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Transcription:

Data sheet acquired from Harris Semiconductor SCHS166B November 1997 - Revised May 2000 CD54/74HC221, CD74HCT221 High Speed CMOS Logic Dual Monostable Multivibrator with Reset Features Description [ /Title (CD74 HC221, CD74 HCT22 1) /Subject High peed MOS ogic ual onos able ulti- Overriding RESET Terminates Output Pulse Triggering from the Leading or Trailing Edge and Buffered Outputs Separate Resets Wide Range of Output-Pulse Widths Schmitt Trigger on B Inputs Fanout (Over Temperature Range) - Standard Outputs............... 10 LSTTL Loads - Bus Driver Outputs............. 15 LSTTL Loads Wide Operating Temperature Range... -55 o C to 125 o C Balanced Propagation Delay and Transition Times Significant Power Reduction Compared to LSTTL Logic ICs HC Types - 2V to 6V Operation - High Noise Immunity: N IL = 30%, N IH = 30% of at = 5V HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, V IL = 0.8V (Max), V IH = 2V (Min) - CMOS Input Compatibility, I l 1µA at V OL, V OH The HC221, and CD74HCT221 are dual monostable multivibrators with reset. An external resistor (R X ) and an external capacitor (C X ) control the timing and the accuracy for the circuit. Adjustment of R X and C X provides a wide range of output pulse widths from the and terminals. Pulse triggering on the B input occurs at a particular voltage level and is not related to the rise and fall time of the trigger pulse. Once triggered, the outputs are independent of further trigger inputs on A and B. The output pulse can be terminated by a LOW level on the Reset (R) pin. Trailing Edge triggering (A) and leading-edge-triggering (B) inputs are provided for triggering from either edge of the input pulse. On power up, the IC is reset. If either Mono is not used each input (on the unused device) must be terminated either high or low. The minimum value of external resistance, R X, is typically 500Ω. The minimum value of external capacitance, C X, is 0pF. The calculation for the pulse width is t W = 0.7 R X C X at = 4.5V. Ordering Information PART NUMBER TEMP. RANGE ( o C) PACKAGE CD54HC221F -55 to 125 16 Ld CERDIP CD54HC221F3A -55 to 125 16 Ld CERDIP CD74HC221E -55 to 125 16 Ld PDIP CD74HC221M -55 to 125 16 Ld SOIC CD74HCT221E -55 to 125 16 Ld PDIP CD74HCT221M -55 to 125 16 Ld SOIC NOTES: 1. When ordering, use the entire part number. Add the suffix 96 to obtain the variant in the tape and reel. 2. Wafer or die are available which meets all electrical specifications. Please contact your local TI sales office or customer service for ordering information. CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright 2000, Texas Instruments Incorporated 1

Pinout CD54HC221 (CERDIP) CD74HC221, CD74HCT221 (PDIP, SOIC) TOP VIEW 1A 1 16 1B 2 15 1C X R X 1R 3 14 1C X 1 4 13 1 2 5 12 2 2C X 6 11 2R 2C X R X 7 10 2B 8 9 2A Functional Diagram 1C X 1R X 14 15 1A 1B 1 2 1C X 1C X R X MONO 1 13 4 1 1 1R 3 2R 11 2A 9 5 2 2B 10 MONO 2 12 2 2C X 2C X R X 6 7 2C X 2R X 2

TRUTH TABLE INPUTS OUTPUTS A B R H X H L H X L H L H L H H H X X L L H L H (Note 3) (Note 3) NOTE: H = High Level, L = Low Level, X = Irrelevant, = Transition from Low to High Level, = Transition from High to Low Level, = One High Level Pulse, = One Low Level Pulse 3. For this combination the reset input must be low and the following sequence must be used: pin 1 (or 9) must be set high or pin 2 (or 10) set low; then pin 1 (or 9) must be low and pin 2 (or 10) set high. Now the reset input goes from low-to-high and the device will be triggered. 3

Logic Diagram C P 16 N R X A 1 (9) B 2 (10) R 3 (11) P RESET FF R D C P OP AMP + - R2 15 (7) S R C R X C X M M PP MIRROR VOLTAGE R3 C X MASK FF S R MAIN FF R1 R4 N PULLDOWN FF D C N 14 (6) C X 8 4 (12) (13) 5 C R + - OP AMP 4

