VRF157FL VRF157FLMP 5V, 6W, 8MHz RF POWER VERTICAL MOSFET The VRF157FL is a gold-metallized silicon n-channel RF power transistor designed for broadband commercial and military applications requiring high power and gain without compromising reliability, ruggedness, or intermodulation distortion. S D G S FEATURES Improved Ruggedness V (BR)DSS = 17V Designed for 2-1mHz Operation 6W with 21dB Typical Gain @ 3MHz, 5V Excellent Stability & Low IMD Common Source Configuration Available in Matched Pairs 7:1 Load VSWR Capability at Specified Operating Conditions Nitride Passivated Economical Flangeless Package Refractory Gold Metallization High Voltage Replacement for MRF157 RoHS Compliant Maximum Ratings All Ratings: T C =25 C unless otherwise specified Symbol Parameter VRF157FL(MP) Unit V DSS Drain-Source Voltage 17 V I D Continuous Drain Current @ T C = 25 C 6 A V GS Gate-Source Voltage ±4 V P D Total Device dissipation @ T C = 25 C 135 W T STG Storage Temperature Range -65 to 15 Operating Junction Temperature Max 2 C Static Electrical Characteristics Symbol Parameter Min Typ Max Unit V (BR)DSS Drain-Source Breakdown Voltage (V GS = V, I D = 1mA) 17 18 V DS(ON) On State Drain Voltage (I D(ON) = 4A, V GS = 1V) 3. 5. V I DSS Zero Gate Voltage Drain Current (V DS = 1V, V GS = V) 4. ma I GSS Gate-Source Leakage Current (V DS = ±2V, V DS = V) 4. μa g fs Forward Transconductance (V DS = 1V, I D = 2A) 16 mhos V GS(TH) Gate Threshold Voltage (V DS = 1V, I D = 1mA) 2.9 3.6 4.4 V Thermal Characteristics Symbol Characteristic Min Typ Max Unit R θjc Junction to Case Thermal Resistance.13 C/W R θjhs Junction to Sink Thermal Resistance (Use High Efficiency Thermal Joint Compound and Planar Heat Sink Surface.) CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. Microsemi Website - http://www.microsemi.com.22
Dynamic Characteristics VRF157FL(MP) Symbol Parameter Test Conditions Min Typ Max Unit C ISS Input Capacitance V GS = V 158 C oss Output Capacitance V DS = 5V 81 C rss Reverse Transfer Capacitance f = 1MHz 65 Functional Characteristics Symbol Parameter Min Typ Max Unit G PS f = 3MHz, V DD = 5V, I DQ = 8mA, P out = 6W 17 21 db η D f = 3MHz, V DD = 5V, I DQ = 8mA, P out = 6W PEP 45 % IMD (d3) ψ f1 = 3MHz, f2 = 3.1MHz, V = 5V, I = 8mA, P = 6W 1-25 dbc DD DQ out PEP f = 3MHz, V DD = 5V, I DQ = 8mA, P out = 6W CW 7:1 VSWR - All Phase Angles,.2mSec X 2% Duty Factor 1. To MIL-STD-1311 Version A, test method 224B, Two Tone, Reference Each Tone Microsemi reserves the right to change, without notice, the specifications and information contained herein. pf No Degradation in Output Power Typical Performance Curves I D, DRAIN CURRENT (A) 45 4 35 3 25 2 15 1 5.5V 4.5V 3.5V 2.5V 5 1.5V.5V 2 4 6 8 1 I D, DRAIN CURRENT (A) 1 9 8 7 6 5 4 3 2 1 25µs PULSE TEST<.5 % DUTY CYCLE = -55 C = 25 C = 125 C 2 4 6 8 1 V DS(ON), DRAIN-TO-SOURCE VOLTAGE (V) FIGURE 1, Output Characteristics V GS, GATE-TO-SOURCE VOLTAGE (V) FIGURE 2, Transfer Characteristics 1.E 8 1 C, CAPACITANCE (F) 1.E 9 1.E 1 C iss C oss C rss 1.E 11.1 25 5 75 1 V DS, DRAIN-TO-SOURCE VOLTAGE (V) FIGURE 3, Capacitance vs Drain-to-Source Voltage I D, DRAIN CURRENT (V) 1 1 I DMax = 125 C T C = 75 C R ds(on) PD Max BVdss Line 1 1 1 18 V DS, DRAIN-TO-SOURCE VOLTAGE (V) FIGURE 4, Forward Safe Operating Area
Typical Performance Curves VRF157FL(MP).14 Z θjc, THERMAL IMPEDANCE ( C/W).12.1 D =.9.7.8.5.6 Note: t 1.3.4 t 2 t 1 = Pulse Duration.2.1 Duty Factor D = t1 /t 2.5 SINGLE PULSE Peak = P DM x Z θjc + T C 1-5 1-4 1-3 1-2.1 1 1 RECTANGULAR PULSE DURATION (seconds) Figure 5. Maximum Effective Transient Thermal Impedance Junction-to-Case vs Pulse Duration P DM 12 Freq=3MHz 5V 12 Freq=65MHz 5V 1 1 OUTPUT POWER (W PEP ) 8 6 4 4V OUTPUT POWER (W PEP ) 8 6 4 4V 2 2 5 1 15 2 P out, INPUT POWER (WATTS PEP) Figure 6. P OUT versus P IN 1 2 3 4 5 6 7 8 P out, INPUT POWER (WATTS PEP) Figure 7. P OUT versus P IN
