates (collectively TOSHIBA ), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively Product ) without notice. This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with TOSHIBA s written permission, reproduction is permissible only if reproduction is without alteration/omission. Though TOSHIBA works continually to improve Product s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the TOSHIBA Semiconductor Reliability Handbook and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS PRODUCT DESIGN OR APPLICATIONS. Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. 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Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations. Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations. 6 --