Absolute Maximum Ratings DC Supply,........................ -0.5V to 7V DC Input Diode Current, I IK For V I < -0.5V or V I > + 0.5V......................±20mA DC Output Diode Current, I OK For V O < -0.5V or V O > + 0.5V....................±20mA DC Drain Current, per Output, I O For -0.5V < V O < + 0.5V..........................±25mA DC Output Source or Sink Current per Output Pin, I O For V O > -0.5V or V O < + 0.5V....................±25mA DC or Ground Current, I CC.........................±50mA Thermal Information Thermal Resistance (Typical, Note 4) θ JA ( o C/W) θ JC ( o C/W) PDIP Package................... 100 N/A SOIC Package................... 180 N/A Maximum Junction Temperature (Plastic Package)........ 150 o C Maximum Storage Temperature Range..........-65 o C to 150 o C Maximum Lead Temperature (Soldering 10s)............. 300 o C (SOIC - Lead Tips Only) Operating Conditions Temperature Range, T A...................... -55 o C to 125 o C Supply Range, HC Types.....................................2V to 6V HCT Types.................................4.5V to 5.5V DC Input or Output, V I, V O................. 0V to Input Rise and Fall Time, t r, t f on Inputs A and R 2V...................................... 1000ns (Max) 4.5V...................................... 500ns (Max) 6V....................................... 400ns (Max) Input Rise and Fall Time, t r, t f on Input B 2V.................................. Unlimited ns (Max) 4.5V................................. Unlimited ns (Max) 6V.................................. Unlimited ns (Max) CAUTION: Stresses above those listed in Absolute Maximum Ratings may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 4. θ JA is measured with the component mounted on an evaluation PC board in free air. DC Electrical Specifications PARAMETER HC TYPES High Level Input Low Level Input High Level Output CMOS Loads High Level Output TTL Loads Low Level Output CMOS Loads Low Level Output TTL Loads SYMBOL TEST CONDITIONS 25 o C -40 o C TO 85 o C -55 o C TO 125 o C V I (V) I O (ma) (V) MIN TYP MAX MIN MAX MIN MAX V IH - - 2 1.5 - - 1.5-1.5 - V 4.5 3.15 - - 3.15-3.15 - V 6 4.2 - - 4.2-4.2 - V V IL - - 2 - - 0.5-0.5-0.5 V 4.5 - - 1.35-1.35-1.35 V 6 - - 1.8-1.8-1.8 V V OH V IH or V IL -0.02 2 1.9 - - 1.9-1.9 - V -0.02 4.5 4.4 - - 4.4-4.4 - V -0.02 6 5.9 - - 5.9-5.9 - V UNITS - - - - - - - - - V -4 4.5 3.98 - - 3.84-3.7 - V -5.2 6 5.48 - - 5.34-5.2 - V V OL V IH or V IL 0.02 2 - - 0.1-0.1-0.1 V 0.02 4.5 - - 0.1-0.1-0.1 V 0.02 6 - - 0.1-0.1-0.1 V - - - - - - - - - V 4 4.5 - - 0.26-0.33-0.4 V 5.2 6 - - 0.26-0.33-0.4 V 5