VRF157FL(MP) Figure 8. 3MHz Test Circuit Vbias C1 R1 R2 C14 L1 C11 L2 R3 L3 C12 L4 L6 C15 C13 L5 C4 C5 C6 C16 C7 C8 C9 5V Output RF Input C1 C2 C3 C1, C2, C6, C7 ARCO 465 mica trimmer C3 18pF ATC7B ceramic C4 68pF metal clad 5V mica C5 39pF metal clad 5V mica C8 1pF ATC 7E ceramic C9 12pF ATC 7E ceramic C1 - C13.1uF 1V ceramic SMT C14 - C16.1uF 1V ceramic SMT Figure 9. 2-5MHz 1kW Wideband Amplifier C13 + 5V - R1 D2 R1 C3 R12 C7 D.U.T. R14 OUTPUT R14 22pF C9 L1 C14 C1 T1 L2 C11 R15 C12 - BIAS 36-5V + R5 R2 D3 R11 C4 R13 C8 D.U.T. T2 R4 1 12 2 3 4 R6 11 13 7 5 6 R7 D1 C1 R3 R8 C2 R9 C1-1pF Ceramic C2, C3, C4 -.1μF Ceramic Disc Capacitor C5 -.1μF Ceramic Chip Capacitor C6, C12 -.1μF Ceramic Chip Capacitor C7, C8 - Two 22 pf Ceramic Chip Capacitors in Parallel C9-82pF Ceramic Chip Capacitor C1, C1 1-1pF Ceramic Chip Capacitor C13 -.47μF Ceramic Chip Capacitor or Two Smaller Values in Parallel C14 - Unencapsulated Mica, 5V Two 1pF Units in Series, Mounted Under T2 D1 - IN5357A or Equivalent D2, D3 - IN4148 or Equivalent C1 - MC1723 (723) Voltage Regulator L1, L2-15 ηh Connecting Wires to R14 and R15, 2.5cm Each #2 AWG L3-1μH, 1 Turns #12 AWG Enameled Wire on Fair-Rite Products Corp. Ferrite Toroid #596141 or Equivalent R1, R2-1.K Single Turn Trimpots R3-1K Single Turn Trimpot R4-47 Ohms, 2. Watts R5-1 Ohms R6, R12, R13-2.K Ohms R7-1K Ohms R8 - Exact Value Depends on Thermistor R9 used (Typically 5. - 1K) R9 - Thermistor, Keystone RL19-582-97-D1 or Equivalent R1, R11-1 Ohms, 1.W Carbon R14, R15 - EMC Technology Model 538 or KDI Pyrofilm PPR 97-15-3 Power Resistors, 25 Ohms T1, T2-9:1 and 1:9 Impedance Ratio RF Transformers
VRF157FL(MP) Adding MP at the end of P/N specifies a matched pair where V GS(TH) is matched between the two parts. V TH values are marked on the devices per the following table. Code Vth Range Code 2 Vth Range A 2.9-2.975 M 3.65-3.725 B 2.975-3.5 N 3.725-3.8 C 3.5-3.125 P 3.8-3.875 D 3.125-3.2 R 3.875-3.95 E 3.2-3.275 S 3.95-4.25 F 3.275-3.35 T 4.25-4.1 G 3.35-3.425 W 4.1-4.175 H 3.425-3.5 X 4.175-4.25 J 3.5-3.575 Y 4.25-4.325 K 3.575-3.65 Z 4.325-4.4 V TH values are based on Microsemi measurements at datasheet conditions with an accuracy of 1.%. Thermal Considerations and Package Mounting: The rated 135W power dissipation is only available when the package mounting surface is at 25 C and the junction temperature is 2 C. The thermal resistance between junctions and case mounting surface is.13 C/W. When installed, an additional thermal impedance of.9 C/W between the package base and the mounting surface is smooth and flat. Thermal joint compound must be used to reduce the effects of small surface irregularities. The heatsink should incorporate a copper heat spreader to obtain best results..25.25.466.15r.75.5 1. G 1 D S The lid maintains the required mounting pressure while allowing for thermal expansion of both the device and the heat sink. Four 4-4 (M3) screws provide the minimum 125 lb. required mounting force. T=4-6 in-lb. Please refer to App Note 181 "Mounting Instructions for Flangeless Packages.".125d.5 2 3 1.25 HAZARDOUS MATERIAL WARNING The ceramic portion of the device between leads and mounting flange is beryllium oxide. Beryllium oxide dust is highly toxic when inhaled. Care must be taken during handling and mounting to avoid damage to this area. These devices must never be thrown away with general industrial or domestic waste. BeO substrate weight: 1.934g. Percentage of total module weight which is BeO: 2%. 1.5.3.2.5.4 4 PIN 1 - DRAIN PIN 2 - SOURCE PIN 3 - SOURCE PIN 4 - GATE
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