DC Electrical Specifications (Continued) PARAMETER Input Leakage Current uiescent Device Current HCT TYPES High Level Input Low Level Input High Level Output CMOS Loads High Level Output TTL Loads Low Level Output CMOS Loads Low Level Output TTL Loads Input Leakage Current uiescent Device Current Additional uiescent Device Current Per Input Pin: 1 Unit Load SYMBOL I I I CC or or V IH - - 4.5 to 5.5 V IL - - 4.5 to 5.5-6 - - ±0.1 - ±1 - ±1 µa 0 6 - - 8-80 - 160 µa 2 - - 2-2 - V - - 0.8-0.8-0.8 V V OH V IH or V IL -0.02 4.5 4.4 - - 4.4-4.4 - V -4 4.5 3.98 - - 3.84-3.7 - V V OL V IH or V IL 0.02 4.5 - - 0.1-0.1-0.1 V I I I CC I CC TEST CONDITIONS 25 o C -40 o C TO 85 o C -55 o C TO 125 o C V I (V) I O (ma) (V) MIN TYP MAX MIN MAX MIN MAX and or -2.1 4 4.5 - - 0.26-0.33-0.4 V 0 5.5 - ±0.1 - ±1 - ±1 µa 0 5.5 - - 8-80 - 160 µa - 4.5 to 5.5 NOTE: For dual-supply systems theoretical worst case (V I = 2.4V, = 5.5V) specification is 1.8mA. HCT Input Loading Table UNITS - 100 360-450 - 490 µa INPUT UNIT LOADS All Inputs 0.3 NOTE: Unit Load is I CC limit specified in DC Electrical Table, e.g., 360µA max at 25 o C. Prerequisite For Switching Function 25 o C -40 o C TO 85 o C -55 o C TO 125 o C PARAMETER SYMBOL (V) MIN TYP MAX MIN MAX MIN MAX UNITS HC TYPES t WL 2 70 - - 90-105 - ns A 4.5 14 - - 18-21 - ns 6 12 - - 15-18 - ns t WH 2 70 - - 90-105 - ns B 4.5 14 - - 18-21 - ns 6 12 - - 15-18 - ns 6

Prerequisite For Switching Function (Continued) Reset Recovery Time R to A or B Output Pulse Width or C X = 0.1µF R X = 10kΩ Output Pulse Width or C X = 28pF, R X = 2kΩ t WL 2 70 - - 90-105 - ns 4.5 14 - - 18-21 - ns 6 12 - - 15-18 - ns t SU 2 0 - - 0-0 - ns 4.5 0 - - 0-0 - ns 6 0 - - 0-0 - ns t W 5 630-770 602 798 595 805 µs t W 4.5-140 - - - - - ns C X = 1000pF, R X = 2kΩ t W 4.5-1.5 - - - - - µs C X = 1000pF, R X = 10kΩ t W 4.5-7 - - - - - µs HCT TYPES A t WL 4.5 14 - - 18-21 - ns B Reset Recovery Time R to A or B PARAMETER SYMBOL (V) Output Pulse Width or C X = 0.1µF R X = 10kΩ Output Pulse Width or C X = 28pF, R X = 2kΩ t WH 4.5 14 - - 18-21 - ns t WL 4.5 18 - - 23-27 - ns t SU 4.5 0 - - 0-0 - ns t W 5 630-770 602 798 595 805 µs t W 4.5-140 - - - - - ns C X = 1000pF, R X = 2kΩ t W 4.5-1.5 - - - - - µs C X = 1000pF, R X = 10kΩ t W 4.5-7 - - - - - µs Switching Specifications Input t r, t f = 6ns 25 o C -40 o C TO 85 o C -55 o C TO 125 o C MIN TYP MAX MIN MAX MIN MAX UNITS PARAMETER SYMBOL TEST CONDITIONS (V) 25 o C -40 o C TO 85 o C -55 o C TO 125 o C MIN TYP MAX MIN MAX MIN MAX UNITS HC TYPES Trigger A, B, R to t PLH C L = 50pF 2 - - 210-265 - 315 ns C L = 50pF 4.5 - - 42-53 - 63 ns C L = 50pF 6 - - 36-45 - 54 ns C L = 15pF 5-18 - - - - - ns Trigger A, B, R to t PHL C L = 50pF 2 - - 170-215 - 255 ns C L = 50pF 4.5 - - 34-43 - 51 ns C L = 50pF 6 - - 29-37 - 43 ns C L = 15pF 5-14 - - - - - ns 7

Switching Specifications Input t r, t f = 6ns (Continued) PARAMETER SYMBOL TEST CONDITIONS (V) 25 o C -40 o C TO 85 o C -55 o C TO 125 o C MIN TYP MAX MIN MAX MIN MAX UNITS R to t PLH C L = 50pF 2 - - 160-200 - 240 ns 4.5 - - 32-40 - 48 ns 6 - - 27-34 - 41 ns R to t PHL C L = 50pF 2 - - 180-225 - 270 ns 4.5 - - 36-45 - 54 ns 6 - - 31-38 - 46 ns Output Transition Time t TLH, t THL C L = 50pF 2 - - 75-95 - 110 ns 4.5 - - 15-19 - 22 ns 6 - - 13-16 - 19 ns Input Capacitance C IN - - - - 10-10 - 10 pf Pulse Width Match Between Circuits in the Same Package C X = 1000pF, R X = 10kΩ - 4.5 to 5.5 - ±2 - - - - - % Power Dissipation Capacitance (Notes 5, 6) HCT TYPES Trigger A, B, R to Trigger A, B, R to R to R to CPD - 5-166 - - - - - pf t PLH C L = 50pF 4.5 - - 42 - - - 63 ns C L = 15pF 5-18 - - - - - ns t PHL C L = 50pF 4.5 - - 34-43 - 51 ns C L = 15pF 5-14 - - - - - ns t PLH C L = 50pF 4.5 - - 38 - - - 57 ns t PHL C L = 50pF 4.5 - - 37 - - - 56 ns Output Transition Time t TLH, t THL C L = 50pF 2 - - 75-95 - 110 ns 4.5 - - 15-19 - 22 ns 6 - - 13-16 - 19 ns Input Capacitance C IN - - - - 10-10 - 10 pf Pulse Width Match Between Circuits in the Same Package C X = 1000pF, R X = 10kΩ - 4.5 to 5.5 - ±2 - - - - - % Power Dissipation Capacitance (Notes 5, 6) CPD - 5-166 - - - - - pf NOTES: 5. C PD is used to determine the dynamic power consumption, per multivibrator. 6. P D = (C PD + C L ) V 2 CC f i + Σ where f i = input frequency, f o = output frequency, C L = output load capacitance, = supply voltage. 8

Test Circuits and Waveforms t r C L CLOCK t f C L I t WL + t WH = fcl 90% 50% 50% 50% 10% 10% t r C L = 6ns CLOCK t f C L = 6ns I t WL + t WH = fcl 3V 2.7V 1.3V 1.3V 1.3V 0.3V 0.3V t WL t WH t WL t WH NOTE: Outputs should be switching from 10% to 90% in accordance with device truth table. For f MAX, input duty cycle = 50%. FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH NOTE: Outputs should be switching from 10% to 90% in accordance with device truth table. For f MAX, input duty cycle = 50%. FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH t r = 6ns t f = 6ns t r = 6ns t f = 6ns INPUT 90% 50% 10% INPUT 2.7V 1.3V 0.3V 3V t THL t TLH t THL t TLH INVERTING OUTPUT t PHL t PLH 90% 50% 10% INVERTING OUTPUT t PHL t PLH 90% 1.3V 10% FIGURE 3. HC TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC 9

Typical Performance Curves CD54/74HC221, CD74HCT221 685 R X = 10K R X = 10K = 5V T A = 25 o C t W, PULSE WIDTH (µs) 680 675 670 C X = 1µF K FACTOR 0.9 0.8 0.7 HCT 665-75 -50-25 0 25 50 75 100 125 150 175 T A, AMBIENT TEMPERATURE ( o C) 0.6 0 2 4 6 8 10, SUPPLY VOLTAGE (V) FIGURE 5. HC/HCT221 OUTPUT PULSE WIDTH vs TEMPERATURE FIGURE 6. HC/HCT221 K FACTOR vs SUPPLY VOLTAGE 10 6 10 5 = 2V 10 6 10 5 = 4.5V t W, PULSE WIDTH (µs) 10 4 10 3 10 2 10 1 R X = 100K R X = 50K R X = 10K R X = 2K t W, PULSE WIDTH (µs) 10 4 10 3 10 2 10 1 R X = 100K R X = 50K R X = 10K R X = 2K 0.1 10 10 2 10 3 10 4 10 5 10 6 10 7 10 8 0.1 10 10 2 10 3 10 4 10 5 10 6 10 7 10 8 C X, TIMING CAPACITANCE (pf) C X, TIMING CAPACITANCE (pf) FIGURE 7. HC221 OUTPUT PULSE WIDTH vs C X FIGURE 8. HC/HCT221 OUTPUT PULSE WIDTH vs C X 10

IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements. Customers are responsible for their applications using TI components. In order to minimize risks associated with the customer s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI s publication of information regarding any third party s products or services does not constitute TI s approval, warranty or endorsement thereof. Copyright 2000, Texas Instruments Incorporated